JPH01310571A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH01310571A JPH01310571A JP14222888A JP14222888A JPH01310571A JP H01310571 A JPH01310571 A JP H01310571A JP 14222888 A JP14222888 A JP 14222888A JP 14222888 A JP14222888 A JP 14222888A JP H01310571 A JPH01310571 A JP H01310571A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- lead
- lead frame
- resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂封止型の半導体装置に使用するリードフ
レームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame used in a resin-sealed semiconductor device.
従来、この種のリードフレームによって第３図に示すよ
うな半導体装置の成形品が製造されている。これを同図
および第４図に基づいて説明すると、同図において、符
号１で示すものは枠体２に吊りリード３によって弾性保
持され半導体素子４を接合するダイパッド、５はこのダ
イパッド１上の半導体素子４にワイヤ６によって接続す
るインナーリード７およびこのインナーリード７に連接
するアウターリード８を有する多数のリード、９はこれ
らリード５のうちインナーリード７間に介在する樹脂流
れ止め用の連結片である。また、１０は前記半導体素子
４．前記ワイヤ６およびインナーリード７を封止する封
止樹脂である。Conventionally, a molded product of a semiconductor device as shown in FIG. 3 has been manufactured using this type of lead frame. This will be explained based on the same figure and FIG. A large number of leads including an inner lead 7 connected to the semiconductor element 4 by a wire 6 and an outer lead 8 connected to the inner lead 7, and 9 is a connecting piece for preventing resin flow interposed between the inner leads 7 of these leads 5. It is. 10 is the semiconductor element 4. This is a sealing resin that seals the wire 6 and the inner lead 7.
このように構成されたリードフレームを用いて半導体装
置の成形品を製造する方法について説明する。A method of manufacturing a molded product of a semiconductor device using a lead frame configured in this manner will be described.
先ず、上下２つの型板のうち下側の型板上に位置決めピ
ンによづて樹脂封止前のリードフレームを位置決めする
。次いで、上下両型板によって型締めした後、型板のポ
ット内に樹脂タブレットを挿入してプランジャーによっ
て加圧する。このとき、樹脂タブレットは加熱溶融され
て溶融樹脂となり、ランナーおよびゲートを介してキャ
ビティ内に充填される。しかる後、型開きをしてから成
形品を取り出す。First, the lead frame before resin sealing is positioned on the lower template of the two upper and lower templates using positioning pins. Next, after the mold is clamped by both upper and lower mold plates, a resin tablet is inserted into the pot of the mold plate and pressurized with a plunger. At this time, the resin tablet is heated and melted to become a molten resin, which is filled into the cavity via the runner and the gate. After that, the mold is opened and the molded product is taken out.
このようにして、半導体装置の成形品を製造することが
できる。In this way, a molded product of a semiconductor device can be manufactured.
この後、インナーリード７間の連結片９を分離除去し、
外装処理、リード成形加工を施してから樹脂封止型の半
導体装置が完成する。After that, the connecting pieces 9 between the inner leads 7 are separated and removed,
A resin-sealed semiconductor device is completed after exterior processing and lead molding.
なお、型締め時には両型板が所定の温度に加熱されてい
る。Note that both mold plates are heated to a predetermined temperature during mold clamping.
ところで、従来のリードフレームにおいては、樹脂流れ
止め用の連結片９がリード５と同一の材料によって形成
されており、このため樹脂封止型の半導体装置を製造す
る場合には樹脂封止後に連結片９を分離除去する工程を
必要としていた。すなわち、半導体装置としての電気的
特性を満足させるためには、リード５間が絶縁されてい
る必要があるからである。この結果、樹脂封止型半導体
装置の製造を煩雑にするばかりか、その製造に多大の時
間を費やし、生産性がきわめて低下するという問題があ
った。By the way, in the conventional lead frame, the connection piece 9 for preventing resin flow is formed of the same material as the lead 5, and therefore, when manufacturing a resin-sealed semiconductor device, the connection piece 9 for preventing resin flow is made of the same material as the lead 5. A step of separating and removing the piece 9 was required. That is, in order to satisfy the electrical characteristics of a semiconductor device, the leads 5 must be insulated. As a result, there has been a problem in that not only is the manufacture of the resin-sealed semiconductor device complicated, but also a great deal of time is spent on the manufacture, resulting in a significant drop in productivity.
本発明はこのような事情に鑑みてなされたもので、樹脂
封止型半導体装置における製造の簡素化および製造時間
の短縮化を図ることができ、もって半導体装置の生産性
を高めることができるリードフレームを提供するもので
ある。The present invention has been made in view of the above circumstances, and provides a lead that can simplify the manufacturing of resin-sealed semiconductor devices and shorten the manufacturing time, thereby increasing the productivity of semiconductor devices. It provides a frame.
本発明に係るリードフレームは、枠体に吊りリードによ
って弾性保持され半導体素子を接合するダイパッドと、
このダイパッド上の半導体素子にワイヤによって接続す
るインナーリードおよびこのインナーリードに連接する
アウターリードを有する多数のリードと、これらリード
のうちインナーリード間に介在する封止樹脂流れ止め用
の連結片とを備え、この連結片を絶縁材によって形成し
たものである。The lead frame according to the present invention includes a die pad that is elastically held by a hanging lead on a frame body and that connects a semiconductor element.
A large number of leads each having an inner lead connected to the semiconductor element on the die pad by a wire and an outer lead connected to the inner lead, and a connecting piece for preventing the flow of sealing resin interposed between the inner leads among these leads. This connecting piece is made of an insulating material.
本発明においては、樹脂封止型の半導体装置を製造する
場合に連結片を分離除去する工程が不要になる。In the present invention, when manufacturing a resin-sealed semiconductor device, there is no need to separate and remove the connecting pieces.
以下、本発明の構成等を図に示す実施例によって詳細に
説明する。EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.
第１図は本発明に係るリードフレームを示す斜視図、第
２図は同じく本発明におけるリードフレームを用いて製
造する半導体装置の成形品を示す斜視図で、同図におい
て第３図および第４図と同一の部材については同一の符
号を付し、詳細な説明は省略する。同図において、符号
２１で示すものは前記インナーリード７のうち各々が互
いに隣り合う２つのインナーリード７間に介在する樹脂
流れ止め用の連結片で、全体力１色縁材によって形成さ
れている。FIG. 1 is a perspective view showing a lead frame according to the present invention, and FIG. 2 is a perspective view showing a molded product of a semiconductor device manufactured using the lead frame according to the present invention. The same members as those in the figures are given the same reference numerals, and detailed explanations will be omitted. In the figure, the reference numeral 21 denotes a connecting piece for preventing resin flow, which is interposed between two adjacent inner leads 7 among the inner leads 7, and is formed of a single-colored edge material. .
このように構成されたリードフレームを用いて半導体装
置の成形品を製造するには、従来と同様にして行うこと
ができる。すなわち、上下２つの型板のうち下側の型板
上に位置決めピンによって樹脂封止前のリードフレーム
を位置決めし、次いで上下両型板によって型締めした後
、型板のボット内に樹脂タブレットを挿入してプランジ
ャーによって加圧してから型開きをするのである。A molded product of a semiconductor device can be manufactured using the lead frame configured in this manner in the same manner as in the conventional method. That is, the lead frame before resin sealing is positioned on the lower template of the two upper and lower templates using positioning pins, and then the mold is clamped by both the upper and lower templates, and then a resin tablet is placed in the bottom of the template. The mold is opened after it is inserted and pressurized with a plunger.
この後、成形品に外装処理、リード成形加工を施してか
ら樹脂封止型の半導体装置が完成する。Thereafter, the molded product is subjected to exterior processing and lead molding processing, and then a resin-sealed semiconductor device is completed.
したがって、本発明においては、樹脂封止型の半導体装
置を製造する場合に連結片２１を分離除去する工程が不
要になるから、樹脂封止型半導体装置における製造の簡
素化および製造時間の短縮化を図ることができる。Therefore, in the present invention, the step of separating and removing the connecting piece 21 is not necessary when manufacturing a resin-sealed semiconductor device, which simplifies the manufacturing process and shortens the manufacturing time of the resin-sealed semiconductor device. can be achieved.
因に、このように構成されたリードフレームを製造する
には、リードフレーム本体（連結片が無いもの）に接着
剤によって２つのインナーリード７間に連結片２１を取
り付けることにより、連結片２１となる液体の熱硬化性
樹脂を２つのインナーリード７間にポツティングしてか
ら熱硬化させることによりあるいは熱可塑性樹脂をイン
ナーリード１間に載置してから加熱・加圧して圧縮成形
することにより行う。Incidentally, in order to manufacture a lead frame configured in this way, the connecting piece 21 is attached between the two inner leads 7 with adhesive to the lead frame body (one without a connecting piece), and the connecting piece 21 and This is done by potting a liquid thermosetting resin between the two inner leads 7 and then thermosetting it, or by placing a thermoplastic resin between the inner leads 1 and compression molding it by heating and pressurizing it. .
以上説明したように本発明によれば、枠体に吊リリード
によって弾性保持され半導体素子を接合するダイパッド
と、このダイバンド上の半導体素子にワイヤによって接
続するインナーリードおよびこのインナーリードに連接
するアウターリードを有する多数のリードと、これらリ
ードのうちインナーリード間に介在する封止樹脂流れ止
め用の連結片とを備え、この連結片を絶縁材によって形
成したので、樹脂封止型の半導体装置を製造する場合に
連結片を分離除去する工程が不要になる。As explained above, according to the present invention, there is a die pad which is elastically held on a frame by a hanging reed and which joins a semiconductor element, an inner lead which is connected to the semiconductor element on the die band by a wire, and an outer lead which is connected to the inner lead. A resin-sealed semiconductor device can be manufactured by manufacturing a resin-sealed semiconductor device, which is equipped with a large number of leads having a diameter of 100 mm, and a connecting piece for preventing the sealing resin from flowing between the inner leads of these leads, and this connecting piece is made of an insulating material. In this case, the process of separating and removing the connecting piece becomes unnecessary.
したがって、樹脂封止型半導体装置における製造の簡素
化および製造時間の短縮化を図ることができるから、半
導体装置の生産性を高めることができる。Therefore, manufacturing of the resin-sealed semiconductor device can be simplified and manufacturing time can be shortened, so that productivity of the semiconductor device can be increased.
第１図は本発明に係るリードフレームを示す斜視図、第
２図は同じく本発明におけるリードフレームを用いて製
造する半導体装置の成形品を示す斜視図、第３図は従来
のリードフレームを示す斜視図、第４図は従来のリード
フレームを用いて製造する半導体装置の成形品を示す斜
視図である。
１・・・・グイバンド、２・・・・枠体、３・・・・吊
りリード、４・・・・半導体素子、５・・・・リード、
６・・・・ワイヤ、７・・・・インナーリード、８・・
・・アウターリード、２１・・・・連結片。
代 理 人 大岩増雄
第１図
第３図FIG. 1 is a perspective view showing a lead frame according to the present invention, FIG. 2 is a perspective view showing a molded product of a semiconductor device manufactured using the lead frame according to the present invention, and FIG. 3 is a conventional lead frame. FIG. 4 is a perspective view showing a molded product of a semiconductor device manufactured using a conventional lead frame. 1... Gui band, 2... Frame body, 3... Hanging lead, 4... Semiconductor element, 5... Lead,
6...Wire, 7...Inner lead, 8...
...Outer lead, 21...Connection piece. Agent Masuo Oiwa Figure 1 Figure 3
Claims (1)
接合するダイパッドと、このダイパッド上の半導体素子
にワイヤによって接続するインナーリードおよびこのイ
ンナーリードに連接するアウターリードを有する多数の
リードと、これらリードのうちインナーリード間に介在
する封止樹脂流れ止め用の連結片とを備え、この連結片
を絶縁材によって形成したことを特徴とするリードフレ
ーム。A die pad that is elastically held by a hanging lead on a frame body and connects a semiconductor element, an inner lead that is connected to the semiconductor element on this die pad by a wire, and a large number of leads that have an outer lead that is connected to the inner lead, and among these leads. A lead frame comprising a connecting piece for preventing the flow of sealing resin interposed between inner leads, and the connecting piece is made of an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14222888A JPH01310571A (en) | 1988-06-09 | 1988-06-09 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14222888A JPH01310571A (en) | 1988-06-09 | 1988-06-09 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01310571A true JPH01310571A (en) | 1989-12-14 |
Family
ID=15310398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14222888A Pending JPH01310571A (en) | 1988-06-09 | 1988-06-09 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01310571A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5176366A (en) * | 1989-10-20 | 1993-01-05 | Texas Instruments Incorporated | Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions |
| US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
-
1988
- 1988-06-09 JP JP14222888A patent/JPH01310571A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5176366A (en) * | 1989-10-20 | 1993-01-05 | Texas Instruments Incorporated | Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions |
| US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
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