TW255091B - A hybrid integrated circuit device and process of manufacturing thereof - Google Patents
A hybrid integrated circuit device and process of manufacturing thereofInfo
- Publication number
- TW255091B TW255091B TW84101722A TW84101722A TW255091B TW 255091 B TW255091 B TW 255091B TW 84101722 A TW84101722 A TW 84101722A TW 84101722 A TW84101722 A TW 84101722A TW 255091 B TW255091 B TW 255091B
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- parts
- insulative
- Prior art date
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A hybrid integrated circuit device is disclosed which never influences the circuit operations of the hybrid integrated circuit device, and which with sufficient shield effect for prevent the electromagnetic wave from passing through between the hybrid integrated circuit device and the mother board on which the hybrid integrated circuit device is mounted, so that the electromagnetic couple between the parts in the hybrid integrated circuit device and between the other parts on the mother board will not increase. The constructure of the present invention is that the resin is used as the insulative coating layer 14 for sealing the circuit board 11 and the mounted parts 12 included the active elements and passive elements which mounted on the circuit board 11, and a part of the external connecting lead 13 for connecting the mounted parts to the external parts. In addition, the surface of the insulative coating layer 14 is coated with the first insulative soft magnetic layer 15, the conductive layer 16 and the second insulative soft magnetic layer 17, in a manner that they never contact with the external connecting lead 13.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19239994A JP3528255B2 (en) | 1994-08-16 | 1994-08-16 | Hybrid integrated circuit device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW255091B true TW255091B (en) | 1995-08-21 |
Family
ID=16290669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW84101722A TW255091B (en) | 1994-08-16 | 1995-02-24 | A hybrid integrated circuit device and process of manufacturing thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3528255B2 (en) |
TW (1) | TW255091B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1179619C (en) | 1996-09-09 | 2004-12-08 | Nec东金株式会社 | Highly heat-conductive composite magnetic material |
JP3893252B2 (en) * | 2001-03-30 | 2007-03-14 | 株式会社日立製作所 | Optical transmitter / receiver module and manufacturing method thereof |
JP2005051129A (en) | 2003-07-30 | 2005-02-24 | Sony Corp | Electronic apparatus |
JP5021349B2 (en) * | 2007-03-27 | 2012-09-05 | 小島プレス工業株式会社 | Circuit board for vehicle-mounted antenna |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59158593A (en) * | 1983-02-28 | 1984-09-08 | ティーディーケイ株式会社 | Composite electromagnetic shielding material |
JPS6218739A (en) * | 1985-07-18 | 1987-01-27 | Sumitomo Electric Ind Ltd | Hybrid integrated circuit |
JPH01151297A (en) * | 1987-12-08 | 1989-06-14 | Nec Corp | Composite circuit substrate |
JP2523390B2 (en) * | 1990-05-01 | 1996-08-07 | ティーディーケイ株式会社 | Method for producing soft magnetic powder for magnetic shield and magnetic shield material |
JPH04213803A (en) * | 1990-11-30 | 1992-08-04 | Riken Corp | Radio wave absorbing material |
JPH04352498A (en) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | Insulation paste for electromagnetic shield with high permeability |
JP3079396B2 (en) * | 1992-07-10 | 2000-08-21 | タツタ電線株式会社 | Hybrid IC |
JPH073195U (en) * | 1993-06-08 | 1995-01-17 | 太陽誘電株式会社 | Exterior structure of hybrid integrated circuit parts |
-
1994
- 1994-08-16 JP JP19239994A patent/JP3528255B2/en not_active Expired - Fee Related
-
1995
- 1995-02-24 TW TW84101722A patent/TW255091B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0856092A (en) | 1996-02-27 |
JP3528255B2 (en) | 2004-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |