JPS5559750A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5559750A
JPS5559750A JP13164078A JP13164078A JPS5559750A JP S5559750 A JPS5559750 A JP S5559750A JP 13164078 A JP13164078 A JP 13164078A JP 13164078 A JP13164078 A JP 13164078A JP S5559750 A JPS5559750 A JP S5559750A
Authority
JP
Japan
Prior art keywords
lead frame
holes
resin
portions
injecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13164078A
Other languages
Japanese (ja)
Inventor
Takeo Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13164078A priority Critical patent/JPS5559750A/en
Publication of JPS5559750A publication Critical patent/JPS5559750A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent break and falling in the case when removing moldings from mold female molds, by mounting through holes onto one surface of a lead frame for a resin mold type semiconductor device, which is used as the one inwall of resin injecting passages, of the lead frame.
CONSTITUTION: Through holes 15 in 1.0W1.5ϕ are formed to the injecting passage forming portions 14 of a lead frame 4. The holes 15 are located at positions facing onto the resin injecting passages 8 of female molds 6. When molding, resin also flows into the holes and hardens. Consequently, connection among solid portions 9 hardending in the resin injecting passages 8 and mold portions 13 surrounding pellets 5 is directly performed at gate corresponding solid portions 12 hardening at resin injecting gate 11 portions while being fast sticked on the injecting passage forming surfaces of the lead frame 4, a flank of the lead frame and further the inner circumferential surfaces of the holes 15, thus resulting in no break of the gate solid portions 12 when removing moldings 13 from the female molds 6.
COPYRIGHT: (C)1980,JPO&Japio
JP13164078A 1978-10-27 1978-10-27 Lead frame Pending JPS5559750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13164078A JPS5559750A (en) 1978-10-27 1978-10-27 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13164078A JPS5559750A (en) 1978-10-27 1978-10-27 Lead frame

Publications (1)

Publication Number Publication Date
JPS5559750A true JPS5559750A (en) 1980-05-06

Family

ID=15062772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13164078A Pending JPS5559750A (en) 1978-10-27 1978-10-27 Lead frame

Country Status (1)

Country Link
JP (1) JPS5559750A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144950A (en) * 1988-11-28 1990-06-04 Matsushita Electron Corp Lead frame for semiconductor device
JPH04180664A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Lead frame for semiconductor device and manufacture of semiconductor device using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144950A (en) * 1988-11-28 1990-06-04 Matsushita Electron Corp Lead frame for semiconductor device
JPH04180664A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Lead frame for semiconductor device and manufacture of semiconductor device using same

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