JPS6464239A - Apparatus for manufacturing resin package sealing for semiconductor - Google Patents
Apparatus for manufacturing resin package sealing for semiconductorInfo
- Publication number
- JPS6464239A JPS6464239A JP12777787A JP12777787A JPS6464239A JP S6464239 A JPS6464239 A JP S6464239A JP 12777787 A JP12777787 A JP 12777787A JP 12777787 A JP12777787 A JP 12777787A JP S6464239 A JPS6464239 A JP S6464239A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- sealing
- molds
- semiconductor
- molded plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent damage to bonding wire or flash, by feeding a pair of thermoplastic resin molded plates to a lead frame positioning and preliminary heating section for positioning and fixing them before heating and melting the same, and subsequently disposing a lead frame between sealing molds for pressurizing it. CONSTITUTION:A pair of thermoplastic resin molded plates 95 are supplied to sealing molds 131. At the same time, a lead frame 20 on which a semiconductor or the like is mounted is fed to a lead frame positioning section 13 where it is positioned and fixed. Then, lead frame heating molds 84 are raised and sandwich the lead frame 20. Simultaneously therewith, hot air blowing boxes 154 are lowered to heat and melt the sealing faces 100 of the molded plates 95. While the hot air blowing boxes 154 are raised, the sealing molds 131 are turned by 90 deg. so that they sandwich and heat the lead frame 20. There is no problem such as damage to bonding wires or flash since they are not contacted directly during these procedures.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12777787A JPS6464239A (en) | 1987-05-25 | 1987-05-25 | Apparatus for manufacturing resin package sealing for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12777787A JPS6464239A (en) | 1987-05-25 | 1987-05-25 | Apparatus for manufacturing resin package sealing for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6464239A true JPS6464239A (en) | 1989-03-10 |
Family
ID=14968428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12777787A Pending JPS6464239A (en) | 1987-05-25 | 1987-05-25 | Apparatus for manufacturing resin package sealing for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6464239A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5997235A (en) * | 1996-09-20 | 1999-12-07 | Brooks Automation, Inc. | Swap out plate and assembly |
-
1987
- 1987-05-25 JP JP12777787A patent/JPS6464239A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5997235A (en) * | 1996-09-20 | 1999-12-07 | Brooks Automation, Inc. | Swap out plate and assembly |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GR3004022T3 (en) | ||
JPS6464239A (en) | Apparatus for manufacturing resin package sealing for semiconductor | |
US5830403A (en) | Method of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line system | |
KR0139128Y1 (en) | Moulding apparatus of molding press for semiconductor package | |
JPH0878452A (en) | Resin molding equipment | |
JP2882013B2 (en) | Processing of sealed lead frame | |
JPH0719785B2 (en) | Resin molding method for semiconductor device | |
JPH04353410A (en) | Automatic transfer molding machine | |
JPS60244512A (en) | Molding method | |
KR0139127Y1 (en) | Moulding heating apparatus of molding press, semiconductor package | |
JPS59172241A (en) | Semiconductor resin sealing device | |
KR100369391B1 (en) | Wire bonding apparatus for fabricating semiconductor package and method for fabricating semiconductor package thereof | |
JPH0428133B2 (en) | ||
JPS57181129A (en) | Forming device molding package of semiconductors | |
KR0164131B1 (en) | Wire bonding type heat block | |
JP2551100Y2 (en) | Semiconductor device encapsulation equipment | |
JP3167469B2 (en) | Heating device for die bonding of semiconductor chips in electronic components | |
JPH05226397A (en) | Thermal cure type automatic molding device for semiconductor | |
JPS57138149A (en) | Mounting method for chip | |
JPS5633847A (en) | Package molding for semiconductor | |
JPS6063937A (en) | Assembling device for electronic component | |
KR100219912B1 (en) | Semiconductor chip package mold exchange method | |
JPH01310571A (en) | Lead frame | |
JPS5998538A (en) | Manufacture of semiconductor device | |
JPH0621118A (en) | Resin sealing apparatus for semiconductor element |