JPS5926244U - Molding equipment for semiconductor resin encapsulation molding - Google Patents

Molding equipment for semiconductor resin encapsulation molding

Info

Publication number
JPS5926244U
JPS5926244U JP12123382U JP12123382U JPS5926244U JP S5926244 U JPS5926244 U JP S5926244U JP 12123382 U JP12123382 U JP 12123382U JP 12123382 U JP12123382 U JP 12123382U JP S5926244 U JPS5926244 U JP S5926244U
Authority
JP
Japan
Prior art keywords
molding
utility
model registration
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12123382U
Other languages
Japanese (ja)
Other versions
JPS6233317Y2 (en
Inventor
坂東　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP12123382U priority Critical patent/JPS5926244U/en
Priority to GB8321044A priority patent/GB2127736B/en
Priority to DE19833328408 priority patent/DE3328408C2/en
Publication of JPS5926244U publication Critical patent/JPS5926244U/en
Application granted granted Critical
Publication of JPS6233317Y2 publication Critical patent/JPS6233317Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の成形装置を示す一部切欠正面図、第５図
の■及び■は該装置にて成形された成形品の正面図及び
平面図である。第２図乃至第４図は本考案装置の実施例
を示すもので、第２図はその一部切欠正面図、第３図は
該装置の型開き及び成形品取出し状態を示す一部切欠正
面図、第４図は′核装置の上下両型の要部を示す一部切
欠斜視図、第６図のＩ及び■は該装置にて成形された成
形品の正面図及び平面図である。 １０１・・・装置フレーム、１０２・・・固定盤、１０
６・・・上型、１１３・・・下型、１１４・・・ポット
、１１５・・・プランジャー、１１８・・・上型キャビ
ティ、１１９・・・カール、１２０・・・下型キャビテ
ィ、１２２・・・ゲート、１４６・・・エジェクター機
構、１４９・・・成形品、１５０・・・パレット。 ／ＩＴＩ 升 丁 第２図 １４１；　１４７１４５１４７　　紹 ＼　　　＼　ＩFIG. 1 is a partially cutaway front view showing a conventional molding apparatus, and ``■'' and ``■'' in FIG. 5 are a front view and a plan view of a molded product molded by the apparatus. 2 to 4 show an embodiment of the device of the present invention, FIG. 2 is a partially cutaway front view thereof, and FIG. 3 is a partially cutaway front view showing the device in the mold opening and molded product removal state. Figure 4 is a partially cutaway perspective view showing essential parts of both upper and lower molds of the core device, and Figures I and 2 in Figure 6 are a front view and a plan view of a molded product molded by the device. 101... Device frame, 102... Fixed plate, 10
6... Upper die, 113... Lower die, 114... Pot, 115... Plunger, 118... Upper die cavity, 119... Curl, 120... Lower die cavity, 122 ...gate, 146...ejector mechanism, 149...molded product, 150...pallet. /ITI Masucho Figure 2 141; 147145147 Introduction\\I

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）固定上型に対向配置させた可動下型の型締部側に
樹脂成形材料の加圧注入用トランスファーシリンダーを
設けたことを特徴とする半導体樹脂封入成形用の成形装
置。(1) A molding device for semiconductor resin encapsulation molding, characterized in that a transfer cylinder for pressurized injection of resin molding material is provided on the mold clamping part side of a movable lower mold that is placed opposite to a fixed upper mold. （２）可動下型側に配設した樹脂成形材料投入用のポッ
ト内に該成形材料の加圧用プランジャーを常時嵌合状態
に構成したことを特徴とする実用新案登録請求の範囲第
（１）項記載の成形装置。(2) Utility model registration claim No. 1 (1) characterized in that a plunger for pressurizing the molding material is always fitted in a pot for charging the resin molding material disposed on the movable lower mold side. The molding device described in ). （３）　　上型を固定させるための上部固定盤側に樹脂
成形品のエジェクター機構を配設したことを特徴とする
実用新案登録請求の範囲第（１）項又は第（２）項記載
の成形装置。(3) The molding according to claim 1 or 2 of the utility model registration claim, characterized in that an ejector mechanism for the resin molded product is disposed on the upper fixed platen side for fixing the upper mold. Device. （４）樹脂成形品の取出用パレットを上下両型間へ進退
可能に配設したことを特徴とする実用新案登録請求の範
囲第（１）項乃至第（３）項記載の成形装置。(4) The molding apparatus according to claims (1) to (3) of the utility model registration claim, characterized in that a pallet for taking out resin molded products is arranged so as to be able to move forward and backward between the upper and lower molds.
JP12123382U 1982-08-09 1982-08-09 Molding equipment for semiconductor resin encapsulation molding Granted JPS5926244U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP12123382U JPS5926244U (en) 1982-08-09 1982-08-09 Molding equipment for semiconductor resin encapsulation molding
GB8321044A GB2127736B (en) 1982-08-09 1983-08-04 Molding apparatus
DE19833328408 DE3328408C2 (en) 1982-08-09 1983-08-05 Compression molding device for the tight embedding of semiconductor chips by overmolding with a molding compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12123382U JPS5926244U (en) 1982-08-09 1982-08-09 Molding equipment for semiconductor resin encapsulation molding

Publications (2)

Publication Number Publication Date
JPS5926244U true JPS5926244U (en) 1984-02-18
JPS6233317Y2 JPS6233317Y2 (en) 1987-08-26

Family

ID=14806202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12123382U Granted JPS5926244U (en) 1982-08-09 1982-08-09 Molding equipment for semiconductor resin encapsulation molding

Country Status (3)

Country Link
JP (1) JPS5926244U (en)
DE (1) DE3328408C2 (en)
GB (1) GB2127736B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131212A (en) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk Mold for transfer molding

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575328A (en) * 1984-03-06 1986-03-11 Asm Fico Tooling, B.V. Automatic continuously cycleable molding apparatus
DE3811814C2 (en) * 1988-04-08 1994-08-25 Siemens Ag Injection molding device for quartz-filled plastic material
DE3811813C2 (en) * 1988-04-08 1993-11-04 Siemens Ag SPRAY SHAPE DEVICE
GB8828334D0 (en) * 1988-12-05 1989-01-05 Goh B H Gang-pot mould
DE8913972U1 (en) * 1989-11-27 1991-03-28 Remaplan Anlagenbau Gmbh, 8000 Muenchen, De
JP2846773B2 (en) * 1992-09-01 1999-01-13 三菱電機株式会社 Resin sealing device and resin sealing method for semiconductor device
US6007316A (en) * 1993-07-22 1999-12-28 Towa Corporation Apparatus for molding resin to seal electronic parts
TW257745B (en) * 1993-07-22 1995-09-21 Towa Kk
CN110640981A (en) * 2019-10-31 2020-01-03 东莞市嘉宏机电科技有限公司 Automatic discharging device of injection mold for combined foot pad

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109255A (en) * 1974-02-06 1975-08-28
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device
JPS5539665A (en) * 1978-09-14 1980-03-19 Toa Seimitsu Kogyo Kk Die device for charge and formation of semiconductor element
JPS5544766A (en) * 1978-09-25 1980-03-29 Nec Kyushu Ltd Resin enclosing device
JPS5546537A (en) * 1978-09-28 1980-04-01 Toa Seimitsu Kogyo Kk Metal mold for shaping semiconductor device in enclosed state
JPS575339A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Molding method and molding die
JPS575338A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Molding die
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH387287A (en) * 1961-02-28 1965-01-31 Drabert Soehne Method and device for automatic transfer molding of curable molding compounds
DE1943210A1 (en) * 1969-08-25 1971-03-11 Siemens Ag Transfer moulding electrical components

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109255A (en) * 1974-02-06 1975-08-28
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device
JPS5539665A (en) * 1978-09-14 1980-03-19 Toa Seimitsu Kogyo Kk Die device for charge and formation of semiconductor element
JPS5544766A (en) * 1978-09-25 1980-03-29 Nec Kyushu Ltd Resin enclosing device
JPS5546537A (en) * 1978-09-28 1980-04-01 Toa Seimitsu Kogyo Kk Metal mold for shaping semiconductor device in enclosed state
JPS575339A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Molding method and molding die
JPS575338A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Molding die
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131212A (en) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk Mold for transfer molding

Also Published As

Publication number Publication date
GB8321044D0 (en) 1983-09-07
JPS6233317Y2 (en) 1987-08-26
GB2127736B (en) 1986-02-26
GB2127736A (en) 1984-04-18
DE3328408C2 (en) 1985-05-02
DE3328408A1 (en) 1984-03-15

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