TW255091B - A hybrid integrated circuit device and process of manufacturing thereof - Google Patents

A hybrid integrated circuit device and process of manufacturing thereof

Info

Publication number
TW255091B
TW255091B TW84101722A TW84101722A TW255091B TW 255091 B TW255091 B TW 255091B TW 84101722 A TW84101722 A TW 84101722A TW 84101722 A TW84101722 A TW 84101722A TW 255091 B TW255091 B TW 255091B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
parts
insulative
Prior art date
Application number
TW84101722A
Other languages
Chinese (zh)
Inventor
Mitsuharu Sato
Eikichi Yoshida
Original Assignee
Tokiin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokiin Corp filed Critical Tokiin Corp
Application granted granted Critical
Publication of TW255091B publication Critical patent/TW255091B/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A hybrid integrated circuit device is disclosed which never influences the circuit operations of the hybrid integrated circuit device, and which with sufficient shield effect for prevent the electromagnetic wave from passing through between the hybrid integrated circuit device and the mother board on which the hybrid integrated circuit device is mounted, so that the electromagnetic couple between the parts in the hybrid integrated circuit device and between the other parts on the mother board will not increase. The constructure of the present invention is that the resin is used as the insulative coating layer 14 for sealing the circuit board 11 and the mounted parts 12 included the active elements and passive elements which mounted on the circuit board 11, and a part of the external connecting lead 13 for connecting the mounted parts to the external parts. In addition, the surface of the insulative coating layer 14 is coated with the first insulative soft magnetic layer 15, the conductive layer 16 and the second insulative soft magnetic layer 17, in a manner that they never contact with the external connecting lead 13.
TW84101722A 1994-08-16 1995-02-24 A hybrid integrated circuit device and process of manufacturing thereof TW255091B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19239994A JP3528255B2 (en) 1994-08-16 1994-08-16 Hybrid integrated circuit device and method of manufacturing the same

Publications (1)

Publication Number Publication Date
TW255091B true TW255091B (en) 1995-08-21

Family

ID=16290669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84101722A TW255091B (en) 1994-08-16 1995-02-24 A hybrid integrated circuit device and process of manufacturing thereof

Country Status (2)

Country Link
JP (1) JP3528255B2 (en)
TW (1) TW255091B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1179619C (en) 1996-09-09 2004-12-08 Nec东金株式会社 Highly heat-conductive composite magnetic material
JP3893252B2 (en) * 2001-03-30 2007-03-14 株式会社日立製作所 Optical transmitter / receiver module and manufacturing method thereof
JP2005051129A (en) 2003-07-30 2005-02-24 Sony Corp Electronic apparatus
JP5021349B2 (en) * 2007-03-27 2012-09-05 小島プレス工業株式会社 Circuit board for vehicle-mounted antenna

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158593A (en) * 1983-02-28 1984-09-08 ティーディーケイ株式会社 Composite electromagnetic shielding material
JPS6218739A (en) * 1985-07-18 1987-01-27 Sumitomo Electric Ind Ltd Hybrid integrated circuit
JPH01151297A (en) * 1987-12-08 1989-06-14 Nec Corp Composite circuit substrate
JP2523390B2 (en) * 1990-05-01 1996-08-07 ティーディーケイ株式会社 Method for producing soft magnetic powder for magnetic shield and magnetic shield material
JPH04213803A (en) * 1990-11-30 1992-08-04 Riken Corp Radio wave absorbing material
JPH04352498A (en) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc Insulation paste for electromagnetic shield with high permeability
JP3079396B2 (en) * 1992-07-10 2000-08-21 タツタ電線株式会社 Hybrid IC
JPH073195U (en) * 1993-06-08 1995-01-17 太陽誘電株式会社 Exterior structure of hybrid integrated circuit parts

Also Published As

Publication number Publication date
JPH0856092A (en) 1996-02-27
JP3528255B2 (en) 2004-05-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees