JPS5242372A - Process for production of semiconductor device - Google Patents

Process for production of semiconductor device

Info

Publication number
JPS5242372A
JPS5242372A JP11816575A JP11816575A JPS5242372A JP S5242372 A JPS5242372 A JP S5242372A JP 11816575 A JP11816575 A JP 11816575A JP 11816575 A JP11816575 A JP 11816575A JP S5242372 A JPS5242372 A JP S5242372A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
mold
clearances
flash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11816575A
Other languages
Japanese (ja)
Inventor
Yutaka Morita
Kaoru Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11816575A priority Critical patent/JPS5242372A/en
Publication of JPS5242372A publication Critical patent/JPS5242372A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent resin mold "flash" through the clearances at mold parting lines during resin sealing, in a transfer molding method for elements using a lead frame.
COPYRIGHT: (C)1977,JPO&Japio
JP11816575A 1975-09-30 1975-09-30 Process for production of semiconductor device Pending JPS5242372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11816575A JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11816575A JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5242372A true JPS5242372A (en) 1977-04-01

Family

ID=14729706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11816575A Pending JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5242372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
US5026669A (en) * 1986-10-13 1991-06-25 Mitsubishi Denki Kabushiki Kaisha Method of eliminating burrs on a lead frame with a thin metal coating
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device

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