JPS5650544A - Resin sealing structure for ic - Google Patents

Resin sealing structure for ic

Info

Publication number
JPS5650544A
JPS5650544A JP12652079A JP12652079A JPS5650544A JP S5650544 A JPS5650544 A JP S5650544A JP 12652079 A JP12652079 A JP 12652079A JP 12652079 A JP12652079 A JP 12652079A JP S5650544 A JPS5650544 A JP S5650544A
Authority
JP
Japan
Prior art keywords
resin
sealing
sealing frame
device hole
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12652079A
Other languages
Japanese (ja)
Inventor
Tetsuo Sato
Katsuji Komatsu
Kazuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP12652079A priority Critical patent/JPS5650544A/en
Publication of JPS5650544A publication Critical patent/JPS5650544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Clocks (AREA)

Abstract

PURPOSE:To reduce the sealing area and to utilize the flexibility of the film to the maximum extent by installing a sealing frame whose size is smaller than that of the device hole for mounting the IC which is formed on a film carrier in said device hole, and sealing the IC by resin. CONSTITUTION:On a flexible film 1, is formed a device hole 18 having recessed part 18a which serve the roles of positioning and a stopper. Fingers 2b of a circuit substrate 10, which is formed by processing such as tin plating and the like on a copper pattern and pipes 3a which are formed at the electrode parts of an IC 3, are bonded by thermal compression. Then, convex parts 16a for positioning the sealing frame 16 are inserted into the recesses 18a of the device hole 18. While, the sealing frame 16 is placed on the fingers 2b. Thereafter, sealing resin 7 is injected from a resin injecting hole 16b by using a resin injecting device and the like. The resin is cured in a circulating type hot-wind drying oven. The sealing frame 16 comprises materials such as resin, metal, ceramics, and the like.
JP12652079A 1979-10-01 1979-10-01 Resin sealing structure for ic Pending JPS5650544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12652079A JPS5650544A (en) 1979-10-01 1979-10-01 Resin sealing structure for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12652079A JPS5650544A (en) 1979-10-01 1979-10-01 Resin sealing structure for ic

Publications (1)

Publication Number Publication Date
JPS5650544A true JPS5650544A (en) 1981-05-07

Family

ID=14937233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12652079A Pending JPS5650544A (en) 1979-10-01 1979-10-01 Resin sealing structure for ic

Country Status (1)

Country Link
JP (1) JPS5650544A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process
JPH01216815A (en) * 1988-02-25 1989-08-30 T & K Internatl Kenkyusho:Kk Transfer resin encapsulation molding of component to be encapsulated, resin encapsulation mold assembly used therefor and film carrier
WO2006016743A1 (en) * 2004-08-10 2006-02-16 Lg Innotek Co., Ltd Multi chip module and fabrication method therof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process
JPH01216815A (en) * 1988-02-25 1989-08-30 T & K Internatl Kenkyusho:Kk Transfer resin encapsulation molding of component to be encapsulated, resin encapsulation mold assembly used therefor and film carrier
WO2006016743A1 (en) * 2004-08-10 2006-02-16 Lg Innotek Co., Ltd Multi chip module and fabrication method therof

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