KR980007891A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
KR980007891A
KR980007891A KR1019960021725A KR19960021725A KR980007891A KR 980007891 A KR980007891 A KR 980007891A KR 1019960021725 A KR1019960021725 A KR 1019960021725A KR 19960021725 A KR19960021725 A KR 19960021725A KR 980007891 A KR980007891 A KR 980007891A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
package
lead
solder
Prior art date
Application number
KR1019960021725A
Other languages
Korean (ko)
Inventor
한철우
Original Assignee
문정환
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 엘지반도체주식회사 filed Critical 문정환
Priority to KR1019960021725A priority Critical patent/KR980007891A/en
Publication of KR980007891A publication Critical patent/KR980007891A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명의 인쇄 회로 기판은 패키지가 실장될 위치에 홈을 가공하여 땜납을 채운것으로 패키지의 아웃-리드에 땜납을 도금 할때 생기는 불완전한 도금 및 아웃-리드의 FORMING 작업중 생길 수 있는 땜납 도금의 손실 등으로 인한 아웃-리드의 불량을 해소하며, 인쇄회로 기판의 홈으로 패키지의 아웃-리더가 실장되므로 인쇄 회로 기판(PCB)에서부터 패키지까지의 높이를 낮출 수 있고, 기판의 홈에 도팽된 땜납이 녹는 것과 동시에 실장이 가능하므로 정렬의 오류 및 외력에 의하여 아웃-리드가 인쇄 회로 기판으로부터 떨어지는 것을 방지하여 실장력 및 부착력을 강화시키므로 원하는 전지적 특정을 유지하여 생산수율을 향상시킬 수 있다.The printed circuit board of the present invention is to fill the solder by processing the groove at the position where the package is to be mounted, the incomplete plating generated when plating the solder on the out-lead of the package and the loss of solder plating that can occur during the forming of the out-lead, etc. Eliminates out-lead defects caused by the printed circuit board and reduces the height from the printed circuit board (PCB) to the package because the out-reader of the package is mounted in the groove of the printed circuit board. At the same time, mounting is possible, thereby preventing the out-lead from falling off the printed circuit board due to misalignment and external force, thereby enhancing the mounting force and adhesion, thereby maintaining the desired battery specificity and improving the production yield.

Description

인쇄 회로 기판Printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 인쇄 회로 기판의 평면도.2 is a plan view of a printed circuit board according to the present invention.

제3도는 제2도에 도시된 인쇄 회로 기판을 A-A선을 따라 절단한 단면도.3 is a cross-sectional view taken along the line A-A of the printed circuit board shown in FIG.

Claims (1)

패키지를 실장하기 위한 회로가 인쇄된 기판에 있어서, 상기 패키지의 아웃-리드와 접촉되는 상기 회로의 끝단에 형성된 다수개의 홈과, 상기 홈 내에 채워져 형성되며 상기 패키지를 상기 기판과 전기적 및 기계적으로 연결하는 땜납을 포함하는 인쇄 회로 기판.A substrate on which a circuit for mounting a package is printed, the substrate comprising: a plurality of grooves formed at an end of the circuit in contact with an out-lead of the package, and filled in the groove and electrically and mechanically connecting the package to the substrate. Printed circuit board containing solder made.
KR1019960021725A 1996-06-17 1996-06-17 Printed circuit board KR980007891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960021725A KR980007891A (en) 1996-06-17 1996-06-17 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960021725A KR980007891A (en) 1996-06-17 1996-06-17 Printed circuit board

Publications (1)

Publication Number Publication Date
KR980007891A true KR980007891A (en) 1998-03-30

Family

ID=66288005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960021725A KR980007891A (en) 1996-06-17 1996-06-17 Printed circuit board

Country Status (1)

Country Link
KR (1) KR980007891A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8815421B2 (en) 2010-11-19 2014-08-26 Samsung Sdi Co., Ltd. Printed circuit board and battery pack using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8815421B2 (en) 2010-11-19 2014-08-26 Samsung Sdi Co., Ltd. Printed circuit board and battery pack using the same

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application