JPS6464239A - Apparatus for manufacturing resin package sealing for semiconductor - Google Patents

Apparatus for manufacturing resin package sealing for semiconductor

Info

Publication number
JPS6464239A
JPS6464239A JP12777787A JP12777787A JPS6464239A JP S6464239 A JPS6464239 A JP S6464239A JP 12777787 A JP12777787 A JP 12777787A JP 12777787 A JP12777787 A JP 12777787A JP S6464239 A JPS6464239 A JP S6464239A
Authority
JP
Japan
Prior art keywords
lead frame
sealing
molds
semiconductor
molded plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12777787A
Other languages
Japanese (ja)
Inventor
Iwao Yamada
Nobukazu Koide
Tamiki Shoji
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12777787A priority Critical patent/JPS6464239A/en
Publication of JPS6464239A publication Critical patent/JPS6464239A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent damage to bonding wire or flash, by feeding a pair of thermoplastic resin molded plates to a lead frame positioning and preliminary heating section for positioning and fixing them before heating and melting the same, and subsequently disposing a lead frame between sealing molds for pressurizing it. CONSTITUTION:A pair of thermoplastic resin molded plates 95 are supplied to sealing molds 131. At the same time, a lead frame 20 on which a semiconductor or the like is mounted is fed to a lead frame positioning section 13 where it is positioned and fixed. Then, lead frame heating molds 84 are raised and sandwich the lead frame 20. Simultaneously therewith, hot air blowing boxes 154 are lowered to heat and melt the sealing faces 100 of the molded plates 95. While the hot air blowing boxes 154 are raised, the sealing molds 131 are turned by 90 deg. so that they sandwich and heat the lead frame 20. There is no problem such as damage to bonding wires or flash since they are not contacted directly during these procedures.
JP12777787A 1987-05-25 1987-05-25 Apparatus for manufacturing resin package sealing for semiconductor Pending JPS6464239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12777787A JPS6464239A (en) 1987-05-25 1987-05-25 Apparatus for manufacturing resin package sealing for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12777787A JPS6464239A (en) 1987-05-25 1987-05-25 Apparatus for manufacturing resin package sealing for semiconductor

Publications (1)

Publication Number Publication Date
JPS6464239A true JPS6464239A (en) 1989-03-10

Family

ID=14968428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12777787A Pending JPS6464239A (en) 1987-05-25 1987-05-25 Apparatus for manufacturing resin package sealing for semiconductor

Country Status (1)

Country Link
JP (1) JPS6464239A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997235A (en) * 1996-09-20 1999-12-07 Brooks Automation, Inc. Swap out plate and assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997235A (en) * 1996-09-20 1999-12-07 Brooks Automation, Inc. Swap out plate and assembly

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