JPS5210674A - Manufacturing method of semi-conductor device - Google Patents

Manufacturing method of semi-conductor device

Info

Publication number
JPS5210674A
JPS5210674A JP50087759A JP8775975A JPS5210674A JP S5210674 A JPS5210674 A JP S5210674A JP 50087759 A JP50087759 A JP 50087759A JP 8775975 A JP8775975 A JP 8775975A JP S5210674 A JPS5210674 A JP S5210674A
Authority
JP
Japan
Prior art keywords
semi
conductor device
manufacturing
pellet
pay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50087759A
Other languages
Japanese (ja)
Other versions
JPS5845820B2 (en
Inventor
Isamu Kitahiro
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50087759A priority Critical patent/JPS5845820B2/en
Publication of JPS5210674A publication Critical patent/JPS5210674A/en
Publication of JPS5845820B2 publication Critical patent/JPS5845820B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: By embedding the beam-lead in the buried material after the separation of the pellet, one can easily manufacture a semi-conductor device without pay ing attention to electrode location, etc., in design.
COPYRIGHT: (C)1977,JPO&Japio
JP50087759A 1975-07-16 1975-07-16 hand tai souchi no seizou houhou Expired JPS5845820B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50087759A JPS5845820B2 (en) 1975-07-16 1975-07-16 hand tai souchi no seizou houhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50087759A JPS5845820B2 (en) 1975-07-16 1975-07-16 hand tai souchi no seizou houhou

Publications (2)

Publication Number Publication Date
JPS5210674A true JPS5210674A (en) 1977-01-27
JPS5845820B2 JPS5845820B2 (en) 1983-10-12

Family

ID=13923863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50087759A Expired JPS5845820B2 (en) 1975-07-16 1975-07-16 hand tai souchi no seizou houhou

Country Status (1)

Country Link
JP (1) JPS5845820B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450043U (en) * 1977-09-16 1979-04-06

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141417U (en) * 1985-02-25 1986-09-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860575A (en) * 1971-11-29 1973-08-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860575A (en) * 1971-11-29 1973-08-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450043U (en) * 1977-09-16 1979-04-06

Also Published As

Publication number Publication date
JPS5845820B2 (en) 1983-10-12

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS522277A (en) Soldering device
JPS5210674A (en) Manufacturing method of semi-conductor device
JPS5255871A (en) Production of semiconductor
JPS5324290A (en) Semiconductor device
JPS5261960A (en) Production of semiconductor device
JPS5274280A (en) Semiconductor device and its production
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5249781A (en) Process for production of semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS51112292A (en) Semiconductor device
JPS5361980A (en) Production of semiconductor device
JPS528787A (en) Semiconductor device process
JPS52179A (en) Method of fabricating semiconductor
JPS51132968A (en) Semiconductor device
JPS5210084A (en) Dual directional negative resistance semiconductor device
JPS51123071A (en) Fabrication technique of semiconductor device
JPS51147968A (en) Method of manufacturing semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS51151089A (en) Manufacturing method of a semiconductor
JPS5253674A (en) Semiconductor device
JPS51140479A (en) Semiconductor device
JPS51147172A (en) Production method of semiconductor device
JPS5273675A (en) Structure of die bonding