JPS5739559A - Resin sealing method for ic - Google Patents
Resin sealing method for icInfo
- Publication number
- JPS5739559A JPS5739559A JP11426980A JP11426980A JPS5739559A JP S5739559 A JPS5739559 A JP S5739559A JP 11426980 A JP11426980 A JP 11426980A JP 11426980 A JP11426980 A JP 11426980A JP S5739559 A JPS5739559 A JP S5739559A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- mounting
- resin
- device hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000011889 copper foil Substances 0.000 abstract 2
- 210000000707 wrist Anatomy 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To increase the effective area of a flexible substrate and to mount an IC in high density by mounting a sealing frame smaller than a device hole for mounting the IC formed on the substrate in the device hole and sealing the IC with resin. CONSTITUTION:The device hole 18 for mounting the IC is opened at a flexible film 11, a copper foil is laminated, the finger 2b of a circuit substrate 10 and the bump 3a of the electrode of the IC3 are simultaneously thermally pressed and bonded to the pattern formed on the copper foil, and then a sealing frame 16 is placed on the finger 2b. Sealing resin 7 is filled from the resin inlet 16b, is heat treated, and is cured. In this manner, the sealing area of the IC can be reduced, and an electronic wrist watch can be reduced in size.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11426980A JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11426980A JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5739559A true JPS5739559A (en) | 1982-03-04 |
Family
ID=14633573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11426980A Pending JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5739559A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
-
1980
- 1980-08-20 JP JP11426980A patent/JPS5739559A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
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