JPS57181129A - Forming device molding package of semiconductors - Google Patents

Forming device molding package of semiconductors

Info

Publication number
JPS57181129A
JPS57181129A JP6660781A JP6660781A JPS57181129A JP S57181129 A JPS57181129 A JP S57181129A JP 6660781 A JP6660781 A JP 6660781A JP 6660781 A JP6660781 A JP 6660781A JP S57181129 A JPS57181129 A JP S57181129A
Authority
JP
Japan
Prior art keywords
lead frame
frame
forming
heated
shapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6660781A
Other languages
Japanese (ja)
Other versions
JPS6258546B2 (en
Inventor
Toshiyuki Arai
Keiji Sakota
Shinichi Oota
Kiichi Kanamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6660781A priority Critical patent/JPS57181129A/en
Publication of JPS57181129A publication Critical patent/JPS57181129A/en
Publication of JPS6258546B2 publication Critical patent/JPS6258546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent deformation and damage by heating two thermoplastic resin tabular shapes with indentations for encasing the semiconductor under a condition that the shapes are supplied to a die section for forming and holding, pressing and unifying a lead frame to which the semiconductor is mounted. CONSTITUTION:The tabular shapes are supplied to cavities 5, 5' from chargers 12, 12', the two die sections 1, 1' for forming are rotated in 90-degree arcs centering around a shaft, the lead frame 7 is sent by one frame pitch by means of a hook 14, and the forming surfaces of the tabular shapes are heated by means of heaters 10, 10'. The die sections are further rotated in 90 deg. arcs centering around the shaft, the lead frame 7 is sent by one frame, the forming surfaces of the tabular shapes are heated and melted by means of heaters 11, 11', one frame of the lead frame 7 is heated by means of a hot disk 16 during that time, and the lead frame 7 is further sent by one frame through revolution centering around the shaft. The tabular shapes are pressed and unified by the lead frame 7 being heated and the holding surfaces of the two die sections for forming.
JP6660781A 1981-04-30 1981-04-30 Forming device molding package of semiconductors Granted JPS57181129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6660781A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6660781A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Publications (2)

Publication Number Publication Date
JPS57181129A true JPS57181129A (en) 1982-11-08
JPS6258546B2 JPS6258546B2 (en) 1987-12-07

Family

ID=13320751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6660781A Granted JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Country Status (1)

Country Link
JP (1) JPS57181129A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like
US4764235A (en) * 1985-08-01 1988-08-16 Hitachi Chemical Company, Ltd. Process and apparatus for sealing semiconductor packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764235A (en) * 1985-08-01 1988-08-16 Hitachi Chemical Company, Ltd. Process and apparatus for sealing semiconductor packages
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like

Also Published As

Publication number Publication date
JPS6258546B2 (en) 1987-12-07

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