JPS5332674A - Sealing structure of semiconductor device and its production - Google Patents

Sealing structure of semiconductor device and its production

Info

Publication number
JPS5332674A
JPS5332674A JP10706276A JP10706276A JPS5332674A JP S5332674 A JPS5332674 A JP S5332674A JP 10706276 A JP10706276 A JP 10706276A JP 10706276 A JP10706276 A JP 10706276A JP S5332674 A JPS5332674 A JP S5332674A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
sealing structure
restriction
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10706276A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP10706276A priority Critical patent/JPS5332674A/en
Publication of JPS5332674A publication Critical patent/JPS5332674A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve the restriction in height owing to resin amount, increase process ability and make a device of high reliability by providing two holes on the top of a sealing case.
COPYRIGHT: (C)1978,JPO&Japio
JP10706276A 1976-09-07 1976-09-07 Sealing structure of semiconductor device and its production Pending JPS5332674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10706276A JPS5332674A (en) 1976-09-07 1976-09-07 Sealing structure of semiconductor device and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10706276A JPS5332674A (en) 1976-09-07 1976-09-07 Sealing structure of semiconductor device and its production

Publications (1)

Publication Number Publication Date
JPS5332674A true JPS5332674A (en) 1978-03-28

Family

ID=14449517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10706276A Pending JPS5332674A (en) 1976-09-07 1976-09-07 Sealing structure of semiconductor device and its production

Country Status (1)

Country Link
JP (1) JPS5332674A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54169464U (en) * 1978-05-19 1979-11-30
JP2002012801A (en) * 2000-06-30 2002-01-15 Toppan Forms Co Ltd Electron beam curing ink for ink-jet printing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54169464U (en) * 1978-05-19 1979-11-30
JP2002012801A (en) * 2000-06-30 2002-01-15 Toppan Forms Co Ltd Electron beam curing ink for ink-jet printing

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