JPS5521126A - Marking method in resin mold parts - Google Patents

Marking method in resin mold parts

Info

Publication number
JPS5521126A
JPS5521126A JP9360578A JP9360578A JPS5521126A JP S5521126 A JPS5521126 A JP S5521126A JP 9360578 A JP9360578 A JP 9360578A JP 9360578 A JP9360578 A JP 9360578A JP S5521126 A JPS5521126 A JP S5521126A
Authority
JP
Japan
Prior art keywords
mold
mold member
face
circumference
mold parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9360578A
Other languages
Japanese (ja)
Inventor
Hidetoshi Mochizuki
Keizo Otsuki
Akira Suzuki
Yoshio Adachi
Hideki Kosaka
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9360578A priority Critical patent/JPS5521126A/en
Publication of JPS5521126A publication Critical patent/JPS5521126A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

PURPOSE: To perform a marking in the central portion of the upper and lower face of a mold member by taking mold parts from the upper and lower mold members with an ejecter pin projected to the circumference of the upper and lower face of the mold member in taking the mold parts after a mold processing.
CONSTITUTION: A semiconductor element 21 is fixed to a tab lead 20, a lead frame 24 connected by a wire 23 to the inner end of anelectrode lead 22 of the semiconductor element 21 is interposed between an upper and lower mold member 25 and 26 to be molded after tightening. Thereafter, the mold member is opened and the mold parts are taken from the upper and lower mold member 25 and 26 by projecting an ejector pin 27 and 28 from the cavity bottom face of the mold member 25 and 26. In this case, the ejector pin 27 and 28 are provided in the circumference of a mold member 29 so that they press the circumference of the mold 29 and the upper and lower central face of the mold member 29 is formed flat and a mark 31 is indicated on the flat face.
COPYRIGHT: (C)1980,JPO&Japio
JP9360578A 1978-08-02 1978-08-02 Marking method in resin mold parts Pending JPS5521126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9360578A JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9360578A JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59152890A Division JPS60121742A (en) 1984-07-25 1984-07-25 Marking method in resin molded product

Publications (1)

Publication Number Publication Date
JPS5521126A true JPS5521126A (en) 1980-02-15

Family

ID=14086951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9360578A Pending JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Country Status (1)

Country Link
JP (1) JPS5521126A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219056A (en) * 1982-06-16 1983-12-20 Hitachi Ltd Marking method of hybrid integrated circuit
US6294411B1 (en) 1996-10-25 2001-09-25 Nippon Steel Semiconductor Corporation Method for molding a semiconductor device utilizing a satin finish

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219056A (en) * 1982-06-16 1983-12-20 Hitachi Ltd Marking method of hybrid integrated circuit
US6294411B1 (en) 1996-10-25 2001-09-25 Nippon Steel Semiconductor Corporation Method for molding a semiconductor device utilizing a satin finish

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