JPH06254910A - Resin sealing mold for electronic part - Google Patents

Abstract

PURPOSE:To provide a resin sealing mold for an electronic part in which a cavity of other shape can be formed easily. CONSTITUTION:In a resin sealing mold 1 consisting of a top force 10 and a bottom force 20 provided with center blocks 11 and 12 into which resin is fed and cavity blocks 12 and 22 with cavities 13 and 23 into which resin is injected from the center blocks 11 and 12 through runners assembled respectively in the top force and the bottom force, the cavity blocks 12 and 22 are assembled removably to the center blocks 11 and 21 disposed on the top force 10 and the bottom force 20. Even when the cavity blocks 12 and 22 are formed on both sides of the center blocks 11 and 21, the respective cavity blocks are assembled removably.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation mold for an electronic component for encapsulating an electronic component such as a semiconductor element with a resin.

[0002]

2. Description of the Related Art A semiconductor device encapsulated in a resin package is generally molded by a transfer molding method, and an upper part and a lower part are mounted in a state where electronic parts such as semiconductor elements are mounted on a lead frame. A package is molded around an electronic component by sandwiching it between a mold and a mold and filling a cavity provided in the mold with resin. In order to mold a resin package by such a transfer molding method, the mold including the upper mold and the lower mold as described above is required.

A conventional resin sealing die will be described with reference to the perspective view of FIG. That is, this resin sealing mold 1 is
It is roughly divided into an upper mold 10 and a lower mold 20, and an upper mold chase unit 15 is incorporated in the upper mold 10 and a lower mold chase unit 25 is incorporated in the lower mold 20. The upper die chase unit 15 is provided with an upper die center block 11 and an upper die cavity block 12, and the lower die chase unit 25 is provided with a lower die center block 21 and a lower die cavity block 22.
The upper mold cavity 13 and the lower mold cavity 23 are aligned by superposing the lower mold 20 and the lower mold 20.

Further, for example, the lower mold center block 21 is provided with a pot 24 into which a resin is poured so as to face a cull portion (not shown) provided in the upper mold center block 11. For example, in order to assemble the lower die 20, so-called setup, the entire lower die chase unit 25 including the lower die center block 21 and the lower die cavity block 22 is fitted into the recess of the lower die 20. In order to set up the upper mold 10, the entire upper mold chase unit 15 including the upper mold center block 11 and the upper mold cavity block 12 is fitted into the recess of the upper mold 10.

In order to mold a package of electronic parts using such a resin-sealing die 1, for example, the electronic parts are mounted on a lead frame and wired with bonding wires or the like, and then the lead frame is placed on top. It is sandwiched between the mold 10 and the lower mold 20. At this time, electronic components are arranged between the upper mold cavity 13 and the lower mold cavity 23,
Molten resin is injected between the upper mold cavity 13 and the lower mold cavity 23.

The mold 1 for resin encapsulation is heated to a temperature necessary for curing the resin (for example, 175 ° C.), and the resin is supplied to the pot 24 of the lower mold center block 21 to be melted and not shown. It is injected between the upper mold cavity 13 and the lower mold cavity 23 by pressing with a plunger. As a result, the periphery of the electronic component can be sealed with the resin, and the package in which the shapes of the upper mold cavity 13 and the lower mold cavity 23 are transferred is molded.

[0007]

However, such a resin-sealing mold has the following problems. In other words, if you want to use the same upper and lower molds to mold other types of packages, replace the upper mold chase unit and lower mold chase unit as a whole with the change of upper mold cavity and lower mold cavity. There is a need to. However, these chase units are composed of a center block and a cavity block, and it is difficult to easily replace the entire chase unit due to its size and weight.

Further, since the chase unit is heated to the temperature required for hardening the resin, it requires a great deal of handling and a great amount of time is required to raise the replaced chase unit to the required temperature. It takes. In particular, in the case of high-mix low-volume production, it is necessary to frequently change chase units, which leads to a decrease in productivity. Therefore, it is an object of the present invention to provide a resin-sealing mold capable of easily preparing another type of cavity.

[0009]

SUMMARY OF THE INVENTION The present invention is a metal mold for resin encapsulation of an electronic component, which is made to solve the above problems. That is, in this resin sealing mold, a center block to which the resin is supplied and a cavity block having a cavity into which the resin is injected from the center block via a runner are incorporated in the upper mold and the lower mold, respectively. A center block in which a cavity block is arranged in an upper mold and a lower mold, in which a periphery of an electronic component arranged in a cavity is sealed with resin in a state where the upper mold and the lower mold are clamped. It is one that is detachably incorporated into. Further, when the cavity blocks are provided on both sides of the center block arranged in the upper mold and the lower mold, a resin sealing mold in which each cavity block is detachably incorporated into the center block. Is.

[0010]

[Function] Since the cavity block having the cavity is detachably incorporated into the center blocks arranged in the upper mold and the lower mold, only the cavity block is left with the center blocks left in the upper mold and the lower mold. Can be replaced. That is, when changing the shape of the cavity, it is sufficient to replace only the cavity block having the cavity of that shape, and the handling becomes easy. Further, by exchanging only the cavity block, it is not necessary to lower the temperature of the center block, and the temperature rise of the cavity block after the exchange can be accelerated.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a resin-sealing mold for electronic parts of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view illustrating a resin sealing mold of the present invention. That is, the resin sealing mold 1 is composed of an upper mold 10 and a lower mold 20, and the upper mold 10 includes an upper mold center block 11 and an upper mold cavity block 12 having an upper mold cavity 13. It has been incorporated. Further, a lower mold center block 21 and a lower mold cavity block 22 having a lower mold cavity 23 are incorporated in the lower mold 20.

For example, the lower die center block 21 is provided with a plurality of vertical hole-shaped pots 24.
The resin can be supplied inside. This pot 2
The upper die center block 11 of the upper die 10 facing the position 4
Is provided with a cull portion (not shown), and in a state where the upper mold 10 and the lower mold 20 are clamped, the resin pushed up from the pot 24 is pushed into the upper mold cavity 13 and the lower mold cavity 23.
Leading in the direction of.

An upper mold cavity block 12 is detachably incorporated adjacent to the upper mold center block 11 arranged in the upper mold 10, and adjacent to a lower mold center block 21 arranged in the lower mold 20. Then, the lower mold cavity block 22 is detachably incorporated. That is, rail-shaped protrusions are provided on the side surfaces of the cavity blocks 12 and 22, and, for example, a protrusion of the lower mold cavity block 22 is provided in a concave portion provided between the lower mold center block 21 and the lower mold 20. Can be fitted. Similarly, the upper mold cavity block 12 can also be fitted between the upper mold center block 11 and the upper mold 10.

For example, in the case of taking two frames, the lower die center block 21 is arranged at substantially the center of the lower die 20,
Lower mold cavity blocks 22 are detachably incorporated on both sides thereof. Further, an upper mold center block 11 is arranged at a substantially central portion of the upper mold 10, and upper mold cavity blocks 12 are detachably incorporated on both sides thereof. Each of the cavity blocks 12 and 22 is provided with a runner and a gate (not shown), and the pot 24 and the cavities 13 and 23 in the assembled state communicate with each other via the runner and the gate.

That is, only the upper mold cavity block 12 and the lower mold cavity block 22 can be exchanged while the upper mold 10 and the lower mold 20, and the upper mold center block 11 and the lower mold center block 21 are left as they are. That is, in such two-frame taking, since the upper mold cavity blocks 12 are arranged on both sides of the upper mold center block 11, the conventional upper mold chase unit 15 is arranged.
Compared with (see FIG. 3), the size and weight of the upper mold cavity block 12 alone is about half or less, and the upper mold cavity block 12 can be easily attached and detached. The same applies to the lower mold cavity block 22 on the lower mold 20 side.

As described above, the side plate 30 is provided with the cavity blocks 12 and 22 incorporated in the upper mold 10 and the lower mold 20.
By mounting, the setup of the upper mold 10 and the lower mold 20 is completed. Then, with the upper mold 10 and the lower mold 20 clamped, resin is injected into the cavities 13 and 23.

In order to mold a package of electronic parts by using the resin-sealing mold 1, as described above, the predetermined cavity blocks 12 and 22 are mounted on the upper mold 10 and the lower mold 2.
After assembling each of them into 0, a lead frame (not shown) on which electronic components such as semiconductor elements are mounted is sandwiched between the upper die 10 and the lower die 20. At this time, the electronic component is placed between the upper mold cavity 13 and the lower mold cavity 23.

Next, the upper mold 10 and the lower mold 20 are clamped with a predetermined pressure, and the resin is supplied to the pot 24 and melted.
After the resin is melted in the pot 24, the resin is pushed up by a plunger (not shown) to inject the resin into the upper mold cavity 13 and the lower mold cavity 23. Each of the cavity blocks 12 and 22 is heated by an upper mold 10 and a lower mold 20 provided with a heater, and the resin injected into the cavities 13 and 23 can be cured. Accordingly, the periphery of the electronic component arranged between the upper mold cavity 13 and the lower mold cavity 23 can be sealed with the resin package.

When it is desired to form another type of package, only the cavity blocks 12 and 22 are to be molded in the upper mold 1.
0 and lower mold 20 and other shaped cavities 1
Other cavity blocks 12 and 22 having the same outer dimensions provided with 3 and 23 may be assembled in the upper mold 10 and the lower mold 20. In this way, since only the cavity blocks 12 and 22 can be removed, it is possible to easily handle even when heated. Moreover, since the center blocks 11 and 12 are still arranged in the upper die 10 and the lower die 20, there is no unnecessary temperature drop, and
Since it is only necessary to heat the newly incorporated cavity blocks 12, 22 alone, it is possible to easily raise the temperature to a predetermined temperature.

Next, another example of the present invention will be described with reference to FIG. In addition, in order to simplify the description, the lower mold 20 side will be described as an example in FIG. 2. FIG. 2A is a plan view showing the lower mold 20 having one frame, and the lower mold cavity block 22 is arranged on one side of the lower mold center block 21. The lower die cavity block 22 is detachably incorporated into the lower die center block 21 arranged in the lower die 20, and the pot 24 is attached in the assembled state.
The lower mold cavity 23 and the runner 26 and the gate 27.
The communication is established via.

FIG. 2B is a plan view showing a lower die 20 having four frames. Two lower die center blocks 21 are arranged on the lower die 20, and both lower die center blocks 21 are provided on both sides thereof. The lower mold cavity block 22 is detachably incorporated. That is, even when only one lower mold cavity block 22 is arranged in the lower mold 20, and even when a plurality of lower mold cavity blocks 22 are arranged, the side plate 30 of the lower mold 20 should be removed. Thus, only the lower mold cavity block 22 can be easily attached and detached.

In particular, if four or more frames are taken, it takes a long time to replace the lower die center block 21 and the lower die cavity blocks 22 as a whole, but the lower die center block 21 is left as it is. Since only the lower mold cavity block 22 needs to be replaced, the setup time can be significantly shortened. In the above description,
Although the description has been made using the lower mold 20 side, the same applies to the upper mold 10 side, and the upper mold cavity block 12 may be detachably incorporated into the upper mold center block 11.

Further, although the case where the lower mold center block 21 is provided with the pot 24 has been described in these embodiments, the present invention is not limited to this, and the upper mold center block 11 is provided with the pot 24. The same is true. In this case, the resin is pushed from the pot 24 of the upper die center block 11 toward the lower die 20 and injected into the cavities 13 and 23.

[0024]

As described above, the metal mold for resin sealing of electronic parts of the present invention has the following effects. That is, since the cavity blocks are detachably incorporated in the upper mold and the lower mold, only the cavity blocks can be replaced. For this reason, the size and weight of the block to be replaced are significantly reduced, and the replacement work can be easily performed.

Further, by exchanging only the cavity block, the temperature of the center block and the like is not unnecessarily lowered, and the cavity block after the exchange can be immediately heated to a predetermined temperature, so that productivity can be reduced by shortening the exchange time. Can be improved. In addition, if you want to mold a new shape of package, you only need to develop the cavity block portion, and even if you are compatible with various types of packages, you can store only the cavity block if you do not use it, saving space. It is possible to reduce the cost. In particular, the present invention is suitable for high-mix low-volume production that requires frequent replacement of the cavity block.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a resin sealing mold of the present invention.

2A and 2B are plan views illustrating another example, in which FIG. 2A is one frame taken, and FIG. 2B is four frames taken.

FIG. 3 is a perspective view illustrating a conventional resin sealing mold.

[Explanation of symbols]

 1 Resin Mold 10 Upper Mold 11 Upper Mold Center Block 12 Upper Mold Cavity Block 13 Upper Mold Cavity 20 Lower Mold 21 Lower Mold Center Block 22 Lower Mold Cavity Block 23 Lower Mold Cavity 24 Pot 30 Side Plate

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/56 T 8617-4M // B29L 31:34 4F

Claims (2)

[Claims] 1. A center block to which a sealing resin is supplied, and a cavity block having a cavity into which the resin is injected from the center block via a runner are incorporated in each of an upper mold and a lower mold. In the state where the upper mold and the lower mold are clamped, a mold for resin sealing that seals the periphery of an electronic component arranged in the cavity with the resin, wherein the cavity block is A mold for resin sealing of an electronic component, which is detachably incorporated into the center blocks arranged in the upper mold and the lower mold. 2. The cavity blocks are provided on both sides of the center block arranged in the upper mold and the lower mold, and each cavity block is detachably incorporated in the center block. The mold for resin encapsulation of an electronic component according to claim 1, characterized in that.