KR950004789Y1 - Switch contacts using jumper wire - Google Patents

Switch contacts using jumper wire

Info

Publication number
KR950004789Y1
KR950004789Y1 KR92021675U KR920021675U KR950004789Y1 KR 950004789 Y1 KR950004789 Y1 KR 950004789Y1 KR 92021675 U KR92021675 U KR 92021675U KR 920021675 U KR920021675 U KR 920021675U KR 950004789 Y1 KR950004789 Y1 KR 950004789Y1
Authority
KR
South Korea
Prior art keywords
copper foil
pcb substrate
switch
switch contacts
jumper wire
Prior art date
Application number
KR92021675U
Other languages
Korean (ko)
Other versions
KR940013560U (en
Inventor
김희수
곽지근
Original Assignee
정용문
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정용문, 삼성전자 주식회사 filed Critical 정용문
Priority to KR92021675U priority Critical patent/KR950004789Y1/en
Publication of KR940013560U publication Critical patent/KR940013560U/en
Application granted granted Critical
Publication of KR950004789Y1 publication Critical patent/KR950004789Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/10—Bases; Stationary contacts mounted thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Contacts (AREA)
  • Push-Button Switches (AREA)

Abstract

내용 없음.No content.

Description

점프선을 이용한 스위치 접점Switch contact using jump line

제1도는 종래 PCB기판의 접점 평면도.1 is a plan view of a conventional PCB substrate.

제2도는 종래 PCB기판의 접점단면도.2 is a cross-sectional view of a conventional PCB substrate.

제3도는 본 고안의 스위치 접점의 평면도.3 is a plan view of the switch contact of the present invention.

제4도는 본 고안의 스위치 접점의 단면도.4 is a cross-sectional view of the switch contact of the present invention.

본 고안은 전자기기에 사용되는 스위치의 접점에 관한 것으로써, 특히 PCB기판의 회로패턴을 한 면만 형상할 수 있도록하여 PCB기판의 제조에 편리를 기할 수 있도록 한 것이다.The present invention relates to a contact point of a switch used in an electronic device, and in particular, it is possible to form a circuit pattern of a PCB board only one side to facilitate the manufacture of the PCB board.

종래에 사용되어온 스위치 접점은 제1도에 도시한 바와 같이 PCB기판(10)의 표면에 탄소접점(11)을 서로 인접한 위치에 도포하고 상기 탄소접점(11)으로 부터 동박패턴(12)이 연결되어 있으며 상기 탄소접점(11)의 상면에 도전막(15)을 가지는 키버튼(16)이 설치된다.Conventionally used switch contacts are coated with carbon contacts 11 on the surface of the PCB substrate 10 adjacent to each other, as shown in FIG. 1, and the copper foil pattern 12 is connected from the carbon contacts 11. And a key button 16 having a conductive film 15 on an upper surface of the carbon contact 11.

이와 같이 구성되는 종래의 장치는 스위치의 키버튼(16)을 압압하면 하면의 도전막(15)이 탄소접점들(11)을 도통시켜 동박패턴(12)을 통해 신호를 전달하게 된다.In the conventional device configured as described above, when the key button 16 of the switch is pressed, the conductive film 15 on the bottom surface conducts the carbon contacts 11 to transmit a signal through the copper foil pattern 12.

그러나 이와 같이 탄소 접점들(11)을 이용하는 PCB기판(10)은 회로 소자들을 PCB기판의 하면에 조립하게 되며 탄소접점이 배열된 상면에서 납땜작업을 수행하게 된다.However, the PCB substrate 10 using the carbon contacts 11 is assembled with the circuit elements on the lower surface of the PCB substrate and the soldering operation is performed on the upper surface where the carbon contacts are arranged.

따라서 자동화라인에서 납땜작업을 할 수 없어 수작업에 의해 납땜 작업을 수행하므로 생산성의 저하를 초래하며 또한 납땜 작업시 납과 플럭스등에 의해 접점 불량이 발생한다.Therefore, the soldering work cannot be performed in the automation line, and the soldering work is performed by manual work, which leads to a decrease in productivity, and also a contact failure occurs due to lead and flux during the soldering work.

따라서 회로소자와 탄소 접점들을 PCB기판의 동일면상에 배치하려면 PCB기판의 일면에는 회로소자를 연결하는 회로패턴을 형성하고 이면에는 탄소 접점을 연결하는 회로패턴을 인쇄하여야 한다.Therefore, in order to arrange the circuit elements and the carbon contacts on the same side of the PCB, a circuit pattern connecting the circuit elements is formed on one side of the PCB and a circuit pattern connecting the carbon contacts is printed on the back side.

즉, PCB기판의 양면에 동박회로패턴을 형성하여야 하므로 제조원가의 상승은 물론 제조 공정이 매우 복잡해지는 문제점이 있었다.That is, since copper foil circuit patterns must be formed on both sides of the PCB, the manufacturing cost increases and the manufacturing process becomes very complicated.

본 고안은 상기와 같은 문제점을 해소하기 위하여 안출된 것으로서 PCB기판의 일면에 형성되는 회로 패턴을 형성하며 상면에 회로 소자를 조립할 수 있도록 하여 납땜 작업을 자동화시킬 수 있도록 하여 제조 능률을 향상시킬 수 있도록 함을 목적으로 한다.The present invention has been made to solve the above problems to form a circuit pattern formed on one side of the PCB substrate and to assemble the circuit elements on the upper surface to automate the soldering work to improve the manufacturing efficiency For the purpose of

본 고안의 또 다른 목적은 접점으로 와이어를 사용함으로써 제조 단가를 낮출 수 있으며 탄소막 도포 공정을 배제하므로써 제조공정이 간단하여 생산성을 향상시킬 수 있도록 함에 있다.Another object of the present invention is to reduce the manufacturing cost by using a wire as a contact point and to improve the productivity by simplifying the manufacturing process by excluding the carbon film coating process.

PCB기판에 형성된 동박회로패턴사이에 와이어를 삽입하여 크린치하여 납땜할 수 있도록 하고 반대면에 근접하게 연결된 와이어 상면에서 도전막을 갖는 키버튼이 설치됨을 특징으로 한다.Between the copper foil circuit patterns formed on the PCB substrate, the wires are inserted to be crimped and soldered, and a key button having a conductive film is installed on the upper surface of the wire connected to the opposite side.

상기 목적을 달성하기 위한 본 고안의 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.When described in detail with reference to the accompanying drawings an embodiment of the present invention for achieving the above object.

우선 첨부된 도면을 참조하여 본 고안의 구성을 설명하면, PCB기판(10)의 일면에 동박회로패턴(12)이 형성되며 스위치(5)가 설치되는 지점에 구멍을 통해 와이어(1)가 나란한 양방향으로 인접한 위치에 조립된 것이다.Referring to the configuration of the present invention with reference to the accompanying drawings, the copper foil circuit pattern 12 is formed on one surface of the PCB substrate 10 and the wire (1) side by side through the hole at the point where the switch 5 is installed It is assembled in adjacent directions in both directions.

이와같이 구성되는 본 고안의 작용효과는 PCB기판(10)의 동박회로패턴(12) 사이에 와이어(1)를 삽입하여 크린칭하면 스위치(5)의 접점이 완성되는 것으로서 상면에 키버튼(6)을 압압하면 도전막(15)이 와이어(1)를 서로 도통시켜 신호를 출력하게 된다.The working effect of the present invention, which is constructed as described above, inserts the wire 1 between the copper foil circuit patterns 12 of the PCB substrate 10, and the contact of the switch 5 is completed. When pressed, the conductive film 15 conducts the wires 1 to each other and outputs a signal.

이때 와이어(1)는 근접한 위치에 나란히 배열되며 동일한 굵기를 갖는 와이어는 동일한 높이를 갖게 되어 스위치의 키버튼(6)을 압압하면 탄력부가 오므라들면서 하측면의 도전막(15)이 인접한 와이어들을 서로 연결하게 되어 도통되며 도통한 신호가 크린칭된 부위에서 동박회로패턴(12)을 통해 회로 소자에 전달하게 된다.At this time, the wires 1 are arranged side by side in close proximity and the wires having the same thickness have the same height. When pressing the key button 6 of the switch, the elastic portion is retracted, and the lower conductive film 15 is adjacent to each other. When connected, the conductive and conductive signal is transferred to the circuit element through the copper foil circuit pattern 12 at the portion where the conductive signal is crimped.

상기한 바와 같이 본 고안에 의하면 PCB기판에 일면만 동박회로패턴을 형성한 상태에서 납땜 작업을 수행할 수 있어 자동화할 수 있으므로 작업능률을 향상시킬 수 있게 된다.As described above, according to the present invention, soldering can be performed in a state in which only one surface of a copper foil circuit pattern is formed on a PCB, so that automation can be performed, thereby improving work efficiency.

Claims (1)

PCB기판기판에 형성되는 스위치 접점 구성에 있어서, PCB기판(10)의 일면에 동박회로패턴(12)이 배열되며 반대편에 와이어(1)를 근접한 위치에 삽입하여 상기 동박패턴(12)상에서 크린칭한 것을 특징으로 하는 스위치 접점.In the switch contact configuration formed on the PCB substrate, the copper foil circuit pattern 12 is arranged on one surface of the PCB substrate 10, and the wire 1 is inserted into a position adjacent to the opposite side and then crimped on the copper foil pattern 12. Switch contact, characterized in that.
KR92021675U 1992-11-05 1992-11-05 Switch contacts using jumper wire KR950004789Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92021675U KR950004789Y1 (en) 1992-11-05 1992-11-05 Switch contacts using jumper wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92021675U KR950004789Y1 (en) 1992-11-05 1992-11-05 Switch contacts using jumper wire

Publications (2)

Publication Number Publication Date
KR940013560U KR940013560U (en) 1994-06-25
KR950004789Y1 true KR950004789Y1 (en) 1995-06-15

Family

ID=19343358

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92021675U KR950004789Y1 (en) 1992-11-05 1992-11-05 Switch contacts using jumper wire

Country Status (1)

Country Link
KR (1) KR950004789Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200452149Y1 (en) * 2010-08-25 2011-02-10 진창길 Mover of earth leakage breaker

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200452149Y1 (en) * 2010-08-25 2011-02-10 진창길 Mover of earth leakage breaker

Also Published As

Publication number Publication date
KR940013560U (en) 1994-06-25

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