JPS526082A - Production method of resin-seal type semiconductor device - Google Patents

Production method of resin-seal type semiconductor device

Info

Publication number
JPS526082A
JPS526082A JP8215075A JP8215075A JPS526082A JP S526082 A JPS526082 A JP S526082A JP 8215075 A JP8215075 A JP 8215075A JP 8215075 A JP8215075 A JP 8215075A JP S526082 A JPS526082 A JP S526082A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
production method
type semiconductor
seal type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8215075A
Other languages
Japanese (ja)
Other versions
JPS5534579B2 (en
Inventor
Yasuhiko Sato
Akitoshi Komiya
Goro Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
NEC Home Electronics Ltd
NEC Corp
Original Assignee
Shin Etsu Chemical Co Ltd
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP8215075A priority Critical patent/JPS526082A/en
Publication of JPS526082A publication Critical patent/JPS526082A/en
Publication of JPS5534579B2 publication Critical patent/JPS5534579B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: In order to improve the pyrogenetic inverse-bias characteristics through immersing and processing a semiconductor device being sealed with resin, and extracting the impurities inside the resinseal existing around the surface of a semiconductor element.
COPYRIGHT: (C)1977,JPO&Japio
JP8215075A 1975-07-03 1975-07-03 Production method of resin-seal type semiconductor device Granted JPS526082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8215075A JPS526082A (en) 1975-07-03 1975-07-03 Production method of resin-seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8215075A JPS526082A (en) 1975-07-03 1975-07-03 Production method of resin-seal type semiconductor device

Publications (2)

Publication Number Publication Date
JPS526082A true JPS526082A (en) 1977-01-18
JPS5534579B2 JPS5534579B2 (en) 1980-09-08

Family

ID=13766400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8215075A Granted JPS526082A (en) 1975-07-03 1975-07-03 Production method of resin-seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS526082A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461865A (en) * 1981-08-31 1984-07-24 Denki Kagaku Kogyo Kabushiki Kaisha ABS Resin composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826075A (en) * 1971-08-04 1973-04-05
JPS5075694A (en) * 1973-11-07 1975-06-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826075A (en) * 1971-08-04 1973-04-05
JPS5075694A (en) * 1973-11-07 1975-06-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461865A (en) * 1981-08-31 1984-07-24 Denki Kagaku Kogyo Kabushiki Kaisha ABS Resin composition

Also Published As

Publication number Publication date
JPS5534579B2 (en) 1980-09-08

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