JPS5587461A - Microwave integrated circuit package - Google Patents

Microwave integrated circuit package

Info

Publication number
JPS5587461A
JPS5587461A JP16317278A JP16317278A JPS5587461A JP S5587461 A JPS5587461 A JP S5587461A JP 16317278 A JP16317278 A JP 16317278A JP 16317278 A JP16317278 A JP 16317278A JP S5587461 A JPS5587461 A JP S5587461A
Authority
JP
Japan
Prior art keywords
constitution
lid
metal
running
lower edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16317278A
Other languages
Japanese (ja)
Inventor
Masafumi Shigaki
Yasuyuki Tokumitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16317278A priority Critical patent/JPS5587461A/en
Publication of JPS5587461A publication Critical patent/JPS5587461A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating

Abstract

PURPOSE: To eliminate mismatching and unstable action by covering connections between an active element and a passive circuit and the facing part of active elements with an earthed metal layer.
CONSTITUTION: Lid 15 has strap metal film 20a running from one lower edge to the other lower edge through a convex part. While ceramic substrate 12 has metal films 20b, 20b' running from an upper surface facing film 20a to a lower surface through an inner surface. After fixing parts on metal base 11 with the help of conductive adhesive, the lid 15 is adhered by applying conductive adhesive 21 around films 20b, 20b' and insulative adhesive 22 on a surface including transmission line 14. Under a package of this constitution, inductance in the lead wire can be offset by electrostatic capacity between 20 lead wire 18 connecting active element 6 with passive element 13 and earthed metal film. Accordingly, the mentioned construction, not only enabling wide-band matching, but also diminutes electric field bond and magnetic field bond among lead wires, which leads to the stability of functions of microwave IC.
COPYRIGHT: (C)1980,JPO&Japio
JP16317278A 1978-12-26 1978-12-26 Microwave integrated circuit package Pending JPS5587461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16317278A JPS5587461A (en) 1978-12-26 1978-12-26 Microwave integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16317278A JPS5587461A (en) 1978-12-26 1978-12-26 Microwave integrated circuit package

Publications (1)

Publication Number Publication Date
JPS5587461A true JPS5587461A (en) 1980-07-02

Family

ID=15768601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16317278A Pending JPS5587461A (en) 1978-12-26 1978-12-26 Microwave integrated circuit package

Country Status (1)

Country Link
JP (1) JPS5587461A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595343A (en) * 1979-01-11 1980-07-19 Nec Corp Container for semiconductor
RU2657324C2 (en) * 2016-10-20 2018-06-13 ООО "НПО "Синергетика" Application of industrial watch stone as the millimeter range wave length semiconductor device housing and the oscillator with such device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595343A (en) * 1979-01-11 1980-07-19 Nec Corp Container for semiconductor
JPS6146975B2 (en) * 1979-01-11 1986-10-16 Nippon Electric Co
RU2657324C2 (en) * 2016-10-20 2018-06-13 ООО "НПО "Синергетика" Application of industrial watch stone as the millimeter range wave length semiconductor device housing and the oscillator with such device

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