JP2609894B2 - Transfer resin encapsulation molding method for parts to be encapsulated, resin encapsulation molding die apparatus and film carrier used therefor - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a resin sealing molding technique for sealing and molding a part to be sealed with a resin material, and in particular, to a film carrier (or tape carrier). The present invention relates to a device for molding a mounted component such as a semiconductor device by transfer resin sealing.

[Conventional technology]

A transfer resin encapsulation molding method has been conventionally used as a technique for encapsulating a sealed component such as a semiconductor device mounted on a metal lead frame with a resin material.

For example, as shown in FIG. 8 and FIG. 9, a fixed upper die A
A movable lower mold B arranged opposite to the upper mold A, and P.M.
A required number of cavities C of the same shape are provided opposite to the L (parting line) surface. A required number of resin material supply pots and plungers are provided on one side of the two dies.
A pressure transfer passage D for the resin material heated and melted in the pot is provided between the two.

The resin encapsulation molding is first performed by the die unit A.
The mold B is opened as shown in FIG. 8, and then the lead frame F is fitted into the fitting groove E provided on the mold surface of the lower mold B and the sealed component mounted on the lead frame. G is set at the position of the cavity C portion. Next, in the state described above, the molds A and B are clamped as shown in FIG. 9, and then the resin material supplied into the pot is heated and melted and pressed by a plunger, The molten resin material is injected and filled into the upper and lower cavities C of both molds through the passage D, and the sealed component G fitted and set in the cavities C is set.
Is resin-sealed.

As a technique for sealing and molding a sealed component such as a semiconductor device mounted on a film carrier (see FIGS. 1 and 2) with a resin material, a potting resin sealing molding method has conventionally been adopted.

In this method, a liquid resin material is dropped into a required resin sealing area of a film carrier, and the resin material is heated and cured.

[Problems to be solved by the invention]

By the way, when the above potting resin sealing molding method is adopted, in general, troublesome handling using a liquid resin material and a long molding time are required,
Further, problems have been pointed out, such as complicated processes and extremely low production efficiency.

It is also known that when the transfer resin encapsulation molding method is employed, there is generally no such adverse effect as described above.

However, when a film carrier is used, the transfer resin encapsulation molding method cannot be adopted mainly because there are adverse effects due to the following causes.

That is, the thickness of the film carrier itself is extremely thin as compared with the metal lead frame, and the thickness of the outer lead and the inner lead is even thinner. For example, FIG. 8 and FIG. When resin sealing molding of the part to be sealed is performed using the conventional transfer resin sealing molding die apparatus shown in FIG. Also, the film carrier itself is swung due to the fact that it flows in the cavity C due to the speed, so that there is a serious problem that uniform resin sealing molding cannot be performed. Further, the above-mentioned flow action of the molten resin material in the cavity is caused by the inner leads of the film carrier, the semiconductor chip, and the bumps (connection electrodes) interposed between them.
Such a product has a serious adverse effect, for example, such that electrical connection failure occurs due to obstruction of the electrode connection state between each of these products.

Therefore, in the case where the parts to be sealed in the film carrier are molded with resin, the conventional transfer resin molding method and apparatus cannot be immediately applied.

The present invention is an improvement of the conventional transfer resin encapsulation molding method as described above, whereby the parts to be encapsulated in the film carrier can be resin encapsulation molded using the transfer resin encapsulation molding method. It is intended to provide a molding method.

In addition, the present invention is an improvement of the conventional transfer resin encapsulation mold apparatus, which allows resin encapsulation of a part to be encapsulated in a film carrier using a transfer resin encapsulation molding method. It is an object of the present invention to provide a molding die apparatus.

Another object of the present invention is to provide a film carrier for transfer resin encapsulation molding which can be resin-encapsulated by using the transfer resin encapsulation molding method described above.

[Means for solving the problem]

The transfer resin encapsulation method of a part to be encapsulated according to the present invention is a cross-section in which substantially the entire surface of a required resin encapsulation range (6) in a film carrier (1) is encapsulation molded with a resin material having a substantially uniform thickness. By using a resin-sealing mold having a cavity-shaped resin-molding cavity, the resin material heated and melted into the cavity of the mold is pressure-injected through the pressure-transfer passage, whereby It is characterized in that a part to be sealed on a film carrier fitted and set in a cavity portion is molded by resin sealing.

Further, a mold device for transfer resin encapsulation molding of a component to be encapsulated according to the present invention comprises a fixed mold (11), a movable mold (12) arranged to face the fixed mold, and both molds (11). A required number of resin material supply pots and plungers disposed on one side of the above (12), and a required number of resin molding cavities provided on the PL surfaces of both molds (11 and 12); In a mold apparatus for transfer resin sealing molding of a part to be sealed provided with a passage (14) for transferring a molten resin material that communicates between a pot and a cavity part, a part to be sealed on a film carrier (1). The cross-sectional shape of the cavity for resin-molding a part is formed in such a shape that substantially the entire surface of the resin-sealed area (6) in the film carrier (1) is molded with a resin material having a substantially uniform thickness. It is characterized by being configured.

The film carrier (1) for transfer resin encapsulation molding of a part to be encapsulated according to the present invention comprises an outer lead (2), an inner lead (3), and a semiconductor chip (4) connected to the inner lead (3) side. ), Wherein a shape-retaining support portion (7) having a shape surrounding the resin sealing area (6) of the film carrier is formed, and the shape-retaining support portion is provided with a transfer member. A molten resin material transfer passage surface (8) corresponding to the position of the molten resin material transfer passage (14) in the resin sealing molding die apparatus is provided.

[Action]

According to the method and apparatus of the present invention, when the sealed component on the film carrier is set in the cavity by fitting,
A configuration space in which substantially the entire surface of the resin sealing range (6) in the film carrier is sealed and molded with a resin material having a substantially uniform thickness (consisting of the cavities 13 of the upper and lower molds 11 and 12 shown in FIG. 4). Space).

Therefore, in this state, if the molten resin material is pressure-injected into the cavity portion, the injected resin material flows and is filled in the above-mentioned specific constituent space in a stable state. The swirl of the molten resin material can be efficiently and surely prevented. Therefore, it is possible to reliably prevent the film carrier itself from swinging due to the flow action of the molten resin material in the cavity.

Further, according to the film carrier of the present invention, the molten resin material transfer passage surface is used as the shape-retaining support portion of the film carrier corresponding to the position of the molten resin material transfer passage in the transfer resin sealing molding die device. Since it is arranged and configured, the molten resin material is efficiently and smoothly transferred to the resin sealing area of the film carrier, and adheres to the passage surface of the film carrier after resin molding. The solidified resin can be easily removed.

〔Example〕

Next, the present invention will be described based on the embodiment diagrams shown in FIGS. 1 to 6.

1 and 2 show the essential parts of the film carrier 1 used for carrying out the method of the present invention.

The film carrier is usually formed as a thin wall (approximately 120 μm) made of a polyimide film or the like, and the outer leads 2 and the inner leads 3 provided on the film carrier are further thicker than this. It is formed with a thin wall thickness (about 30 μm).

The inner leads 3 of the film carrier 1 and the semiconductor chips 4 are electrically connected via bumps 5 respectively.

Further, the required resin sealing range 6 in the film carrier 1, that is, the range in which the inner lead 3 and the parts to be sealed such as the semiconductor chip 4 are sealed and molded with a resin material is the outer lead 2 of the film carrier. In order to maintain the shape and posture of the inner lead 3, the inner lead 3 is arranged and configured as a range substantially equal to the portion surrounded by the shape retaining support portion 7 formed on the film carrier itself.

Further, a passage surface 8 for transferring a molten resin material corresponding to a passage position (14) for transferring a molten resin material in a transfer resin encapsulation molding die device to be described later is provided in the shape retaining support portion 7. There is.

In addition, engaging holes 9 for automatic feeding of the film carrier are formed in both side portions of the film carrier 1. The portion surrounded by the shape-retaining support portion 7 has a through-hole 10 called a window.

FIGS. 3 and 4 show the main parts of a transfer resin encapsulation mold apparatus used for carrying out the method of the present invention.

The mold apparatus is provided with a fixed upper mold 11, a movable lower mold 12 arranged to face the upper mold, and a required number of cavities 13 opposed to the PL surfaces of both molds.

In addition, a required number of resin material supply pots and plungers (not shown) are provided on one side of the two dies (11 and 12).
A passage 14 (see FIG. 1) for pressurizing a molten resin material composed of only a runner and a gate or a gate is provided between the pot and the cavity 13.

The cross-sectional shape of the resin molding cavity formed by the upper and lower cavities 13 for resin-sealing the parts to be sealed on the film carrier 1 and the upper mold core described later is determined by the resin sealing in the film carrier 1. The substantially entire surface of the stop area 6 is formed so that it can be molded by sealing with a resin material having a substantially uniform thickness.

That is, as shown in FIGS. 3 and 4, a fitting groove portion for fitting the film carrier 1 on the mold surface of the lower mold 12.
When the film carrier 1 is fitted in a predetermined position of the fitting groove 15, the required resin sealing area 6 in the film carrier is fitted in the cavity of the lower mold 12. Is provided.

Also, the upper and lower molds (11.
At the time of mold clamping of 2), the projecting core portion 16 is provided so as to fit into the cavity 13 of the lower mold 12.

Therefore, when the upper and lower molds (11 and 12) are clamped, the space formed by the shape of the upper and lower cavities 13 and the above-described protruding shape of the core 16 is a cavity portion for injecting and filling the molten resin material. Will be configured.

Therefore, when the upper and lower molds (11, 12) are clamped with the film carrier 1 fitted in the predetermined position of the fitting groove 15, the cross-sectional shape of the cavity is as shown in FIG. The film carrier is formed so as to form a space in which substantially the entire surface of the resin sealing region 6 can be molded by sealing with a resin material having a substantially uniform thickness.

Hereinafter, a case will be described in which the above-described component is subjected to resin sealing molding within the resin sealing range 6 of the film carrier using the film carrier 1 and the mold apparatus.

First, the molds (11 and 12) are opened as shown in FIG. 3, and the film carrier 1 is fitted in a predetermined position of the fitting groove 15 provided on the mold surface of the lower mold 11, whereby the film The parts to be sealed in the carrier are fitted and set in the lower mold cavity 13. At this time, the bottom surface of the semiconductor chip 4 in the resin sealing area 6 of the film carrier 1 is configured to be directly bonded to the bottom surface of the cavity of the lower mold 12,
Therefore, it is possible to reliably support the entire sealed component fitted in the lower mold cavity (13) through the semiconductor chip 4.

Next, in this state, both molds (11, 12) are clamped as shown in FIG. 4, and the resin material supplied into the pot is heated and melted and pressed by the plunger to fix it. What is necessary is just to inject and fill the upper and lower cavities (13) through the transfer passage.

By the way, the parts to be sealed on the film carrier fitted and set in the upper and lower cavities (13) are substantially the same as the resin sealing area 6 in the film carrier at the time of the mold clamping of the two dies as described above. The entire surface is fitted in a component space sealed and molded with a resin material having a substantially uniform thickness.

Therefore, in this state, when the molten resin material is pressure-injected into the cavity portion, the injected resin material flows and fills in the above-mentioned specific configuration space (that is, inside the upper and lower cavity portions 13) in a stable state. Therefore, the swirling flow of the molten resin material in the upper and lower cavities (13) can be efficiently and reliably prevented. Therefore, the swing of the film carrier itself due to the flow action of the molten resin material in the cavity can be reliably prevented.

Further, since the molten resin material filled in the upper and lower cavities (13) is solidified and formed after the required time has elapsed, the sealed parts fitted and set in the upper and lower cavities (13) are shown in FIG. It will be sealed and molded in the resin molded body 17 as shown in FIG.

It should be noted that a recess 18 corresponding to the shape of the core portion 16 in the upper mold cavity is formed on the upper surface of the resin molded body 17, which is a resin sealing of the component to be sealed in the film carrier. It does not impair the stop function.
Further, the same or different resin material may be filled in the recess 18 by the ordinary secondary molding to form the upper surface of the resin molded body 17 as a smooth surface as shown in FIG. Well, further, the resin molded body 19 formed by filling the recess 18
Required markings may be provided on the upper surface of the.

The thickness of the resin molded body 17 in the vertical direction is slightly increased due to the formation of the concave portion 18 on the upper surface of the film carrier 1, but the concave portion 18 is not necessarily required. However, by omitting at least the concave portion (18) formed above the upper surface of the film carrier, the upper and lower thickness of the resin molded body 17 can be reduced. That is, in this case, as shown in FIG. 7, the cavity (recess for resin molding) which is recessed from the mold surface (PL surface) of the upper mold 11 in the mold apparatus is omitted, and the omitted portion is omitted. The resin molding (17) may be formed so as not to be molded above the upper surface of the film carrier 1 by forming it so as to be flush with the PL surface.

In the above embodiment, as described above, since the bottom surface of the semiconductor chip 4 in the resin sealing area 6 is directly joined to the bottom surface of the cavity of the lower mold 12, the bottom surface of the semiconductor chip 4 is made of resin. Thus, it is molded as a state not sealed. Thus, aspects of this embodiment include, for example,
This is suitable for a case where a heat dissipation function is configured on the bottom surface of the semiconductor chip 4. When the molded product (product) does not need to have such a heat dissipation function, for example, the semiconductor chip 4 is resin-sealed in a state where the semiconductor chip 4 is fitted and supported at a predetermined height position in the lower mold cavity. By molding, the bottom surface portion of the semiconductor chip 4 can be simultaneously resin-molded.

Further, since the resin sealing range 6 in the film carrier 1 is arbitrarily set in each of various film carriers, the molten resin material transfer passage surface 8 in the film carrier 1 shown in the embodiment drawings is formed. Setting position and passage for molten resin material transfer in mold equipment
The 14 setting positions may be selected relatively correspondingly.

Further, the shape of the core portion 16 provided in the cavity 13 of the upper mold 11 is such that the upper surface (flat surface) side of the parts to be sealed is resin-sealed when the molds (11, 12) are clamped in the illustrated example. Although the case is shown in which the projecting shape is formed so as to protrude downward from the inside of the upper mold cavity to be molded and fitted into the through hole 10 in the film carrier 1, this shape is It can be set appropriately according to the shape.

〔The invention's effect〕

ADVANTAGE OF THE INVENTION According to this invention, rocking | fluctuation of the film carrier itself resulting from the flow action of the molten resin material pressurized and injected into the resin molding cavity part can be reliably prevented, and stable resin molding can always be performed.

Therefore, even if the parts to be sealed in the film carrier are resin-molded using the transfer resin-sealing molding method and apparatus, a uniform resin-sealing molding action can be obtained. This is an excellent practical effect that can be reliably solved and a resin-sealed molded product having high quality and high reliability can be obtained.

In addition, it becomes possible to employ the transfer resin sealing molding method and apparatus for resin sealing molding of the parts to be sealed in the film carrier, and it is possible to use a low-pressure molding resin material such as an epoxy resin. For example, the quality of molded products must be improved.

The use of a resin tablet facilitates handling of the resin material, and further shortens the curing time without limiting the pot life, thereby improving production efficiency.

The production cost can be reduced.

There are excellent practical advantages such as

In addition, the present invention can provide a film carrier that can be used in the above-described transfer resin encapsulation method and apparatus, and by using this in combination, contributes to the improvement of this type of resin encapsulation molding technology. There is an effect that can be done.

[Brief description of the drawings]

FIG. 1 is a partially cutaway plan view showing a main portion of a film carrier for transfer resin sealing molding according to the present invention. FIG. 2 is an enlarged vertical sectional front view taken along line II-II of FIG. FIG. 3 is a longitudinal sectional front view showing a main part of a transfer resin encapsulation mold apparatus according to the present invention, and shows a mold open state of both molds. FIG. 4 is a longitudinal sectional front view corresponding to FIG. 3, showing a mold clamping state of both dies. FIG. 5 is a partially cutaway vertical front view showing a main part of a resin-sealed molded product. FIG. 6 is a partially cutaway vertical front view showing a main part of another resin-sealed molded product example. FIG. 7 is a longitudinal sectional front view showing a main part of another example of the mold apparatus.
Only the upper mold portion is shown. FIG. 8 is a longitudinal sectional front view showing a main part of a conventional transfer resin encapsulation mold device using a lead frame, and shows a mold open state of both molds. FIG. 9 is a vertical sectional front view corresponding to FIG. 8 and shows the mold clamping state of both molds. [Description of symbols] 1 ... Film carrier 2 ... Outer lead 3 ... Inner lead 4 ... Semiconductor chip 5 ... Bump 6 ... Resin sealing area 7 ... Shape retention support 8 ... Transport passage Road surface 11 …… Fixed upper mold 12 …… Movable lower mold 13 …… Cavity 14 …… Transfer passage 15 …… Mating groove 16 …… Core part 17 …… Resin molding

Claims (3)

(57) [Claims] 1. A resin sealing mold having a resin molding cavity having a cross-sectional shape for sealing and molding substantially the entire surface of a required resin sealing area of a film carrier with a resin material having a substantially uniform thickness. By using the resin material that has been heated and melted into the cavity portion of the mold under pressure injection through the pressure transfer passage, the sealed parts on the film carrier fitted and set in the cavity portion are sealed with resin. A transfer resin encapsulation molding method for a part to be encapsulated, which comprises a stop molding. 2. A fixed mold, a movable mold arranged opposite to the fixed mold, a required number of resin material supply pots and plungers arranged on one of the two molds, and Transfer resin sealing molding metal for a part to be sealed, comprising a required number of resin molding cavities opposed to the PL surface, and a molten resin material transfer passage for communicating between the pot and the cavity. In the mold device, the cross-sectional shape of the cavity for resin-sealing the part to be sealed on the film carrier,
A transfer resin encapsulation molding gold for a part to be encapsulated, characterized in that substantially the entire surface of the resin encapsulation range of the film carrier is formed into an encapsulating shape with a resin material having a substantially uniform thickness. Mold device. 3. A film carrier comprising an outer lead, an inner lead and a semiconductor chip connected to the inner lead, wherein a shape-retaining support portion having a shape surrounding a resin sealing area of the film carrier is formed. Further, the shape-retaining support portion is provided with a molten resin material transfer passage surface corresponding to the position of the molten resin material transfer passage in the transfer resin sealing molding die device. A film carrier for transfer resin sealing molding of a part to be sealed.