JP2000003923A - Resin sealing of semiconductor device and resin-sealing device for that - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device resin-sealing technique, which inhibits or prevents tabs from being varied and can form favorably a sealed body (package). SOLUTION: A resin-sealing device is constituted into such a structure that in a semiconductor device resin-sealing technique that a lead frame of a constitution, wherein a semiconductor chip 25 formed with a prescribed circuit is mounted on the lead frame and electrode pads on the chip 25 are connected electrically with leads of the lead frame, is clamped by a metal mold constituted of one pair of a top force 3 and a bottom force 4, a molten resin 29 is filled in the clamped metal mold and a sealed body is formed on the lead frame by curing the filled resin, the resin is injected in the metal mold in a state that the filling of the resin into the metal mold is guided to the lead frame by guide pins 16 protruding from the metal mold and the pins 16 are returned to the metal mold before the resin is filled in the metal mold.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a semiconductor device, and more particularly to a technique for resin-sealing a lead frame in which a semiconductor chip is mounted and electrode pads and leads of the semiconductor chip are connected by wires. It is effective.

[0002]

2. Description of the Related Art In a semiconductor device, a structure in which a semiconductor chip, a wire, and the like are sealed by a sealing body (package) made of resin is known. Generally, such a sealing body is formed by, for example, transfer molding.

[0003] The resin sealing device for performing the transfer molding has a die including an upper die and a lower die. The upper mold and the lower mold are configured as a pair at the top and bottom, and each has a cavity for shaping the outer shape of the sealing body of the semiconductor device. The upper mold and the lower mold each have a heater, and the upper mold and the lower mold can be heated to a predetermined temperature. One of the upper mold and the lower mold is fixed, and the other is movable. The upper mold and the lower mold can clamp a lead frame as an object to be processed. Further, the resin sealing device has a plunger mechanism, and is configured to inject the molten thermosetting resin into the cavity in a state where the upper mold and the lower mold are clamped by the plunger mechanism. Have been.

The transfer molding is performed by the resin sealing device. A semiconductor chip is mounted on a tab of the lead frame as the object to be processed, and an electrode pad formed on the semiconductor chip and a tip of the lead are electrically connected by a conductive wire. The upper mold and the lower mold are previously heated to a predetermined temperature by the heater, and the lead frame is clamped by the upper mold and the lower mold. Then, the resin melted by the plunger mechanism is injected into the cavities of the upper mold and the lower mold which have been clamped. Then, in a state where the cavity is filled with the resin, the resin is cured by holding for several minutes,
A predetermined sealing body is formed on the lead frame. After the molding of the sealing body is completed, the lead frame is taken out of the mold and cured to completely cure the sealing body, and the sealing body is formed on the lead frame. .

Such a transfer mold is described in “VLSI Packaging Technology (Lower)” published by Nikkei BP, May 31, 1993, pp. 31 to 40.

[0006]

However, in the above-described technique, the space above the cavity formed by clamping the upper mold and the lower mold, that is, the cavity is mounted on the lead frame. A space above the semiconductor chip and a space below the cavity,
That is, since the balance between the cavity and the space below the tab for mounting the semiconductor chip is different, the flow of the resin injected into the space of the upper cavity and the flow of the resin injected into the space of the lower cavity are different. The balance with the flow of the resin is lost. As described above, when the flow of the resin injected into the cavity is out of balance, there is a problem that the tab on which the semiconductor chip is mounted fluctuates (eg, tilts). Specifically, in the space above the cavity, since there is a semiconductor chip fixed to the lead frame, the space is smaller than the space below the cavity, and the resin flowing in the space below is large. As a result, the tab is raised on the lower surface, and the tab is inclined. When the tab is tilted in this manner, a problem that the wire connecting the electrode pad of the semiconductor chip and the tip of the lead is exposed from the sealing body occurs. Further, the wire that connects the electrode pad of the semiconductor chip mounted on the tab and the lead may be broken due to the fluctuation of the tab.

[0007] Further, the imbalance of the flow of the resin injected into the cavity causes the resin to be unfilled, thereby causing the void to the sealing body. The voids cause cracks in the sealing body due to the curing after the formation of the sealing body.

For this reason, a technology has been considered in which the space above the cavity and the space below the cavity are made substantially the same using a lead frame in which the tab is downset. However, even when a lead frame in which the tab is downset is used, when the semiconductor chip is fixed to the tab or when the electrode pad of the semiconductor chip is connected to the lead, the lead frame is added to the lead frame. The tabs fluctuate due to the applied heat, and the balance between the space above the cavity and the space below the cavity may be deteriorated. In this way, the balance between the space above and below the cavity is deteriorated, so that resin sealing cannot be performed well,
As described above, the tab may be fluctuated.

Resin used for resin sealing (resin)
When the resin deteriorates, the viscosity of the resin increases, and when the deteriorated resin is used, the space above the cavity and the space below the cavity are substantially reduced by a lead frame obtained by downsetting the tab. Even in the case of the same configuration, the tab may be fluctuated by the flow of the high-viscosity resin.

Further, in recent years, packages have become thinner, and thin packages such as TQFP (Thin Quad Flat Package) and TSOP (Thin Small Outline Package) have also been commercialized. In such a thin package, the thickness of the resin is extremely thin as compared with the conventional one, and the potential that a defect such as exposure of a wire or a tab occurs due to slight fluctuation of the tab is increasing.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin sealing technique for a semiconductor device which can suppress or prevent the fluctuation of the tab and can form a sealed body (package) satisfactorily.

Another object of the present invention is to provide a semiconductor device sealing technique for satisfactorily sealing a thin package product.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

The following is a brief description of an outline of a typical invention among the inventions disclosed in the present application.

That is, a semiconductor chip on which a predetermined circuit is formed is mounted, and a lead frame in which electrode pads of the semiconductor chip and leads are electrically connected is clamped by a pair of upper and lower dies. In a resin sealing technique for a semiconductor device in which a sealed mold is filled with a molten resin and the filled resin is cured to form a sealing body on the lead frame, the resin is filled into the mold. Filling is performed by injecting a resin while guiding the lead frame with a guide pin protruding from the mold, and returning the guide pin to the mold before filling with the resin.

In the resin sealing technique for a semiconductor device, the lead frame guide may sandwich a plurality of locations near corners of a mounting portion (tab) of the semiconductor chip from above and below the lead frame with guide pins. What to do.

Further, in the resin sealing technique for a semiconductor device, the guide pin has a wide portion provided at a tip end portion for guiding the lead frame.

Further, in the resin sealing technique of the semiconductor device, one of the plurality of guide pins is formed in a shape different from other guide pins.

According to the above means, a semiconductor chip on which a predetermined circuit is formed is mounted, and a lead frame in which electrode pads of the semiconductor chip and leads are electrically connected is formed by a pair of upper and lower dies. In the resin sealing method for a semiconductor device in which a molten resin is filled in the closed mold, and the filled resin is cured to form a sealed body in the lead frame, the method further comprises: Injecting resin while filling the mold with the lead frame guided by a guide pin projecting from the mold,
By returning the guide pins to the mold before filling with the resin, it is possible to suppress or prevent a change in the mounting portion of the semiconductor chip due to the flow of the resin melted at the time of filling the resin, and A sealed body can be formed.

Further, in the resin sealing technique of the semiconductor device, the lead frame is guided so that a plurality of locations near corners of the mounting portion of the semiconductor chip are sandwiched by guide pins from above and below the lead frame. Accordingly, it is possible to more favorably suppress or prevent the variation of the mounting portion of the semiconductor chip.

Further, in the resin sealing technique of the semiconductor device, since the guide pin has a wide portion at a leading end portion for guiding the lead frame, the area for guiding the lead frame is increased, and the variation of the tab is increased. Can be further suppressed or prevented, and in a state where the mold is filled with resin, the guide pin returns to the mold, whereby the wide portion is brought into close contact with the mold, and the guide pin and the mold are And the resin flowing into this gap can be reduced.

Further, one of the guide pins provided at the plurality of locations has a shape different from that of the other guide pins, so that one of the traces of the guide pins formed on the surface of the sealing body is different from the other guide pins. Can be formed in a shape different from that of the pin mark, and an index for direction determination can be displayed on the semiconductor device.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and
The description of the repetition is omitted.

(Embodiment 1) In this embodiment, a case where the present invention is applied to a resin sealing device for a TQFP semiconductor device will be specifically described.

FIG. 1 is a schematic configuration diagram of a resin sealing device 1 according to one embodiment of the present invention, FIG. 2 is a sectional view of a main part of a mold of the resin sealing device, and FIG. 3 is a guide pin of the mold. 4 (a)-(b) and 5 (a)-(b) are plan views showing modified examples of the guide pin, and FIGS. 6 and 7 are workpieces of the present invention. FIG. 8 is a sectional view showing a lead frame after die bonding, FIGS. 9 and 10 are views showing a lead frame after wire bonding, and FIGS. 11 (a) to 11 (e) are FIG. 12 is a sectional view showing a resin sealing flow using a resin sealing mold according to an embodiment of the present invention, FIGS. 12 and 13 are views showing a lead frame after resin sealing, and FIG. FIG.

The resin sealing device 1 has a mold 2 for forming a sealing body on a lead frame to be processed, and the mold 2 includes an upper mold 3 and a lower mold 4. ing. The lower mold 4 is fixed to a base 5 of the resin sealing device 1. The upper mold 3 is disposed so as to face the lower mold 4, and a lead frame placed on the upper surface of the lower mold 4 can be clamped together with the upper mold 3 and the lower mold 4. Have been. The upper die 3 is fixed to a movable plate 7 that moves up and down along a support bar 6 provided on the base 5, and the upper die 3 is moved up and down by the up and down movement of the movable plate 7. It is configured as follows. The parting surface formed by clamping the upper mold 3 and the lower mold 4 together, as shown in FIG. 8
A pot 9 serving as an entrance of the resin when the resin is injected into the cavity, a runner 10 serving as a resin flow path from the bot 9 to the cavity 8, a gate 11 serving as an entrance of the cavity 8 of the runner 10, Air mold 2
An air vent 12 or the like, which is an air passage for discharging outside, is formed. The upper mold 3 and the lower mold 4 each have a heater 1
The upper mold 3 and the lower mold 4 are each configured to be heated to a predetermined temperature. Further, a cylinder mechanism 14 is provided at an upper portion of the resin sealing device 1, and a plunger 15 is provided at a cylinder lot of the cylinder mechanism 14. The plunger 1
5 is disposed so as to be inserted into the pot 9, and after closing the upper mold 3 and the lower mold 4, the plunger 15 is pushed down to remove the resin put into the pot 9. The cavity 8 is configured to be injected.

The cavity 8 of the upper mold 3 and the lower mold 4
Are provided with guide pins 16 respectively. For example, four guide pins 16 are respectively provided in the concave portions of the cavities 8 of the upper mold 3 and the lower mold 4, and the lead pins 16 are clamped to the upper mold 3 and the lower mold 4. Are arranged at positions corresponding to the squares of the tabs. Further, the guide pin 16 is configured to be movable in the vertical direction. As shown in FIG. 3, the guide pin 16 projects from the upper mold 3 and the lower mold 4 into the cavity 8, respectively. It is possible to guide the tab of the lead frame to be clamped to the lower mold 4 so as to sandwich the tab from above and below. The guide pins 16 provided on the upper mold 3 and the lower mold 4 have a diameter of, for example, 2 mm.
The guide pins 16 are controlled by a controller (not shown) so as to protrude from the tabs 18 of the lead frame 17 to an interval of about 0.05 mm or less. It is preferable that the volume of the guide pin 16 provided in the mold 2 is made as small as possible compared to the volume of the cavity 8 so as not to hinder the flow of the injected resin. The guide pins 16 are controlled so that the cavity 8 is returned to the mold 2 before the resin is filled into the cavity 8, for example, at a filling rate of the resin into the cavity 8 of about 50 to 100%.

Further, the guide pins 16 are again projected into the cavity 8 after the formation of the sealing body 30 on the lead frame 17, and the sealing body 30 formed on the lead frame 17 is pushed up, so that the upper die and The sealing body 30 can be released from the cavity 8 of the lower mold. By providing the guide pin 16 with an eject function in this way, it is not necessary to provide both the ejector pin and the guide pin 16 in the resin sealing device 1,
The complexity of the device can be suppressed.

In this embodiment, the case where four guide pins 16 are arranged from the upper die 3 and the lower die 4, respectively, has been described. However, as shown in FIGS. Two, three, or five or more guide pins 16 may be provided in one of the cavities to guide the tab 18 of the lead frame 17 from above and below.

In this embodiment, the case where the guide pins 16 are arranged so as to guide the squares of the tabs 18 of the lead frame 17 from above and below, respectively, is described. 5A and 5B, the four sides of the tab 18 or the tab suspending leads 19 may be disposed so as to guide the tabs from the up and down directions, respectively.

Further, in this embodiment, the guide pin is formed in a cylindrical shape, but may be formed in, for example, a triangular shape, a polygonal shape, or the like.

Next, TQFP using the resin sealing device 1
The method of manufacturing the semiconductor device will be described with reference to FIGS.

First, FIGS. 6 and 7 are views showing the structure of a unit frame of a lead frame 17 which is an object to be processed.
A plurality of the unit frames are formed along the transport direction. A substantially rectangular tab 18 for mounting a semiconductor chip 25 on which a predetermined circuit is formed is formed at a central portion of the lead frame 17. The tab 18 is supported by four tab suspension leads 19 in a substantially quadrangular square. A plurality of leads 20 are arranged so as to surround the periphery of the tab 18. The lead frame 17 is provided with a dam bar 21 for connecting the leads 20 and preventing resin from flowing out when the sealing body 30 is formed. The dam bar 21 is formed in a frame shape according to the shape of the sealing body 30. The other ends of the leads 20 are supported by an outer frame 22 or a frame 23 provided between unit frames. Positioning holes 24 are formed in the outer frame 22 at predetermined intervals.
Can be positioned. The lead frame 17 is formed in a predetermined shape by etching or punching a thin plate of about 0.15 mm made of, for example, Cu (copper). As shown in FIG. 7, the lead frame 17 is formed by downsetting the tab 18, for example, so that the upper surface of the tab 18 is located below the lower surface of the lead 20. Such a downset processed lead frame 17 is prepared.

Next, the lead frame 17 subjected to the downset processing is transferred to a die bonding step, and die bonding is performed as shown in FIG. In this die bonding, the tab 18 of the lead frame 17 is used.
Then, a semiconductor chip 25 on which a predetermined circuit is formed is adhered and fixed. That is, a paste for bonding and fixing the semiconductor chip 25 is applied on the tab 18 in advance, and the semiconductor chip 25 is mounted on the tab 18 by the paste. The paste is cured by curing at a predetermined temperature, and the semiconductor chip 25 is fixed to the tab 18 of the lead frame 17. After the die bonding is completed, the lead frame 17 is transferred to a wire bonding process.

In the wire bonding step, as shown in FIGS. 9 and 10, the electrode pads 26 on the semiconductor chip 25 mounted on the lead frame 17 and the leads 20 are connected to a conductive material made of Au (gold) or the like. This is performed by connecting with a wire 27. That is, in the wire bonding, after the tip of the wire 27 is melted to form a ball portion, the ball portion is pressed against the electrode pad 26 while applying ultrasonic vibration to join. Then, the rear end of the wire 27 is ultrasonically bonded to the lead 20 so as to draw a predetermined loop shape. Thus, all the electrode pads 26 and the leads 20 are connected by the wires 27. All the electrode pads 26 and the leads 20
The lead frame 17 for which connection with the lead frame 17 has been completed is transferred to a resin sealing step.

In the resin sealing step, first, the resin sealing device 1 is moved upwardly of the movable platen 7 to
Has been moved upward. Then, the lead frame 17 is set at a predetermined portion of the lower mold 4 of the resin sealing device 1. Then, as the movable platen 7 descends, the upper die 3
Is moved downward, and the lead frame 17 is moved to the position shown in FIG.
The mold is clamped by the upper mold 3 and the lower mold 4 as shown in FIG. At this time, the lead frame 17 is
Are downset, so that the space above the semiconductor chip 25 and the space below the tab 18 are arranged to be substantially equal. Then, the guide pins 16 provided on the upper mold 3 are moved downward, and the guide pins 16 provided on the lower mold 4 are moved upward, and are projected from the concave portions of the cavity 8. As shown in FIG. 11B, the tips of the guide pins 16 are arranged at an interval of, for example, about 0.05 mm from the tab 18 and guide the tab from above and below. The arrangement of the guide pins 16 may be such that the tabs 18 are directly sandwiched from above and below. The position at which the guide pin 16 guides the lead frame 17 is, for example, a pressing portion 28 shown in FIG. 9, that is, four corners of the tab 18 arranged in the cavity are guided.

In the state where the lead frame 17 is clamped by the upper die 3 and the lower die 4, the tabs are guided by the guide pins 16 so that the tabs 18 are heat-treated in the previous step. Even if the fluctuation and the balance between the upper space and the lower space of the cavity are deteriorated, the protrusion of the guide pin 16 can correct the fluctuation of the tab.

The upper mold 3 and the lower mold 4 are provided with a heater 1 in advance.
3 is heated to a predetermined temperature, and the pre-heated resin 29 is placed in the pot 9 of the clamped mold 2.
Is input. The viscosity of the resin 29 charged in the pot 9 is reduced by heat from the upper mold 3 and the lower mold 4. After the resin 29 in the pot 9 is melted, the plunger 15 inserted into the pot 9 is lowered by the cylinder mechanism 14. The lowering of the plunger 15 causes the molten resin 29 in the pot 9 to move.
Is injected into the cavity 8 through the runner 10 and the gate 11. The resin 29 injected into the cavity 8 is configured so that the lead frame 17 is subjected to down-set processing so that the upper space and the lower space of the cavity 8 are substantially equal.
As shown in the figure, the resin 29 flowing in the space above the cavity 8 and the space below the cavity 8 is substantially uniformly filled.

The resin 29 is injected into the cavity 8 while the tabs 18 of the lead frame 17 are guided by the guide pins 16 provided in the cavities 8 of the upper mold 3 and the lower mold 4 as described above. Fluctuation of the tab caused by the flow of the resin injected into the cavity 8 can be suppressed or prevented, and the cavity 8 can be favorably filled with the resin.

In this embodiment, the case where the lead frame 17 in which the tab 18 is down-set is used has been described.
8 can be suppressed or prevented, and the cavity 8 can be filled with the resin.

When the filling rate of the resin 29 to be injected into the cavity 8 reaches about 50 to 100%, the guide pins 16 projecting into the cavity 8 are
As shown in FIG. 1 (d), control is performed so as to return to the mold 2, and the guide pins 16 of the upper mold 3 are moved upward, and the guide pins 16 of the lower mold 4 are moved downward. FIG.
As shown in (e), the guide pins 16 return to the mold 2 respectively, and filling of the cavity 8 with the resin 29 is completed. By holding the cavity 29 filled with the resin 29 for several minutes, the resin 29 filled in the cavity 8 is cured by the heat from the mold 2.

When the curing of the resin 29 filled in the cavity 8 of the mold 2 is completed, the upper mold 3 is moved upward with the rise of the movable platen 7, so that the sealing body 30 is formed. The lead frame 17 is taken out. At this time, the guide pin 16 is moved from the mold 2 to the sealing body 3.
0 is controlled to protrude into the cavity 8 so as to release the mold. Unnecessary resin portions, such as the runners 10, are removed from the lead frame 17 taken out of the resin sealing device 1. Then, the sealing body 30
Is cured at a predetermined temperature, whereby the sealing body 30 is completely cured,
As shown in FIG. 12 and FIG.
The sealing body 30 is formed.

Lead frame 1 completed with resin sealing
7 is shifted to a cutting and forming step, and the lead frame 17 is
The dam bar 21, the outer frame 22, and the frame body 23 are cut, and the respective leads 20 protruding from the sealing body 30 are independent, and the protruding leads 20 are formed into a gull wing shape. Thus, a semiconductor device 31 as shown in FIG. 14 is obtained.

(Embodiment 2) Next, a resin sealing mold according to another embodiment of the present invention and a method of manufacturing a semiconductor device using the same will be briefly described.

FIG. 15 is a sectional view showing a main part of a mold according to another embodiment of the present invention, and FIGS. 16 (a) to 16 (d) show resins using the mold according to another embodiment of the present invention. It is sectional drawing which shows a sealing flow.

The mold 2 is arranged so that the upper mold 3 and the lower mold 4 are opposed to each other as in the first embodiment, and the lead frame 17 is clamped by the upper mold 3 and the lower mold 4. Is configured. The cavity 8, the pot 9, the runner 10, the gate 11, the air vent 12, and the like are formed on a parting surface formed by clamping the upper mold 3 and the lower mold 4 together. I have. Four guide pins 16 are provided in the cavities 8 of the upper mold 3 and the lower mold 4 respectively.
The lead frame 17 is clamped to the upper die 3 and the lower die 4, and is disposed at a position corresponding to a square of the tab 18 of the lead frame 17.

In this embodiment, as shown in FIG. 15, a wide portion 32 is formed at each of the distal ends of the guide pins 16. The wide portion 32 is connected to the guide pin 16.
The width of the wide portion 32 prevents the resin from flowing into the gap between the guide pin 16 and the mold 2 when the guide pin 16 returns to the mold 2. Be composed. The guide pin 16 having the wide portion 32 formed at the distal end is configured to be movable in the vertical direction as in the first embodiment, and the lead frame 17 is clamped to the upper mold 3 and the lower mold 4. Is controlled so as to guide the tab 18. Since the tabs 18 are configured to be guided by the wide portions 32, the area for guiding the tabs 18 is large, and the tabs can be better guided.

Next, a method of manufacturing a semiconductor device according to another embodiment of the present invention will be described with reference to FIG.

First, in the same manner as in the first embodiment, the lead frame 17 in which the semiconductor chip is mounted and the electrode pads 26 of the semiconductor chip 25 and the leads 20 are electrically connected by wires 27 is used as the lower mold. 4 and the lead frame 17 is clamped by the upper die 3 and the lower die 4 as shown in FIG. The guide pin 1 provided on the upper die 3
6 is the guide pin 16 provided on the lower die 4
Is moved upward and projected into the cavity 8.
The wide portion 3 provided at the tip of the guide pin 16
As shown in FIG. 16B, 2 is arranged at an interval of, for example, about 0.05 mm or less from the tab 18 and guides the tab 18 from above and below. The arrangement of the guide pins 16 may be such that the tabs 18 are directly sandwiched from above and below. Similarly to the first embodiment, when the tab 18 fluctuates in the previous process or the like and the balance between the space above the cavity 8 and the space below the cavity 8 is deteriorated, the tip of the guide pin 16 is The wide portion 32 can correct the inclination of the tab.

The upper mold 3 and the lower mold 4 are provided with a heater 1 in advance.
3 is heated to a predetermined temperature, and the pre-heated resin 29 is placed in the pot 9 of the clamped mold 2.
Is input. The resin 29 put into the pot 9 is melted, and the melted resin 29 is injected into the cavity 8 through the runner 10 and the gate 11. The resin 29 injected into the cavity 8 is shown in FIG.
As shown in (c), the resin 29 flowing in the space above the cavity 8 and the space below the cavity 8 is substantially uniformly filled.

As described above, the tabs 18 of the lead frame 17 are guided by the wide portions 32 provided at the tips of the guide pins 16 provided in the cavities 8 of the upper mold 3 and the lower mold 4. By injecting the resin 29 into the cavity, the area for guiding the tub is increased, and the fluctuation of the tub caused by the flow of the resin injected into the cavity 8 is suppressed or prevented more favorably. 8 can be favorably filled with resin.

When the filling rate of the resin 29 to be injected into the cavity 8 reaches about 50 to 100%, the guide pins 16 projecting into the cavity 8 are moved as shown in FIG. Is controlled to return to the mold 2. Then, as shown in FIG. 16E, the guide pins 16 return to the mold 2 respectively, and the guide pins 1
The wide part 32 provided at the tip of 6 is in close contact with the mold. Wide portion 32 provided at the tip of the guide pin 16
Is brought into close contact with the mold, so that the guide pin 1
The resin flowing into the gap between the mold 6 and the mold 2 can be reduced.
After the filling of the cavity 29 with the resin 29 is completed, the resin 29 filled in the cavity 8 is cured by the heat from the mold 2.

When the curing of the resin filled in the cavity 8 of the mold 2 is completed, the upper mold 3 is moved upward, and the lead frame 16 on which the sealing body 30 is formed is formed.
Is taken out. At this time, the sealing body 30 is released from the mold 2 by the guide pins 16 as in the first embodiment. Then, the lead frame 17 on which the sealing body 30 is formed is cured at a predetermined temperature, whereby the sealing body 30 is completely cured. Then, the lead frame 17 after the resin sealing is completed is cut in the same manner as in the first embodiment, and a semiconductor device 31 as shown in FIG. 14 is obtained.

(Embodiment 3) A mold according to another embodiment of the present invention and a method of manufacturing a semiconductor device using the same will be briefly described.

FIGS. 17 (a) to 17 (c) are plan views showing the configuration of a cavity of a resin mold according to another embodiment of the present invention, and FIG. 18 is a resin according to another embodiment of the present invention. FIG. 4 is a plan view showing a configuration of a lead frame in which a sealing body is formed by a sealing mold.

As described in the first and second embodiments,
The cavity 8 has a substantially rectangular recess formed in the mold 2 to shape the outer shape of the sealing body 30 of the semiconductor device 31. The guide pins 16 are respectively arranged at positions corresponding to the squares of the tab 18 of the lead frame 17 which is the object to be processed in the concave portion of the mold.

In the present embodiment, one of the plurality of guide pins 16 arranged in each of the squares of the tab, for example, a guide pin close to the gate 11 of the cavity 8 is defined as an index guide pin 16a, and FIG. The guide pin has a different shape from the other guide pins as shown in FIGS. 17A and 17B or a smaller shape than the other guide pins 16 as shown in FIG. Alternatively, as shown in FIG. 4A, a guide pin 16 close to the gate 11 of the cavity is provided.
The configuration may be such that the direction of the semiconductor device is determined by eliminating the above. By eliminating the guide pin near the gate 11 of the cavity or forming the guide pin in a small shape, the flow of the resin injected from the gate 11 into the cavity at the time of the resin sealing is preferably prevented. Resin can be injected.

Next, a method of manufacturing a semiconductor device using a mold having guide pins 16 configured as shown in FIG. 17A will be briefly described.

Using the mold 2 provided with the index guide pins 16a, the semiconductor chip is mounted in the same manner as in the first or second embodiment described above, and the electrode pad 26 of the semiconductor chip 25 is The lead frame 17 electrically connected to the leads 20 by wires 27 is sealed with resin. The resin sealing is performed on the upper mold 3
The resin 29 is filled in the cavity 8 while the tab 18 of the lead frame 17 is guided by the guide pin 16 provided in the cavity 8 of the lower mold 4. Before the filling of the resin 29 to be injected into the cavity 8 is completed, the guide pin 16 returns to the mold 2 and the cavity 8
Is filled with the resin 29. Then, the resin 29 filled in the cavity 8 is cured, and for example, a sealing body 30 is formed on the lead frame 17 as shown in FIG.
At this time, the guide pins 16 are provided on the surface of the sealing body 30.
Are formed, and the index guide pin trace 33a corresponding to the index guide pin 16a is formed in a different shape from the other guide pin traces 33.
Therefore, the direction of the package can be easily determined based on the index guide pin traces 33a. Then, the lead frame 17 on which the sealing body 30 is formed is cut and molded, and the semiconductor device 31 with the index can be obtained.

As described above, one of the guide pins 16 provided in the cavities 8 of the upper mold 3 and the lower mold 4 is used as an index guide pin and has a shape different from that of the other guide pins. Tab 18
The resin 29 is injected into the cavity 8 in a state where the resin is guided, so that the fluctuation of the tab caused by the flow of the resin injected into the cavity 8 is suppressed or prevented. And an index can be displayed on the surface of the sealing body 30 formed on the lead frame 17.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and can be variously modified without departing from the gist of the invention. Needless to say. For example, in the present embodiment, the case where the guide pin 16 is guided so as to sandwich the tab 18 of the lead frame 17 from above and below has been described. However, it is sufficient that the guide pin 16 has a configuration capable of suppressing the fluctuation of the tab. The portion of the guide pin 16 for guiding the upper side and the portion of the guide pin 16 for guiding the lower side of the tab may be arranged at different portions. Further, the guide pin 16 may be provided in only one of the upper mold 3 and the lower mold according to the characteristics of the resin sealing device. For example, the space below the tab 18 is larger than the space above the tab 18. When the flow of the resin 29 injected into the lower space is large, the guide pin 16 can be provided only in the upper cavity to guide the tab 18.

[0063]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, a semiconductor chip on which a predetermined circuit is formed is mounted, and a lead frame in which electrode pads of the semiconductor chip and leads are electrically connected is clamped by a pair of upper and lower molds. In the method for manufacturing a semiconductor device in which a sealed mold is filled with a molten resin and the filled resin is cured to form a sealing body on the lead frame, the filling of the mold with the resin may be performed. By injecting a resin while guiding the lead frame with a guide pin protruding from the mold, and returning the guide pin to the mold before filling with the resin, the mounting position (tab) of the semiconductor chip is reduced. Variation is suppressed or prevented, and a sealed body can be favorably formed. Since the sealing body can be formed more favorably, defects in the resin sealing step can be reduced, and the yield of semiconductor device manufacturing can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an overall configuration of a resin sealing device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part showing a cross-sectional structure of a resin sealing mold according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an operation of a guide pin of the resin sealing mold according to one embodiment of the present invention.

FIG. 4 is a plan view showing a modified example of the guide pin of the resin sealing mold according to one embodiment of the present invention.

FIG. 5 is a plan view showing a modified example of a lead frame holding portion by a guide pin of a resin sealing mold according to an embodiment of the present invention.

FIG. 6 is a plan view showing a configuration of a lead frame which is an object to be processed in a resin sealing mold according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along the line XX ′ of FIG. 6, showing a configuration of a lead frame which is an object to be processed in a resin-sealed mold according to an embodiment of the present invention.

FIG. 8 is a sectional view showing a lead frame after die bonding.

FIG. 9 is a plan view showing a configuration of a lead frame after wire bonding.

FIG. 10 is a cross-sectional view taken along the line YY ′ of FIG. 9 showing the configuration of the lead frame after wire bonding.

FIG. 11 is a sectional view showing a resin sealing flow using a resin sealing mold according to an embodiment of the present invention.

FIG. 12 is a plan view showing a configuration of a lead frame after resin sealing.

FIG. 13 is a cross-sectional view taken along the line ZZ ′ of FIG. 12, showing the configuration of the lead frame after resin sealing.

FIG. 14 is a cross-sectional view illustrating a configuration of a semiconductor device.

FIG. 15 is a cross-sectional view showing an operation of a guide pin of a resin sealing mold according to another embodiment of the present invention.

FIG. 16 is a cross-sectional view illustrating a resin sealing flow using a resin sealing mold according to another embodiment of the present invention.

FIG. 17 is a plan view showing a configuration of a guide pin of a resin mold according to another embodiment of the present invention.

FIG. 18 is a plan view showing a configuration of a lead frame in which a sealing body is formed by a resin sealing mold according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Resin sealing device, 2 ... Mold, 3 ... Upper mold, 4 ... Lower mold, 5
... Base, 6 ... Support rod, 7 ... Movable plate, 8 ... Cavity, 9
... pot, 10 ... runner, 11 ... gate, 12 ... air vent, 13 ... heater, 14 ... cylinder mechanism, 15 ... plunger, 16 ... guide pin, 16a ... index guide pin, 17 ... lead frame, 18 ... tab (mounted Parts), 19: tab suspension lead, 20: lead, 21 ...
Dam bar, 22 outer frame, 23 frame, 24 positioning hole, 25 semiconductor chip, 26 electrode pad, 27 wire, 28 holding part, 29 resin, 30 sealing body,
31: semiconductor device, 32: wide portion, 33: guide pin mark, 33a: index guide pin mark.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AD03 AD20 AH33 CA12 CB01 CB12 CQ03 CQ07 4F206 AD03 AD20 AH37 JA02 JB17 JF05 JL02 JM04 JN14 JN25 JQ06 JQ81 5F061 AA01 BA01 CA21 DA06 DA12 DA14 DA16

Claims (10)

[Claims] 1. A semiconductor chip having a predetermined circuit formed thereon is mounted, and a lead frame electrically connecting electrode pads and leads of the semiconductor chip is clamped by a pair of upper and lower dies. In a resin sealing method for a semiconductor device in which a molten resin is filled in a tightened mold and a sealed body is formed on the lead frame by curing the filled resin, the resin is filled into the mold. A resin sealing method for a semiconductor device, comprising: injecting a resin in a state where the lead frame is guided by a guide pin whose filling protrudes from the mold, and returning the guide pin to the mold before filling with the resin. . 2. The method according to claim 1, wherein the guide of the lead frame is sandwiched by the guide pins from above and below the lead frame. 3. The resin sealing method for a semiconductor device according to claim 1, wherein the guide of the lead frame guides a plurality of mounting portions of the semiconductor chip with guide pins. 4. The resin sealing method for a semiconductor device according to claim 3, wherein said guide pin has a wide portion at a tip portion for guiding said lead frame. 5. The resin sealing method for a semiconductor device according to claim 3, wherein one of said plurality of guide pins has a shape different from other guide pins. 6. A pair of upper and lower dies for mounting a semiconductor chip on which a predetermined circuit is formed, and for clamping a lead frame in which electrode pads of the semiconductor chip and leads are electrically connected; A semiconductor device having a cavity provided in a mold for forming an outer shape of a sealing body in the lead frame, a heater for heating the mold to a predetermined temperature, and a plunger mechanism for injecting a molten resin into the cavity. 2. The resin sealing device for a semiconductor device according to claim 1, further comprising: a guide pin provided so as to protrude from said mold and guide said lead frame when injecting resin into said cavity. 7. The resin sealing device for a semiconductor device according to claim 6, wherein said guide pins are provided above and below said mold so as to sandwich said lead frame from above and below. 8. The semiconductor device according to claim 6, wherein said guide pins are provided at a plurality of positions of said mold so as to guide the vicinity of a corner of a semiconductor chip mounting portion of said lead frame. Resin sealing device. 9. One of the guide pins provided at the plurality of locations.
9. The resin sealing device for a semiconductor device according to claim 8, wherein one of the guide pins is formed in a different shape from the other guide pins. 10. The resin sealing device for a semiconductor device according to claim 6, wherein said guide pin has a wide portion at a tip portion for guiding said lead frame.