JPS6471198A - Printed substrate for mounting multiterminal parts - Google Patents

Printed substrate for mounting multiterminal parts

Info

Publication number
JPS6471198A
JPS6471198A JP22626587A JP22626587A JPS6471198A JP S6471198 A JPS6471198 A JP S6471198A JP 22626587 A JP22626587 A JP 22626587A JP 22626587 A JP22626587 A JP 22626587A JP S6471198 A JPS6471198 A JP S6471198A
Authority
JP
Japan
Prior art keywords
land
thickness
lands
multiterminal
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22626587A
Other languages
Japanese (ja)
Other versions
JPH0666541B2 (en
Inventor
Hideo Iwamoto
Shusaku Izumi
Mitsutaka Yamada
Mamoru Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62226265A priority Critical patent/JPH0666541B2/en
Publication of JPS6471198A publication Critical patent/JPS6471198A/en
Publication of JPH0666541B2 publication Critical patent/JPH0666541B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make solder supply uniform and remove any defective short circuit between lands by providing, at the circumference of each land, a photocuring insulating resin having the thickness which is two-thirds or more of the thickness of the land and is within a range that does not exceed its thickness of the land. CONSTITUTION:Coming closely into contact with each land 3, a photocuring insulating resin layer 4 having the thickness which is two-thirds or more of its thickness of the land 3 and is within a range that does not exceed the thickness of the land 3 is arranged at the circumference of each land 3. Then, after performing a band-like pattern printing of a paste 5, a uniform solder layer where no running of the paste 5 develops is obtained on the resin layer 4 between lands 3. In this way, any defective short circuit disappears between the lands 3.
JP62226265A 1987-09-11 1987-09-11 Printed circuit board for mounting multi-terminal components Expired - Fee Related JPH0666541B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62226265A JPH0666541B2 (en) 1987-09-11 1987-09-11 Printed circuit board for mounting multi-terminal components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62226265A JPH0666541B2 (en) 1987-09-11 1987-09-11 Printed circuit board for mounting multi-terminal components

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP9003564A Division JP2768358B2 (en) 1997-01-13 1997-01-13 Printed circuit board for mounting multi-terminal components
JP9003563A Division JP2768357B2 (en) 1997-01-13 1997-01-13 Printed circuit board for mounting multi-terminal components
JP9003565A Division JP2842425B2 (en) 1997-01-13 1997-01-13 Multi-terminal component mounting method

Publications (2)

Publication Number Publication Date
JPS6471198A true JPS6471198A (en) 1989-03-16
JPH0666541B2 JPH0666541B2 (en) 1994-08-24

Family

ID=16842495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62226265A Expired - Fee Related JPH0666541B2 (en) 1987-09-11 1987-09-11 Printed circuit board for mounting multi-terminal components

Country Status (1)

Country Link
JP (1) JPH0666541B2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293271A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Semiconductor device and its manufacture for that device
JPS575385A (en) * 1980-06-12 1982-01-12 Clarion Co Ltd Printed circuit board
JPS5776897A (en) * 1980-10-31 1982-05-14 Nippon Electric Co Printed circuit board
JPS59148388A (en) * 1983-02-14 1984-08-25 キヤノン株式会社 Printed circuit board
JPS6132840A (en) * 1984-07-25 1986-02-15 Fuji Photo Film Co Ltd Photosensitive silver halide material
JPS6357775U (en) * 1986-10-01 1988-04-18

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293271A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Semiconductor device and its manufacture for that device
JPS575385A (en) * 1980-06-12 1982-01-12 Clarion Co Ltd Printed circuit board
JPS5776897A (en) * 1980-10-31 1982-05-14 Nippon Electric Co Printed circuit board
JPS59148388A (en) * 1983-02-14 1984-08-25 キヤノン株式会社 Printed circuit board
JPS6132840A (en) * 1984-07-25 1986-02-15 Fuji Photo Film Co Ltd Photosensitive silver halide material
JPS6357775U (en) * 1986-10-01 1988-04-18

Also Published As

Publication number Publication date
JPH0666541B2 (en) 1994-08-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees