JPS52150970A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS52150970A
JPS52150970A JP6767276A JP6767276A JPS52150970A JP S52150970 A JPS52150970 A JP S52150970A JP 6767276 A JP6767276 A JP 6767276A JP 6767276 A JP6767276 A JP 6767276A JP S52150970 A JPS52150970 A JP S52150970A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
resin molded
molded type
composing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6767276A
Other languages
Japanese (ja)
Inventor
Osamu Yugawa
Susumu Okikawa
Atsushi Sasayama
Noboru Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6767276A priority Critical patent/JPS52150970A/en
Publication of JPS52150970A publication Critical patent/JPS52150970A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the occurrence of cracking in pellets by composing tabs with a low thermal expansion material and composing each lead with a good thermal conductivity material.
COPYRIGHT: (C)1977,JPO&Japio
JP6767276A 1976-06-11 1976-06-11 Resin molded type semiconductor device Pending JPS52150970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6767276A JPS52150970A (en) 1976-06-11 1976-06-11 Resin molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6767276A JPS52150970A (en) 1976-06-11 1976-06-11 Resin molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS52150970A true JPS52150970A (en) 1977-12-15

Family

ID=13351712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6767276A Pending JPS52150970A (en) 1976-06-11 1976-06-11 Resin molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS52150970A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200087200A (en) 2017-12-27 2020-07-20 미쓰비시덴키 가부시키가이샤 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200087200A (en) 2017-12-27 2020-07-20 미쓰비시덴키 가부시키가이샤 Semiconductor device

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