JPS57162354A - Substrate for electronic circuit - Google Patents

Substrate for electronic circuit

Info

Publication number
JPS57162354A
JPS57162354A JP4633981A JP4633981A JPS57162354A JP S57162354 A JPS57162354 A JP S57162354A JP 4633981 A JP4633981 A JP 4633981A JP 4633981 A JP4633981 A JP 4633981A JP S57162354 A JPS57162354 A JP S57162354A
Authority
JP
Japan
Prior art keywords
substrate
pattern
terminal
electronic circuit
exfoliation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4633981A
Other languages
Japanese (ja)
Other versions
JPS6217875B2 (en
Inventor
Shinzo Anazawa
Kuniharu Noda
Yasuyuki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NARUMI SEITOU KK
Narumi China Corp
NEC Corp
Original Assignee
NARUMI SEITOU KK
Narumi China Corp
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NARUMI SEITOU KK, Narumi China Corp, NEC Corp, Nippon Electric Co Ltd filed Critical NARUMI SEITOU KK
Priority to JP4633981A priority Critical patent/JPS57162354A/en
Publication of JPS57162354A publication Critical patent/JPS57162354A/en
Publication of JPS6217875B2 publication Critical patent/JPS6217875B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To prevent the exfoliation of a metallic connector by securing the end of a bet terminal not parallel to the side face but obliquely faced when mounting an external terminal to a metallized pattern formed on the part of the side surface perpendicular to the main surface of a substrate. CONSTITUTION:A substrate has an insulator 10' having an outside surface extending perpendicularly from the main surface of the substrate, and a metallized pattern 11 is covered on the part. The end of a terminal is secured not parallel to the insulator but obliquely faced with the pattern with solder material 17 when mounting an external terminal 15 on the pattern 11. In this manner, the exfoliation of the metallic connector can be prevented.
JP4633981A 1981-03-31 1981-03-31 Substrate for electronic circuit Granted JPS57162354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4633981A JPS57162354A (en) 1981-03-31 1981-03-31 Substrate for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4633981A JPS57162354A (en) 1981-03-31 1981-03-31 Substrate for electronic circuit

Publications (2)

Publication Number Publication Date
JPS57162354A true JPS57162354A (en) 1982-10-06
JPS6217875B2 JPS6217875B2 (en) 1987-04-20

Family

ID=12744374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4633981A Granted JPS57162354A (en) 1981-03-31 1981-03-31 Substrate for electronic circuit

Country Status (1)

Country Link
JP (1) JPS57162354A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642670A (en) * 1983-12-02 1987-02-10 At&T Bell Laboratories Chip carrier package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642670A (en) * 1983-12-02 1987-02-10 At&T Bell Laboratories Chip carrier package

Also Published As

Publication number Publication date
JPS6217875B2 (en) 1987-04-20

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