JP2012015318A - Light emitting device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting device that can suppress dispersion of the thickness of a resin layer and also prevent occurrence of unevenness in light brightness, chromaticity, etc. when dispersion of the coating amount of resin material for sealing a light emitting element occurs.SOLUTION: A light emitting device manufacturing method has an oil repellent pattern forming step of forming an oil repellent pattern 2, and a mold resin coating step of dropping and coating mold resin material 15 into an area surrounded by the oil repellent pattern 2 on an interposer wiring substrate 1. When the width of the oil repellent pattern 2 is represented by W, the coating amount of the mold resin material 15 in the mold resin coating step is represented by V and the dispersion of the coating amount is represented by ΔV, W and V are set so that the mold resin material 15 runs on the oil repellent pattern 2 when the actual coating amount of the mold resin material 15 is equal to V-ΔV, and the mold resin material 15 does not spread to the outside of the oil repellent pattern 2 when the actual coating amount of the mold resin material 15 is equal to V+ΔV.

Description

  The present invention relates to a method for manufacturing a light emitting device in which a light emitting element is sealed with a resin layer, and a light emitting device manufactured thereby.

  In recent years, LEDs have been used for backlights and lighting for display devices such as liquid crystal televisions.

  Many of the LEDs used for these are LEDs that emit white light (white LEDs). There are mainly two types of methods for realizing a white LED. One is a method using an LED chip and a phosphor, and the other is a method using red, green and blue LED elements. At present, the former method is mainly used because the cost of the latter LED element is high.

  As a method of using the LED chip and the phosphor, there are a method of combining a blue LED element and a yellow phosphor, a method of combining a blue LED element and red and green phosphors in order to improve color rendering. According to this method, since the phosphor converts blue light into yellow light, part of the blue light emitted by the blue LED is transmitted through the phosphor layer, while the remaining blue light strikes the phosphor to produce yellow light. become. Therefore, the concrete mechanism is that these two colors are mixed and appear white.

  As a method for applying a resin in which a phosphor is mixed on an LED element, Patent Document 1 discloses that a first recess and a second recess surrounding the first recess are formed on a wiring pattern on a substrate. Forming by forming a resist film, mounting the light emitting element in the first recess, dropping the resin into the first recess on the substrate, so that the resin contacts the second recess or the protrusion, A method for manufacturing a light emitting device is described in which the light emitting element is covered in a mountain shape.

  In Patent Document 2, a flat substrate, a light emitting chip attached to one side of the substrate, a mold resin cured around the light emitting chip and mixed with a wavelength conversion material, and provided around the mold resin A light emitter composed of a translucent resin is described. In addition, the first oil-repellent film is arranged in an annular shape on one side surface of the substrate near the light-emitting chip, and the second oil-repellent film is formed in an annular shape at a position farther from the light-emitting chip than the position of the first oil-repellent film. The configuration is described in which the cross section of the mold resin is formed in a semicircular shape by the first oil repellent film, and the cross section of the translucent resin is formed in a semicircular shape by the second oil repellent film.

  Patent Document 3 discloses a light emitting device in which a white resist layer covers one surface so as to leave an opening at and near a mounting position of a light emitting element chip connected to at least one surface of a mounting substrate. Is described. The light emitting element chip and the opening are sealed with a hemispherical transparent sealing resin, and the shape of the transparent sealing resin is transparently sealed with a water repellent material layer deposited on a white resist layer. It is described that the outer edge of the resin is controlled by being retracted. Further, it is described that the water repellent material layer is disposed in a band shape sandwiched between two concentric circles centering on the position of the light emitting element chip.

  Patent Document 4 describes an illuminating device including a light emitting diode placed on a substrate and a first optical resin formed in a dome shape covering the light emitting diode. Moreover, it is described that this 1st optical resin may be formed by potting inside the water repellent material apply | coated on the board | substrate so that a closed curve may be drawn continuously.

Japanese Patent Laid-Open No. 7-231120 (released on August 29, 1995) Japanese Unexamined Patent Publication No. 2004-87812 (published on March 18, 2004) JP 2008-258296 A (released on October 23, 2008) JP 2010-114406 A (published on May 20, 2010)

  However, in the method described in Patent Document 1, the inner wall or the convex portion of the second concave portion dams the resin when applying the resin mixed with the phosphor, and exerts a force in the direction in which the resin spreads radially. Let it be suppressed. Therefore, the area of the region where the resin is applied is constant. Therefore, when a variation occurs in the amount of resin applied, a variation in the thickness of the formed resin layer occurs. Therefore, since the distance from the LED element to the resin layer surface varies greatly, it causes unevenness in light brightness, chromaticity, and the like. In addition, there is no description about how to deal with variations in the amount of resin applied.

  Further, in the method described in Patent Document 2, since the mold resin is prevented from spreading by the first oil-repellent film, when there is a variation in the application amount of the mold resin, the surface of the mold resin layer is changed from the light emitting chip. The distance to the distance varies greatly, which causes unevenness of light brightness, chromaticity, and the like. Further, there is no description about how to deal with variations in the amount of mold resin applied.

  In Patent Documents 3 and 4, the width size of the water repellent material layer is not specified. Therefore, the applied transparent sealing resin may not remain on the water-repellent material layer depending on the application amount of the transparent sealing resin and its variation. For example, when the coating amount is large or when the coating amount varies and increases, there is a possibility that the transparent sealing resin protrudes outside the water repellent material layer. In addition, when the coating amount is small, or when the coating amount varies and decreases, the transparent sealing resin does not reach the water repellent material layer, or even if it reaches, the coating amount varies greatly. There may be variations in the thickness of the transparent sealing resin. When the thickness of the anti-transparent resin varies, the distance from the LED chip to the surface of the transparent sealing resin varies. Since Patent Documents 3 and 4 do not describe any method for dealing with variations in the amount of transparent sealing resin applied, there is a problem that the luminance, chromaticity, etc. of light from the light emitting device deteriorates. Arise.

  The present invention has been made in view of the above-described problems of the prior art. The purpose of the present invention is to vary the thickness of the resin layer when variations occur in the amount of resin material applied to seal the light emitting element. It is an object of the present invention to provide a method for manufacturing a light emitting device that can suppress the occurrence of unevenness in the brightness and chromaticity of light, and a light emitting device manufactured thereby.

  In order to solve the above problems, a method for manufacturing a light-emitting device according to the present invention includes a substrate, a light-emitting element provided on the substrate, and a resin layer that seals the light-emitting element. An oil repellent pattern forming step of forming a band-shaped oil repellent pattern surrounding the light emitting element on the substrate, and a resin material for forming the resin layer on the substrate. A resin coating step in which the coating is dropped into a region surrounded by the resin, the width of the oil repellent pattern is W, the coating amount of the resin material in the resin coating step is V, and the variation in the coating amount Where V is ΔV, W and V are the actual application amount of the resin material when the resin material rides on the oil-repellent pattern when the actual application amount of the resin material is V−ΔV. Resin material when is V + ΔV Characterized in that it is set not spread outside the aforementioned oil-repellent pattern.

  With the above configuration, in the resin coating process, when the variation in the coating amount of the resin material is large, the resin material can be run on the oil-repellent pattern and not spread outside the oil-repellent pattern. can do. That is, the resin material can be kept on the oil-repellent pattern.

  Therefore, when the coating amount increases due to variations, there is room for the resin material to spread on the oil-repellent pattern, so that variations in the distance between the light emitting element and the surface of the formed resin layer can be suppressed. Further, when the resin layer includes a wavelength conversion member, it is possible to suppress the distribution change of the wavelength conversion member. Therefore, since the variation in the thickness of the resin layer and the change in the distribution of the wavelength conversion member can be suppressed, the occurrence of unevenness in the brightness, chromaticity, etc. of the light can be prevented. Furthermore, since the shape of the resin layer can be stabilized, it is possible to prevent a decrease in production yield of the light emitting device.

  In the method for manufacturing a light-emitting device according to the present invention, W and V are the first when the actual application amount of the resin material is V−ΔV, and the resin material rides on the oil-repellent pattern, and the resin It is preferable that the resin material is set so as to spread outward from the oil-repellent pattern only when the actual application amount of the material exceeds V + ΔV.

  With the above configuration, the width of the oil repellent pattern can be minimized. Therefore, after the resin layer is formed, the oil repellent pattern does not protrude greatly on the outside. Therefore, when performing the lens formation process which forms a lens on a resin layer after that, a lens can be stuck on a substrate with high adhesion. Therefore, it is possible to prevent problems such as lens peeling in a process performed later.

  In addition, because of the high adhesion between the lens and the substrate, the manufactured light-emitting device has high resistance to external stress, moisture penetration, etc., so that it can prevent a decrease in reliability and stably perform subsequent steps. Can be performed.

  In the method for manufacturing a light emitting device according to the present invention, the oil repellent pattern is preferably annular.

  If it is said structure, since the resin material dripped in the resin application | coating process will spread in a substantially concentric form from the dripped position, when dripping the resin material to the center of the area | region surrounded by the oil-repellent pattern, The oil repellent pattern can be evenly reached. In addition, since the oil repellent pattern that protrudes outside the resin layer can be reduced, the adhesion between the lens and the substrate can be improved when the lens forming step is subsequently performed.

  The method for manufacturing a light emitting device according to the present invention includes a resin curing step of curing the resin material applied in the resin application step, wherein the oil repellent pattern has an inner diameter D1 and the oil repellent pattern. The contact diameter of the substrate with respect to the resin material at the temperature used in the resin application step is θ1, and the contact angle of the oil repellent pattern with respect to the resin material at the temperature used in the resin application step is θ2. Assuming that the contact angle of the oil-repellent pattern with respect to the resin material at the temperature used in the resin curing step is θ3, W and V may be set to satisfy the following expressions (1) to (5). preferable.

  If it is said structure, in a resin hardening process, when the contact angle with respect to the resin material in an oil repellent pattern becomes small and a resin material spreads outside, a resin material can be kept on an oil repellent pattern. For example, it is effective when raising the temperature in the resin curing step. Therefore, the shape of the resin layer can be stabilized.

The method for manufacturing a light emitting device according to the present invention includes a resin curing step of curing the resin material applied in the resin application step, wherein the oil repellent pattern has an inner diameter D1 and the oil repellent pattern. The outer diameter of the resin material is D2, the diameter of the resin material in the resin curing step when the actual application amount of the resin material is V + ΔV is Dmax, and the actual application amount of the resin material is V−ΔV. When the diameter of the resin material in the resin curing step is Dmin, W and V are preferably set so as to satisfy the following formulas (1) and (6) to (8).
W = (D2-D1) / 2 (1)
D1 ≦ Dmin (6)
D2 ≧ Dmax (7)
W ≧ (Dmax−Dmin) / 2 (8)
If it is said structure, since the wetting spread of the resin material can be stopped on an oil-repellent pattern in a resin hardening process, the shape of a resin layer can be stabilized.

In the method for manufacturing a light-emitting device according to the present invention, V represents a contact angle θ4 of the substrate with respect to the resin material when the resin material is applied at V in the resin application step. ) Is preferably set to satisfy.
θ1 ≦ θ4 ≦ θ2 (9)
With the above-described configuration, the resin amount V of the resin material in the resin application step is the contact angle θ4 (θ1 ≦ θ4 ≦ θ2) with respect to the oil-repellent pattern in which the resin material can be applied until the contact angle θ2 is reached. ). Therefore, compared to the case where the resin amount V is set so as to be the contact angle θ2, it is possible to prevent overflow of the resin material due to shaking or the like when the substrate is transported after the resin coating process is completed.

  In order to solve the above-described problems, the light-emitting device according to the present invention is manufactured by any one of the manufacturing methods described above.

  With the above structure, a light-emitting device with less unevenness in light brightness, chromaticity, and the like can be provided.

  As described above, the method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device including a substrate, a light emitting element provided on the substrate, and a resin layer that seals the light emitting element. An oil repellent pattern forming step for forming a band-shaped oil repellent pattern surrounding the light emitting element on the substrate, and a resin material for forming the resin layer surrounded by the oil repellent pattern on the substrate Including a resin application step of dropping and applying in the region, the width of the oil-repellent pattern is W, the application amount of the resin material in the resin application step is V, and the variation in the application amount is ΔV When W and V are the actual application amount of the resin material is V−ΔV, the resin material rides on the oil-repellent pattern, and the actual application amount of the resin material is V + ΔV. The resin material is the oil repellent pattern. Therefore, when the coating amount of the resin material that seals the light emitting element varies, the variation in the thickness of the resin layer can be suppressed. It is possible to prevent the occurrence of unevenness in the degree.

(A)-(b) is a figure which shows the structure of the LED package manufactured by the manufacturing method which concerns on one Embodiment of this invention, (a) of FIG. 1 is sectional drawing of an LED package, FIG. (B) is a plan view of the LED package. (A)-(g) is a figure for demonstrating the manufacturing method of the LED package which concerns on one Embodiment of this invention. It is a figure which shows the example of the contact angle with respect to the mold resin material of the interposer wiring board and oil-repellent pattern in one Embodiment of this invention. It is a schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on this invention. (A)-(d) is a figure for demonstrating an example of the lens formation process in one Embodiment of this invention. (A)-(e) shows the top view for demonstrating the manufacturing method of the LED package which concerns on other embodiment of this invention. It is a graph which shows the film thickness of the mold resin layer of the LED package manufactured in one Example of this invention. It is a graph which shows the film thickness of the mold resin layer of the LED package manufactured in the comparative example of this invention. (A)-(b) is a figure which shows the example at the time of apply | coating a mold resin material by the conventional method.

<First Embodiment>
An embodiment of a method for manufacturing a light emitting device according to the present invention will be described in detail below.

  The LED package 10 manufactured by the method for manufacturing the LED package (light emitting device) 10 according to the present embodiment is arranged in a matrix on the interposer wiring substrate 1. The LED package 10 is a white LED package used for a backlight used in a display device such as a lighting fixture or a liquid crystal television, an edge light used as the backlight, or a surface light source of a direct type.

[LED package 10]
First, the configuration of the LED package 10 manufactured by the method for manufacturing the LED package 10 according to the present embodiment will be described with reference to FIGS. FIGS. 1A to 1B are views showing a configuration of an LED package manufactured by a manufacturing method according to an embodiment of the present invention, and FIG. 1A is a cross-sectional view of the LED package. FIG. 1B is a plan view of the LED package. The LED packages 10 are arranged in a matrix on the interposer wiring board 1, and one LED package 10 of the interposer wiring board 1 is arranged in FIGS. Only the part is shown.

  The LED package 10 includes an interposer wiring substrate (substrate) 1, an oil repellent pattern 2, an LED element (light emitting element) 3, a wire 4, a mold resin layer (resin layer) 5, and a lens 7. .

  The interposer wiring substrate 1 is a substrate in which a plurality of LED packages 10 are arranged in a matrix, and each LED package 10 includes a p-electrode 8 and an n-electrode 9.

  The interposer wiring board 1 is preferably a lipophilic board. Thereby, in the mold resin application process described later, the mold resin material (resin material) 15 can be efficiently spread substantially concentrically from the dropped position. As the interposer wiring substrate 1, for example, a ceramic substrate or the like can be used.

  The oil repellent pattern 2 is a pattern formed of an oil repellent material, and is a band-like shape sandwiched between an inner periphery 2 a and an outer periphery 2 b surrounding the LED element 3 and the mounting member including the wire 4 on the interposer wiring substrate 1. It is a pattern. The oil repellent pattern 2 is a pattern for suppressing the spread of the mold resin material 15 for forming the mold resin layer 5.

  The oil repellent pattern 2 preferably has a larger contact angle (liquid repellency) with respect to the mold resin material 15 than at least the surface of the interposer wiring substrate 1. This makes it easy to keep the mold resin material 15 from spreading so that the mold resin material 15 does not spread outward from the oil-repellent pattern 2 in the mold resin application step described later.

  In the present embodiment, the inner circumference 2a and the outer circumference 2b are two concentric circles that are parallel to the surface of the interposer wiring board 1 and have different diameters, as shown in FIG. 2 has an annular shape.

  The width of the oil-repellent pattern 2, that is, the distance between the inner periphery 2a and the outer periphery 2b is set to a predetermined length by a method described later. In the present embodiment, the distance between the inner periphery 2a and the outer periphery 2b is ½ of the difference between the diameter of the inner periphery 2a and the diameter of the outer periphery 2b.

  The inner circumference 2a and the outer circumference 2b are not limited to a circle as in the present embodiment, but may be a shape that can surround the LED element 3, for example, a polygon such as a quadrangle, but is preferably a circle. .

  That is, the shape of the oil repellent pattern 2 is preferably an annular shape. If the oil repellent pattern 2 is annular, the mold resin material 15 that spreads is repelled by dropping the mold resin material 15 onto the approximate center of the region surrounded by the oil repellent pattern 2 in a mold resin coating process described later. The oil pattern 2 can be evenly reached. The inner periphery and the outer periphery may have different shapes.

  The oil-repellent pattern 2 may be formed on the interposer wiring board 1 in a region excluding at least the region where the LED elements 3 and the wires 4 are provided and the peripheral portion of the LED package 10.

  As the oil repellent material used for the oil repellent pattern 2, for example, a known oil repellent coating agent or the like can be used, and specific examples include Marvell Coat (manufactured by Ryoko Chemical Co., Ltd., model number: RFH-05X). .

  The LED element 3 is a light emitting element provided in a region surrounded by the oil repellent pattern 2 on the interposer wiring substrate 1 for each LED package 10. The LED element 3 is preferably provided in the vicinity of the center of the region surrounded by the oil repellent pattern 2. As LED element 3, a blue LED element etc. are mentioned, for example.

  The wire 4 is one of mounting members for electrically and mechanically connecting the LED element 3 to the p-electrode 8 and the n-electrode 9 on the interposer wiring board 1.

  The mold resin layer 5 is a resin layer for sealing the LED element 3 and contains a phosphor (wavelength conversion member) 6 for converting the wavelength of light from the LED element 3. The mold resin layer 5 is formed by applying a mold resin material 15 including the phosphor 6 on the LED element 3. The mold resin layer 5 preferably covers at least a part of the oil repellent pattern 2.

  Examples of the mold resin constituting the mold resin material 15 include an epoxy resin, an acrylic resin, and a silicone resin. Examples of the silicone resin include silicone resins, epoxy silicone resins, and phenyl silicone resins.

  Examples of the phosphor 6 include a yellow phosphor, a red phosphor, and a green phosphor.

  The lens 7 has a substantially hemispherical shape and is formed on the mold resin layer 5.

  The LED package 10 can constitute an LED that emits white light, for example, by combining the blue LED element 3 and the mold resin layer 5 containing yellow, red, or green phosphors with the above-described configuration.

[Manufacturing Method of LED Package 10]
A method for manufacturing the LED package 10 according to the present embodiment will be described with reference to FIGS. FIGS. 2A to 2G are views for explaining a method for manufacturing an LED package according to an embodiment of the present invention.

  The manufacturing method of the LED package 10 includes an oil repellent pattern forming process, a die bonding process, a wire bonding process, a mold resin coating process (resin coating process), a phosphor sedimentation process, and a mold resin curing process (resin curing process). And a lens forming step. First, each process is demonstrated.

(1. Oil repellent pattern forming step)
In the oil repellent pattern forming step, as shown in FIG. 2A, the oil repellent pattern 2 is formed by applying an oil repellent material on the interposer wiring substrate 1 and forming a film. For example, the oil repellent pattern 2 may be formed by printing an oil repellent material on the interposer wiring substrate 1. Here, the oil repellent pattern 2 is formed so that the distance between the inner periphery 2a and the outer periphery 2b becomes a predetermined length set by a method described later.

(2. Die bonding process)
In the die bonding process, as shown in FIG. 2B, the LED element 3 is mechanically connected in a region surrounded by the oil-repellent pattern 2 on the interposer wiring substrate 1.

(3. Wire bonding process)
In the wire bonding step, as shown in FIG. 2C, the electrode of the LED element 3 die-bonded in the die bonding step and the electrode (p electrode 8 and n electrode 9) of the interposer wiring substrate 1 are electrically connected by the wire 4. Connect to.

(4. Mold resin application process (resin application process))
In the mold resin application step, as shown in FIG. 2D, the mold resin material 15 is dropped on the approximate center of the region surrounded by the oil-repellent pattern 2 on the interposer wiring substrate 1 so that the mold resin material 15 Application is performed by spreading the surface of the interposer wiring board 1 substantially concentrically from the position where it is dropped due to its own weight and fluidity. The spread mold resin material 15 reaches the inner periphery 2 a of the oil repellent pattern 2 and then rides on the oil repellent pattern 2. Further, the mold resin material 15 has a mountain shape due to its surface tension, and as a result, covers the LED element 3 and the wire 4.

  The mold resin material 15 can reach the inner periphery 2a of the oil-repellent pattern 2 evenly in any direction by being dropped at the approximate center of the region surrounded by the oil-repellent pattern 2.

  The mold resin material 15 preferably runs over at least the oil-repellent pattern 2 and does not spread outward from the oil-repellent pattern 2. That is, it is preferable that the mold resin material 15 extends outside the inner circumference 2a of the oil-repellent pattern 2 and further inside than the outer circumference 2b.

  The amount (application amount) for applying the mold resin material 15 is set to a predetermined amount by a method described later. Here, the “application amount of the mold resin material 15” is the amount of the mold resin material 15 set to be applied to one LED package 10 and may coincide with the amount actually applied. However, they do not have to match.

  The temperature used in the mold resin application step is preferably a temperature at which the mold resin material 15 is not cured, and may be room temperature, for example.

(5. Phosphor sedimentation step)
In the phosphor sedimentation step, the phosphor contained in the mold resin material 15 is sedimented as shown in FIG.

(6. Mold resin curing process (resin curing process))
In the mold resin curing step, as shown in FIG. 2 (f), the mold resin material 15 applied in the mold resin application step is cured to form the mold resin layer 5. For example, the mold resin material 15 can be cured by raising the temperature by heating or the like.

(7. Lens formation process)
In the lens forming step, the lens 7 is formed so as to cover the mold resin layer 5 as shown in FIG. The lens 7 includes the mold resin layer 5 and is formed in a range including a region on the interposer wiring substrate 1 outside the oil repellent pattern 2. For example, the lens 7 is a substantially hemispherical member, and may be formed by adhering the lens 7 on the mold resin layer 5, or the resin used as the material of the lens 7 is approximately hemispherical on the mold resin layer 5. You may form by making it shape | mold.

  An example of the lens forming process will be described with reference to FIGS. FIGS. 5A to 5D are views for explaining an example of a lens forming process in one embodiment of the present invention. Here, a method of molding the lens 7 with a mold will be described.

  First, as shown in FIG. 5A, first, the mold 101 is heated to a temperature for curing the resin 17 used for the lens 7. Next, as shown in FIG. 5B, the resin 17 is placed on the mold 101, adhered to the interposer wiring substrate 1 in which the mold resin layer 5 is formed on each LED package 10, and pressed. Further, as shown in FIG. 5 (c), heating and pressurization are continued as they are to cure the resin 17, and the lens 7 is formed as shown in FIG. 15 (d).

[Method for setting width W of oil repellent pattern 2 and coating amount V of mold resin material 15]
Next, a method for setting the width W of the oil repellent pattern 2 and the coating amount V of the mold resin material 15 will be described.

  The variation when the application amount of the mold resin material 15 applied in the resin application process is V is ΔV. At this time, W and V indicate that the mold resin material 15 runs on the oil-repellent pattern 2 when the actual application amount of the mold resin material 15 is the minimum application amount Vmin (ie, V−ΔV), and the mold When the actual coating amount of the resin material 15 is the maximum coating amount Vmax (that is, V + ΔV), the molding resin material 15 is set so as not to spread outside the outer periphery 2b of the oil-repellent pattern 2.

  The fact that the mold resin material 15 rides on the oil repellent pattern 2 means that the mold resin material 15 rides on the oil repellent pattern 2 in any direction. In the present embodiment, the inner circumference 2a is a circle, and the mold resin material 15 spreads concentrically. Therefore, when the mold resin material 15 is dropped on the approximate center of the inner circumference 2a, the inner circumference 2a is substantially in any direction. At the same time, it reaches the inner circumference 2a and rides up.

  W and V indicate that the mold resin material 15 runs on the oil-repellent pattern 2 for the first time when the actual application amount of the mold resin material 15 is V−ΔV, and the actual application amount of the mold resin material 15 is V + ΔV. It is preferable that the mold resin material 15 is set so as to spread outward from the outer periphery 2b of the oil-repellent pattern 2 for the first time when the value exceeds. Thereby, the distance between the inner periphery 2a and the outer periphery 2b can be minimized.

  Here, the variation (ΔV) in the application amount of the mold resin material 15 is the maximum value of the application amount error caused by an apparatus, an instrument, a method, or the like used for applying the mold resin material 15. It may vary depending on the instrument, method, etc. This variation can be obtained by measuring in advance. The variation may be represented by a difference between the set application amount and the actual application amount, or may be represented by a ratio (%) to the application amount.

  The “actual application amount of the mold resin material” is the amount of the mold resin material actually applied, and is a value obtained by adding or subtracting the generated error to the set application amount V.

When the diameter (inner diameter) of the inner periphery 2a of the oil repellent pattern 2 is D1, and the diameter (outer diameter) of the outer periphery 2b is D2, the width W of the oil repellent pattern 2 is expressed by the following formula (1).
W = (D2-D1) / 2 (1)
It is represented by That is, in this embodiment, W is automatically set by setting D1 and D2.

  D1 is set so that the mold resin material 15 rides on the oil-repellent pattern 2 when the actual application amount of the mold resin material 15 is V−ΔV in the mold resin application step. Moreover, it is preferable that D1 is set so that the mold resin material 15 runs on the oil-repellent pattern 2 only when the actual application amount of the mold resin material 15 is V−ΔV. Note that D1 is set so that at least the inner periphery 2a is outside the LED element 3 and the wire 4.

  D2 is set so that the mold resin material 15 does not spread outside the outer periphery 2b of the oil-repellent pattern 2 when the actual application amount of the mold resin material 15 is V + ΔV in the mold resin application step. Further, D2 is preferably set so that the mold resin material 15 spreads outside the outer periphery 2b of the oil-repellent pattern 2 for the first time only when the actual application amount of the mold resin material 15 exceeds V + ΔV.

  As a result, when the variation in the application amount of the mold resin material 15 is large, the mold resin material 15 can be run on the oil-repellent pattern 2 and should not flow out of the oil-repellent pattern 2. Can do. That is, the mold resin material 15 can be kept on the oil-repellent pattern 2.

  In addition, the contact angle of the interposer wiring substrate 1 with respect to the mold resin material 15 in the mold resin application step is θ1, and the contact angle of the oil repellent pattern 2 with respect to the mold resin material 15 in the mold resin application step is θ2, so that the repellent property in the mold resin curing step. The contact angle of the oil pattern 2 with respect to the mold resin material 15 is θ3. At this time, it is preferable that D1 and D2 are set so as to satisfy the following formulas (2) to (5).

  With the configuration described above, when the mold resin material 15 is one whose viscosity is lowered by increasing the temperature in the mold resin curing step, the oil repellent pattern 2 has a temperature depending on the type of the oil repellent material used for this. When the contact angle with respect to the mold resin material 15 is reduced by raising the value, the mold resin material 15 can be kept on the oil-repellent pattern 2.

  That is, when the temperature is raised in the mold resin curing step, when the contact angle with the mold resin material 15 in the oil repellent pattern 2 is reduced and the mold resin material 15 spreads further outward, the mold resin material 15 is made oil repellent. It can be kept on the pattern 2. That is, if the minimum application amount of the mold resin material 15 is V1 or more, the mold resin material 15 can be run on the oil-repellent pattern 2 at least in the mold resin curing step. Further, if the maximum application amount of the mold resin material 15 is V2 or less, the mold resin material 15 is placed on the oil-repellent pattern 2 when the mold resin material 15 further spreads due to the temperature rising in the mold resin curing step. You can keep it.

  Hereinafter, the temperature used in the mold resin application step is T1, and the reaction start temperature for curing the mold resin material 15 in the mold resin curing step is T2.

  Here, examples of contact angles of the interposer wiring substrate 1 and the oil repellent pattern 2 with respect to the mold resin material 15 are shown in FIGS. FIG. 3A shows an example of the contact angle θ1 of the interposer wiring board 1 with respect to the mold resin material 15 at T1. FIG. 3B is a diagram illustrating an example of the contact angle θ2 of the oil repellent pattern 2 with respect to the mold resin material 15 at T1. FIG. 3C is a diagram illustrating an example of the contact angle θ3 of the oil repellent pattern 2 with respect to the mold resin material 15 at T2.

  The contact angles θ1, θ2, and θ3 can be obtained by experimental measurement in advance at T1 and T2.

Further, when the actual application amount of the mold resin material 15 is Vmax, the mold resin material 15 in the mold resin curing step (for example, the contact angle with respect to the mold resin material 15 on the oil repellent pattern 2 is θ3) (after curing) For example, the diameter of the mold resin layer 5) on the interposer wiring board 1 on which the oil repellent pattern 2 is formed is Dmax. Further, when the actual application amount of the mold resin material 15 is Vmin, the interposer wiring on which the oil-repellent pattern 2 of the mold resin material 15 (mold resin layer 5 if cured) in the mold resin curing step is formed. The diameter on the substrate 1 is Dmin. At this time, it is preferable that D1 and D2 are set so as to satisfy the following formulas (6) to (8).
D1 ≦ Dmin (6)
D2 ≧ Dmax (7)
W ≧ (Dmax−Dmin) / 2 (8).

  If it is the structure mentioned above, the wetting spread of the mold resin material 15 can be stopped on the oil-repellent pattern 2 in the mold resin curing step.

Further, the application amount V of the mold resin material 15 is such that the contact angle θ4 of the interposer wiring board 1 with respect to the mold resin material 15 when the mold resin material 15 is applied at the application amount V in the mold resin application process is expressed by the following equation: It is preferable to set so as to satisfy (9).
θ1 ≦ θ4 ≦ θ2 (9).

  If it is the structure mentioned above, with respect to the oil-repellent pattern 2 which can apply | coat the mold resin material 15 until it becomes contact angle (theta) 2, the resin amount V of the mold resin material 15 in a resin application process is contact angle (theta) 4 ( θ1 ≦ θ4 ≦ θ2). Therefore, compared with the case where the resin amount V is set so as to be the contact angle θ2, it is possible to prevent the mold resin material from overflowing due to shaking or the like when transporting the substrate after completion of the mold resin application process.

  The effect of this embodiment obtained by the above configuration will be described with reference to FIG. FIG. 4 is a schematic view for explaining the method for manufacturing the light emitting device according to the present invention. In FIG. 4, the p electrode 8 and the n electrode 9 included in the interposer wiring substrate 1 are omitted.

  In the mold resin application process, for example, when the mold resin material 15 is applied using a dispenser or the like, the application amount of the mold resin material 15 may vary greatly. Here, in the conventional method, the mold resin material 15 does not reach the oil repellent pattern 2, or even if it reaches, it does not run on the oil repellent pattern 2 or spreads outside the oil repellent pattern 2. Produce. Moreover, when the area | region where the mold resin material 15 is apply | coated is constant, the dispersion | variation in the film thickness of the mold resin layer 5 will arise by the dispersion | variation in application amount.

  In the present embodiment, as described above, the width of the oil repellent pattern 2 and the coating amount of the mold resin material 15 are set. Therefore, the mold resin material 15 applied in the mold resin application process runs on the oil-repellent pattern 2 and does not spread outside the outer periphery 2b. That is, in the present embodiment, as shown in FIG. 4, the mold resin material 15 can be run on the oil-repellent pattern 2 and can be retained.

  Therefore, in the present embodiment, when the coating amount increases due to variation, there is room for the mold resin material 15 to spread on the oil-repellent pattern 2, so that the surface of the LED element 3 and the mold resin material 15 (after curing) For example, the variation in the distance d from the surface of the mold resin layer 5 can be suppressed. Further, when the coating amount changes due to variations, the influence on the distribution change of the phosphor 6 amount in the mold resin layer 5 can be reduced. Therefore, variation in the thickness of the formed mold resin layer 5 and change in distribution of the amount of the phosphor 6 can be suppressed, so that it is possible to prevent unevenness in light luminance, chromaticity, and the like.

  In this embodiment, since the mold resin material 15 runs on the oil repellent pattern 2 and does not spread outside the outer periphery 2b of the oil repellent pattern 2, the shape of the mold resin layer 5 can be stabilized. It becomes possible to prevent the production yield of the LED package 10 from being lowered.

  In addition, if the manufacturing method according to the present embodiment is used, the distance between the inner periphery 2a and the outer periphery 2b that can keep the mold resin material 15 from spreading can be minimized. 2 can be formed. Therefore, after the mold resin layer 5 is formed, the oil repellent pattern 2 does not protrude greatly outside. Therefore, in the lens forming step, a member used for the lens 7 is adhered to the interposer wiring board 1 with high strength, or a resin that is a material of the lens 7 is molded on the interposer wiring board 1 with high adhesion. Can do.

  Therefore, it is possible to prevent problems such as separation of the lens 7 in the step of packing the LED package 10 after the lens formation step, the step of modularizing the LED package 10, and the like. Further, the manufactured LED package 10 has high adhesion between the lens 7 and the interposer wiring substrate 1 and thus has high resistance to external stress, moisture penetration, etc., and thus can prevent deterioration in reliability and is stable. The subsequent steps can be performed.

<Second Embodiment>
Next, another embodiment of the present invention will be described with reference to FIGS. FIGS. 6A to 6E are plan views for explaining a method for manufacturing an LED package according to another embodiment of the present invention, and particularly show a process in a mold resin coating process.

  As shown in FIGS. 6A to 6E, the LED package 20 manufactured by the manufacturing method according to the present embodiment has an oil-repellent pattern 22 having a quadrangular shape, and has two squares with different sizes. The difference from the first embodiment is that the pattern is a belt-like pattern sandwiched between the circumference 22a and the circumference 22b. Other points are the same as in the first embodiment. For convenience of explanation, the same number is attached | subjected to the component which has the same function as the component concerning 1st Embodiment, and the description is abbreviate | omitted. In the present embodiment, differences from the first embodiment will be mainly described.

  In the LED package 20, the LED elements (not shown) are provided in a region surrounded by the oil repellent pattern 22 on the interposer wiring substrate 1.

  In the molding resin application step in the manufacturing method of the present embodiment, first, as shown in FIG. 6A, the molding resin material 15 is dropped at the center of the region surrounded by the oil repellent pattern 22. The mold resin material 15 spreads substantially concentrically on the surface of the interposer wiring board 1 from the dropped position, and as shown in FIG. 6 (b), the four sides constituting the inner periphery 22a of the oil repellent pattern 22 are formed. Reach the center respectively. Thereafter, as shown in FIG. 6C, the mold resin material 15 reaches the four corners of the region surrounded by the oil repellent pattern 22, that is, reaches the entire inner periphery 22 a of the oil repellent pattern 22.

  When the mold resin material 15 is further applied, as shown in FIG. 6D, the mold resin material 15 rides on the oil-repellent pattern 22 from substantially the center of the four sides constituting the inner periphery 22 a of the oil-repellent pattern 22. Thereafter, the mold resin material 15 further spreads in a substantially concentric shape and reaches four sides constituting the outer periphery 22 b of the oil repellent pattern 22.

  In the present embodiment, the width of the oil repellent pattern 22, that is, the distance W between the inner periphery 22a and the outer periphery 22b is ½ of the difference between the length of one side of the inner periphery 22a and the length of one side of the outer periphery 22b.

  Here, it is assumed that the application amount of the mold resin material 15 in the mold resin application step is V, and the application amount variation ΔV of the mold resin material 15 is V. W and V indicate that the mold resin material 15 runs on the oil-repellent pattern 22 when the actual application amount of the mold resin material 15 is the minimum application amount Vmin (ie, V−ΔV), and the mold resin material 15 When the actual coating amount is the maximum coating amount Vmax (that is, V + ΔV), the molding resin material 15 is set so as not to spread outside the outer periphery 22b of the oil repellent pattern 22.

  W and V indicate that the mold resin material 15 runs on the oil-repellent pattern 22 for the first time when the actual application amount of the mold resin material 15 is V−ΔV, and the actual application amount of the mold resin material 15 is V + ΔV. It is preferable that the molding resin material 15 is set so as to spread outward from the outer periphery 22b of the oil-repellent pattern 22 for the first time only when the value exceeds. Thereby, the distance between the inner periphery 22a and the outer periphery 22b can be minimized.

  That is, in the manufacturing method according to the present embodiment, when the actual application amount of the mold resin material 15 is Vmin in the mold resin application step, it is preferable to be (d) in FIG. When the coating amount is Vmax, it is preferable to become (e) in FIG.

  Here, in the case of the conventional method, since W is not set as described above, when the actual application amount of the mold resin material 15 varies, the inner periphery 22a of the oil repellent pattern 22 is not reached. Even if it reaches, it does not ride on the oil-repellent pattern 22 or spreads outward from the outer periphery 22b. (A)-(b) of Drawing 9 is a figure showing an example at the time of applying a mold resin material by a conventional method. In the conventional method, when the actual application amount of the mold resin material 15 varies and increases, the mold resin material 15 is placed outside the oil-repellent pattern 22 as shown in FIGS. It will flow out.

  However, according to the present embodiment, when there is a large variation in the amount of application of the mold resin material 15, the mold resin material 15 can run on the oil-repellent pattern 22 and does not flow out of the outer periphery 22b. Can be. That is, the mold resin material 15 can be kept on the oil-repellent pattern 22.

  In the present embodiment, when the actual application amount of the mold resin material 15 is Vmax, the mold resin material 15 does not reach the outer four corners of the oil-repellent pattern 22. Therefore, as compared with the first embodiment, the oil-repellent pattern 22 protrudes greatly outside the mold resin layer 5, and the adhesion between the lens 7 and the interposer wiring substrate 1 when the lens 7 is formed in the subsequent lens forming process. May decrease. Therefore, the shape of the oil-repellent pattern formed by the present invention is preferably an annular shape as in the first embodiment.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

[Example 1]
An embodiment of the present invention will be described. In this example, an LED package having the same configuration as the LED package 10 shown in FIGS. 1A to 1B was produced by the manufacturing method according to the first embodiment, and the film thickness of the mold resin layer 5 was measured. . In addition, the application quantity of the mold resin material in a mold resin application | coating process was set to 0.728 microliters using the setting method described in 1st Embodiment. That is, the mold resin material was set so that wetting and spreading of the resin material remained on the oil-repellent pattern 2. The variation in the coating amount was ± 5%.

  The result is shown in FIG. FIG. 7 is a graph showing the film thickness of the mold resin layer of the LED package manufactured in one example of the present invention.

  In this example, since the mold resin material runs on the oil-repellent pattern 2, the diameter (φ) of the mold resin layer 5 changed when the application amount changed due to the variation in the application amount of the mold resin material. At this time, the variation in the height (film thickness) of the mold resin layer 5 was ± 1.9%.

[Comparative Example 1]
A comparative example of the present invention will be described. In this comparative example, the application amount of the mold resin material in the mold resin application process is 0.639 μL, which is the amount that the mold resin material reaches the inner periphery of the oil repellent pattern 2 but does not run on the oil repellent pattern 2. Set. The variation in the coating amount was ± 5%.

  The result is shown in FIG. FIG. 8 is a graph showing the film thickness of the mold resin layer of the LED package manufactured in the comparative example of the present invention.

  In this comparative example, when the coating amount changed due to the variation in the coating amount of the mold resin material, the diameter (φ) of the mold resin layer 5 was constant. On the other hand, the variation in the height (film thickness) of the mold resin layer 5 is ± 4.8%, which indicates that the variation is larger than that in Example 1.

〔Comparison result〕
From the above results, it was shown that the variation in the thickness of the resin layer can be suppressed according to the present invention.

  Since the present invention can prevent unevenness in the luminance, chromaticity, etc. of light, it can be suitably used for backlights used in display devices such as lighting fixtures and liquid crystal televisions.

1 Interposer wiring board (board)
2 Oil repellent pattern 2a Inner circumference 2b Outer circumference 3 LED element (light emitting element)
5 Mold resin layer (resin layer)
6 Phosphor (wavelength conversion member)
10 LED package (light emitting device)
15 Mold resin material (resin material)
20 LED package 22 Oil repellent pattern 22a Inner circumference 22b Outer circumference

Claims (7)

A method for manufacturing a light emitting device comprising a substrate, a light emitting element provided on the substrate, and a resin layer for sealing the light emitting element,
An oil repellent pattern forming step of forming a band-shaped oil repellent pattern surrounding the light emitting element on the substrate;
Including a resin coating step of dropping and applying a resin material for forming the resin layer in a region surrounded by the oil-repellent pattern on the substrate,
When the width of the oil repellent pattern is W, the application amount of the resin material in the resin application step is V, and the variation in the application amount is ΔV, W and V are the actual application amounts of the resin material. In the case of V−ΔV, the resin material runs on the oil repellent pattern, and when the actual application amount of the resin material is V + ΔV, the resin material does not spread outward from the oil repellent pattern. A method for manufacturing a light-emitting device, characterized by being set.   W and V are obtained when the resin material runs on the oil-repellent pattern for the first time when the actual application amount of the resin material is V−ΔV, and the actual application amount of the resin material exceeds V + ΔV. The method for manufacturing a light-emitting device according to claim 1, wherein the resin material is set for the first time so as to spread outward from the oil-repellent pattern.   The method for manufacturing a light emitting device according to claim 1, wherein the oil repellent pattern has an annular shape. Including a resin curing step of curing the resin material applied in the resin application step,
The inner diameter of the oil-repellent pattern is D1, the outer diameter of the oil-repellent pattern is D2, and the contact angle of the substrate with the resin material at the temperature used in the resin application step is θ1, and the resin application step When the contact angle of the oil-repellent pattern with respect to the resin material at the temperature used in the above is θ2, and the contact angle of the oil-repellent pattern with respect to the resin material at the temperature used in the resin curing step is θ3, W and V 4. The method for manufacturing a light emitting device according to claim 3, wherein the method is set so as to satisfy (1) to (5).

Including a resin curing step of curing the resin material applied in the resin application step,
The diameter of the inner periphery of the oil repellent pattern is D1, the diameter of the outer periphery of the oil repellent pattern is D2, and the diameter of the resin material in the resin curing step when the actual application amount of the resin material is V + ΔV is Dmax. Assuming that the diameter of the resin material in the resin curing step when the actual application amount of the resin material is V−ΔV is Dmin, W and V are the following formulas (1) and (6) to (8): The method of manufacturing a light emitting device according to claim 3, wherein the light emitting device is set so as to satisfy the following.
W = (D2-D1) / 2 (1)
D1 ≦ Dmin (6)
D2 ≧ Dmax (7)
W ≧ (Dmax−Dmin) / 2 (8) V is characterized in that the contact angle θ4 of the substrate with respect to the resin material when the resin material is applied at V in the resin application step is set so as to satisfy the following formula (9). The manufacturing method of the light-emitting device of Claim 4.
θ1 ≦ θ4 ≦ θ2 (9)   A light emitting device manufactured by the manufacturing method according to claim 1.

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