JPS5546537A - Metal mold for shaping semiconductor device in enclosed state - Google Patents
Metal mold for shaping semiconductor device in enclosed stateInfo
- Publication number
- JPS5546537A JPS5546537A JP11969778A JP11969778A JPS5546537A JP S5546537 A JPS5546537 A JP S5546537A JP 11969778 A JP11969778 A JP 11969778A JP 11969778 A JP11969778 A JP 11969778A JP S5546537 A JPS5546537 A JP S5546537A
- Authority
- JP
- Japan
- Prior art keywords
- radiating plate
- plate
- free end
- fixed
- metal mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent the production of burr on the exposed surface of a radiating plate, by making the bottom of the cavity of a metal mold gradient and by elastically bending the radiating plate when the mold is tightened.
CONSTITUTION: The exposed surface 2a of a radiating plate is brought into pressural contact with the bottom 9b of the fixed cavity 9a of a metal mold. When a fixed cavity block 9 and a moving cavity block 14 are tightened on each other, the free end of the radiating plate 2 comes into contact with the bottom 9b. The bottom 9b is made gradient so that the height of the bottom 9 is decreased in the direction from the fixed end toward free end of the radiating plate 2. Therefore, the free end part of the radiating plate 2 is bent along the bottom of the fixed cavity block 9a when both the blocks are tightened on each other. At that time, the fixed end part of the plate 2 is very tightly fitted on the fixed cavity block by a clamping force, the free end part of the plate 2 is also very tightly fitted on the block by th e elastic force of the plate and the warp, small projections or recesses of the radiating plate are pressed and deformed. Therefore, no resin flows the exposed surface of the radiating plate, namely, no burr is produced. When both the cavity blocks are opened from each other, the radiating plate is elastically restored to the original state.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11969778A JPS5546537A (en) | 1978-09-28 | 1978-09-28 | Metal mold for shaping semiconductor device in enclosed state |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11969778A JPS5546537A (en) | 1978-09-28 | 1978-09-28 | Metal mold for shaping semiconductor device in enclosed state |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5546537A true JPS5546537A (en) | 1980-04-01 |
Family
ID=14767822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11969778A Pending JPS5546537A (en) | 1978-09-28 | 1978-09-28 | Metal mold for shaping semiconductor device in enclosed state |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5546537A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122741A (en) * | 1982-01-14 | 1983-07-21 | Nec Home Electronics Ltd | Resin molding method for semiconductor device |
| JPS5926244U (en) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | Molding equipment for semiconductor resin encapsulation molding |
| US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
| US5505602A (en) * | 1993-03-31 | 1996-04-09 | Toyoda Gosei Co., Ltd. | Mold for producing a weather strip |
-
1978
- 1978-09-28 JP JP11969778A patent/JPS5546537A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122741A (en) * | 1982-01-14 | 1983-07-21 | Nec Home Electronics Ltd | Resin molding method for semiconductor device |
| JPS5926244U (en) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | Molding equipment for semiconductor resin encapsulation molding |
| JPS6233317Y2 (en) * | 1982-08-09 | 1987-08-26 | ||
| US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
| US5505602A (en) * | 1993-03-31 | 1996-04-09 | Toyoda Gosei Co., Ltd. | Mold for producing a weather strip |
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