JPS54144873A - Manufacture for resin sealing semiconductor device - Google Patents

Manufacture for resin sealing semiconductor device

Info

Publication number
JPS54144873A
JPS54144873A JP5340078A JP5340078A JPS54144873A JP S54144873 A JPS54144873 A JP S54144873A JP 5340078 A JP5340078 A JP 5340078A JP 5340078 A JP5340078 A JP 5340078A JP S54144873 A JPS54144873 A JP S54144873A
Authority
JP
Japan
Prior art keywords
resin
coated
corrosion
transfer molding
hardening resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5340078A
Other languages
Japanese (ja)
Other versions
JPS5633860B2 (en
Inventor
Toshikuni Kaino
Haruo Nakamura
Noriyoshi Yamada
Norio Murata
Susumu Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5340078A priority Critical patent/JPS54144873A/en
Publication of JPS54144873A publication Critical patent/JPS54144873A/en
Publication of JPS5633860B2 publication Critical patent/JPS5633860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the corrosion and electrolytic corrosion of Al circuit, by continuously forming the low trasfer molding hardening resin coated on the surface of semiconductor element and another type of transfer molding hardening resin coated at the external side within one metal mold in a series of processes.
CONSTITUTION: The semiconductor element 2 is fixed on the lead frame 1, and connection is made to the adjacent frame 1 by using the bonding wire 3. While projecting a part of the adjacent frame 1 externally, they are coated with the low pressure transfer molding hardening resin 6. Further, the outside of it is enclosed and coated with another type of transfer molding hardening resin 4, and a series of processes is continuously made in the same metal mold to finish the resin sealing with perfect hardening. Thus, since the element surface is covered with high impurity resin first, no attachment of impurity ions in the resin placed after that is made on the element surface and accordingly, no corrosion and electrolytic corrosion for the Al circuit provided at the elements can be made.
COPYRIGHT: (C)1979,JPO&Japio
JP5340078A 1978-05-04 1978-05-04 Manufacture for resin sealing semiconductor device Granted JPS54144873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5340078A JPS54144873A (en) 1978-05-04 1978-05-04 Manufacture for resin sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5340078A JPS54144873A (en) 1978-05-04 1978-05-04 Manufacture for resin sealing semiconductor device

Publications (2)

Publication Number Publication Date
JPS54144873A true JPS54144873A (en) 1979-11-12
JPS5633860B2 JPS5633860B2 (en) 1981-08-06

Family

ID=12941768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5340078A Granted JPS54144873A (en) 1978-05-04 1978-05-04 Manufacture for resin sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS54144873A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133509U (en) * 1981-02-14 1982-08-20
JPS6132448A (en) * 1984-07-24 1986-02-15 Mitsubishi Electric Corp Resin-sealed type semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030676A (en) * 1974-05-28 1975-03-26
JPS52123873A (en) * 1976-04-12 1977-10-18 Hitachi Ltd Sealing method of semiconductor elements

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030676A (en) * 1974-05-28 1975-03-26
JPS52123873A (en) * 1976-04-12 1977-10-18 Hitachi Ltd Sealing method of semiconductor elements

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133509U (en) * 1981-02-14 1982-08-20
JPS6132448A (en) * 1984-07-24 1986-02-15 Mitsubishi Electric Corp Resin-sealed type semiconductor device
JPH0345901B2 (en) * 1984-07-24 1991-07-12 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
JPS5633860B2 (en) 1981-08-06

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