JPS6422091A - Double-side printed board - Google Patents

Double-side printed board

Info

Publication number
JPS6422091A
JPS6422091A JP17871287A JP17871287A JPS6422091A JP S6422091 A JPS6422091 A JP S6422091A JP 17871287 A JP17871287 A JP 17871287A JP 17871287 A JP17871287 A JP 17871287A JP S6422091 A JPS6422091 A JP S6422091A
Authority
JP
Japan
Prior art keywords
characters
printed
printed layer
occur
moisture condensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17871287A
Other languages
Japanese (ja)
Inventor
Yoshiharu Numazawa
Naoharu Kiyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17871287A priority Critical patent/JPS6422091A/en
Publication of JPS6422091A publication Critical patent/JPS6422091A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Abstract

PURPOSE:To eliminate silicon coating, and prevent short-circuiting between patterns, and the like caused by drops of water due to moisture condensation, by providing at least a single side with a printed layer, instead of the printed layer, wherein inverted characters of characters and parts symbols are formed on the whole surface of a substrate. CONSTITUTION:On a negative film, portions where characters 7 and parts symbols 8 are to be printed are printed. This negative film is inverted to form a positive film. By using this positive film, the following are formed; a surface pattern 2 formed on an insulating substrate 1, a soldering part 3, a through hole 5, and a printed layer 6 wherein the characters 7 and the parts symbols 8 are not printed. The formed printed layer 6 covers the whole surface of the substrate except the characters 7 and the parts symbols 8. Therefore, the metal part where moisture condensation is apt to occur, and in particular, the surface area of the soldering part 3 and solder 12 are reduced. Thereby, the moisture condensation becomes hard to occur. Further, the portion between terminals 11, and the gap between lines of the soldering part 3 are winded, so that short- circuiting due to drops of water becomes hard to occur.
JP17871287A 1987-07-17 1987-07-17 Double-side printed board Pending JPS6422091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17871287A JPS6422091A (en) 1987-07-17 1987-07-17 Double-side printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17871287A JPS6422091A (en) 1987-07-17 1987-07-17 Double-side printed board

Publications (1)

Publication Number Publication Date
JPS6422091A true JPS6422091A (en) 1989-01-25

Family

ID=16053245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17871287A Pending JPS6422091A (en) 1987-07-17 1987-07-17 Double-side printed board

Country Status (1)

Country Link
JP (1) JPS6422091A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319031A (en) * 2005-05-11 2006-11-24 Daikin Ind Ltd Printed board and its manufacturing method
JP2009239127A (en) * 2008-03-27 2009-10-15 Hitachi High-Tech Instruments Co Ltd Management method of board assembling/mounting line
JP6022110B1 (en) * 2015-05-21 2016-11-09 株式会社メイコー Printed wiring board and method for manufacturing printed wiring board
WO2016185607A1 (en) * 2015-05-21 2016-11-24 株式会社メイコー Printed wiring board and production method for printed wiring board
WO2016185606A1 (en) * 2015-05-21 2016-11-24 株式会社メイコー Printed wiring board and production method for printed wiring board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319031A (en) * 2005-05-11 2006-11-24 Daikin Ind Ltd Printed board and its manufacturing method
JP2009239127A (en) * 2008-03-27 2009-10-15 Hitachi High-Tech Instruments Co Ltd Management method of board assembling/mounting line
JP6022110B1 (en) * 2015-05-21 2016-11-09 株式会社メイコー Printed wiring board and method for manufacturing printed wiring board
WO2016185605A1 (en) * 2015-05-21 2016-11-24 株式会社メイコー Printed wiring board and production method for printed wiring board
WO2016185607A1 (en) * 2015-05-21 2016-11-24 株式会社メイコー Printed wiring board and production method for printed wiring board
WO2016185606A1 (en) * 2015-05-21 2016-11-24 株式会社メイコー Printed wiring board and production method for printed wiring board
JPWO2016185607A1 (en) * 2015-05-21 2017-06-01 株式会社メイコー Printed wiring board and method for manufacturing printed wiring board

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