JPS532078A - Sealing structure for semiconductor device - Google Patents

Sealing structure for semiconductor device

Info

Publication number
JPS532078A
JPS532078A JP7621376A JP7621376A JPS532078A JP S532078 A JPS532078 A JP S532078A JP 7621376 A JP7621376 A JP 7621376A JP 7621376 A JP7621376 A JP 7621376A JP S532078 A JPS532078 A JP S532078A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing structure
barrage
forming
carry out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7621376A
Other languages
Japanese (ja)
Inventor
Kazuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP7621376A priority Critical patent/JPS532078A/en
Priority to US05/808,216 priority patent/US4143456A/en
Priority to GB26291/77A priority patent/GB1581587A/en
Publication of JPS532078A publication Critical patent/JPS532078A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To carry out resin mold by forming a flow prevention barrage with a volatile insulating material.
COPYRIGHT: (C)1978,JPO&Japio
JP7621376A 1976-06-28 1976-06-28 Sealing structure for semiconductor device Pending JPS532078A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7621376A JPS532078A (en) 1976-06-28 1976-06-28 Sealing structure for semiconductor device
US05/808,216 US4143456A (en) 1976-06-28 1977-06-20 Semiconductor device insulation method
GB26291/77A GB1581587A (en) 1976-06-28 1977-06-23 Semi-conductor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7621376A JPS532078A (en) 1976-06-28 1976-06-28 Sealing structure for semiconductor device

Publications (1)

Publication Number Publication Date
JPS532078A true JPS532078A (en) 1978-01-10

Family

ID=13598886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7621376A Pending JPS532078A (en) 1976-06-28 1976-06-28 Sealing structure for semiconductor device

Country Status (1)

Country Link
JP (1) JPS532078A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514785U (en) * 1978-07-18 1980-01-30
JPS5541780A (en) * 1978-09-19 1980-03-24 Seiko Epson Corp Tape carrying tape
JPS5919362A (en) * 1982-07-23 1984-01-31 Seikosha Co Ltd Coating method for resin on electronic parts
JPS61292328A (en) * 1986-05-21 1986-12-23 Hitachi Ltd Manufacture of semiconductor sealing structure
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
JP2012015318A (en) * 2010-06-30 2012-01-19 Sharp Corp Light emitting device and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943873U (en) * 1972-07-20 1974-04-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943873U (en) * 1972-07-20 1974-04-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514785U (en) * 1978-07-18 1980-01-30
JPS584189Y2 (en) * 1978-07-18 1983-01-24 シチズン時計株式会社 IC sealing structure
JPS5541780A (en) * 1978-09-19 1980-03-24 Seiko Epson Corp Tape carrying tape
JPS6054788B2 (en) * 1978-09-19 1985-12-02 セイコーエプソン株式会社 Tape for tape carrier
JPS5919362A (en) * 1982-07-23 1984-01-31 Seikosha Co Ltd Coating method for resin on electronic parts
JPS61292328A (en) * 1986-05-21 1986-12-23 Hitachi Ltd Manufacture of semiconductor sealing structure
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
JP2012015318A (en) * 2010-06-30 2012-01-19 Sharp Corp Light emitting device and method of manufacturing the same

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