JPS5559750A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS5559750A JPS5559750A JP13164078A JP13164078A JPS5559750A JP S5559750 A JPS5559750 A JP S5559750A JP 13164078 A JP13164078 A JP 13164078A JP 13164078 A JP13164078 A JP 13164078A JP S5559750 A JPS5559750 A JP S5559750A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- holes
- resin
- portions
- injecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent break and falling in the case when removing moldings from mold female molds, by mounting through holes onto one surface of a lead frame for a resin mold type semiconductor device, which is used as the one inwall of resin injecting passages, of the lead frame.
CONSTITUTION: Through holes 15 in 1.0W1.5ϕ are formed to the injecting passage forming portions 14 of a lead frame 4. The holes 15 are located at positions facing onto the resin injecting passages 8 of female molds 6. When molding, resin also flows into the holes and hardens. Consequently, connection among solid portions 9 hardending in the resin injecting passages 8 and mold portions 13 surrounding pellets 5 is directly performed at gate corresponding solid portions 12 hardening at resin injecting gate 11 portions while being fast sticked on the injecting passage forming surfaces of the lead frame 4, a flank of the lead frame and further the inner circumferential surfaces of the holes 15, thus resulting in no break of the gate solid portions 12 when removing moldings 13 from the female molds 6.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13164078A JPS5559750A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13164078A JPS5559750A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5559750A true JPS5559750A (en) | 1980-05-06 |
Family
ID=15062772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13164078A Pending JPS5559750A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5559750A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144950A (en) * | 1988-11-28 | 1990-06-04 | Matsushita Electron Corp | Lead frame for semiconductor device |
JPH04180664A (en) * | 1990-11-15 | 1992-06-26 | Nec Kyushu Ltd | Lead frame for semiconductor device and manufacture of semiconductor device using same |
-
1978
- 1978-10-27 JP JP13164078A patent/JPS5559750A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144950A (en) * | 1988-11-28 | 1990-06-04 | Matsushita Electron Corp | Lead frame for semiconductor device |
JPH04180664A (en) * | 1990-11-15 | 1992-06-26 | Nec Kyushu Ltd | Lead frame for semiconductor device and manufacture of semiconductor device using same |
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