JPS5228869A - Process for molding and the mold and heat-radiation header for the pro cess - Google Patents

Process for molding and the mold and heat-radiation header for the pro cess

Info

Publication number
JPS5228869A
JPS5228869A JP50104016A JP10401675A JPS5228869A JP S5228869 A JPS5228869 A JP S5228869A JP 50104016 A JP50104016 A JP 50104016A JP 10401675 A JP10401675 A JP 10401675A JP S5228869 A JPS5228869 A JP S5228869A
Authority
JP
Japan
Prior art keywords
mold
molding
heat
pro cess
radiation header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50104016A
Other languages
Japanese (ja)
Other versions
JPS5311826B2 (en
Inventor
Takao Nakane
Akiro Hoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50104016A priority Critical patent/JPS5228869A/en
Publication of JPS5228869A publication Critical patent/JPS5228869A/en
Publication of JPS5311826B2 publication Critical patent/JPS5311826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: To make removing process of useless molded materials unnecessary by preparing ditch for preventing flowing out of resin at upper and lower molds.
COPYRIGHT: (C)1977,JPO&Japio
JP50104016A 1975-08-29 1975-08-29 Process for molding and the mold and heat-radiation header for the pro cess Granted JPS5228869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50104016A JPS5228869A (en) 1975-08-29 1975-08-29 Process for molding and the mold and heat-radiation header for the pro cess

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50104016A JPS5228869A (en) 1975-08-29 1975-08-29 Process for molding and the mold and heat-radiation header for the pro cess

Publications (2)

Publication Number Publication Date
JPS5228869A true JPS5228869A (en) 1977-03-04
JPS5311826B2 JPS5311826B2 (en) 1978-04-25

Family

ID=14369451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50104016A Granted JPS5228869A (en) 1975-08-29 1975-08-29 Process for molding and the mold and heat-radiation header for the pro cess

Country Status (1)

Country Link
JP (1) JPS5228869A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480078A (en) * 1977-12-08 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPS54153872U (en) * 1978-04-18 1979-10-25
JPS5874045A (en) * 1982-10-06 1983-05-04 Mitsubishi Electric Corp Preparation of resin sealing type semiconductor device
JPS5894605U (en) * 1981-12-22 1983-06-27 小「な」　邦茂 Different level waterproof roof packaging machine
JPS62115242A (en) * 1985-11-12 1987-05-26 Dowa:Kk Vessel for producing electrically processed food
JP2006135100A (en) * 2004-11-05 2006-05-25 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519777A (en) * 1974-07-09 1976-01-26 Shoichi Takagi ONPANYORU BISEIBUTSUNO HATSUKO SOKUSHINHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519777A (en) * 1974-07-09 1976-01-26 Shoichi Takagi ONPANYORU BISEIBUTSUNO HATSUKO SOKUSHINHO

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480078A (en) * 1977-12-08 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPS54153872U (en) * 1978-04-18 1979-10-25
JPS5894605U (en) * 1981-12-22 1983-06-27 小「な」　邦茂 Different level waterproof roof packaging machine
JPS5874045A (en) * 1982-10-06 1983-05-04 Mitsubishi Electric Corp Preparation of resin sealing type semiconductor device
JPS62115242A (en) * 1985-11-12 1987-05-26 Dowa:Kk Vessel for producing electrically processed food
JP2006135100A (en) * 2004-11-05 2006-05-25 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method therefor

Also Published As

Publication number Publication date
JPS5311826B2 (en) 1978-04-25

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