JPS5538088A - Resin sealing device - Google Patents

Resin sealing device

Info

Publication number
JPS5538088A
JPS5538088A JP11208078A JP11208078A JPS5538088A JP S5538088 A JPS5538088 A JP S5538088A JP 11208078 A JP11208078 A JP 11208078A JP 11208078 A JP11208078 A JP 11208078A JP S5538088 A JPS5538088 A JP S5538088A
Authority
JP
Japan
Prior art keywords
burrs
platen
sealing device
resin sealing
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11208078A
Other languages
Japanese (ja)
Other versions
JPS614183B2 (en
Inventor
Kazuki Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP11208078A priority Critical patent/JPS5538088A/en
Publication of JPS5538088A publication Critical patent/JPS5538088A/en
Publication of JPS614183B2 publication Critical patent/JPS614183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens

Abstract

PURPOSE: To prevent a metal mold from deformation and burrs from producing by composing a mobile platen on a resin sealing device of two platens between which compression springs are fitted.
CONSTITUTION: A secondary platen 7 is mounted on a mobile platen 4 and there is provided a free displacement by the use of springs suitable to the clamping pressure between these platens. When a hydraulic cylinder 5 rises and molds are clamped, the secondary platen 7 cuhions the pressure once and then the metal molds are clamped under changed uniform pressure. Therefore, resin can be molded uniformly in the whole lead frame 10 and flashes or burrs do not produce. In this method the metal molds can be prevented from deformation and flashes or burrs can be free from production.
COPYRIGHT: (C)1980,JPO&Japio
JP11208078A 1978-09-11 1978-09-11 Resin sealing device Granted JPS5538088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11208078A JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11208078A JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Publications (2)

Publication Number Publication Date
JPS5538088A true JPS5538088A (en) 1980-03-17
JPS614183B2 JPS614183B2 (en) 1986-02-07

Family

ID=14577571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11208078A Granted JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Country Status (1)

Country Link
JP (1) JPS5538088A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655057A (en) * 1979-10-12 1981-05-15 Fujitsu Ltd Manufacture of semiconductor device
JPS5926244U (en) * 1982-08-09 1984-02-18 坂東　一雄 Molding equipment for semiconductor resin encapsulation molding
JPS59159717A (en) * 1983-03-03 1984-09-10 有限会社　コンペックス Artificial seeding log or fugal bed and mushroom culturing method
JPS6016525A (en) * 1983-07-07 1985-01-28 岡本　広司 Production of raw log for mushroom culture
JPS61274918A (en) * 1985-04-15 1986-12-05 ベルント・シエンク Device for manufacturing synthetic resin molded part, particularly, synthetic resin hollow body
JPS6431425A (en) * 1987-07-27 1989-02-01 Mitsubishi Electric Corp Resin sealing apparatus for semiconductor device
NL1005283C2 (en) * 1997-02-14 1998-08-18 3P Licensing Bv Matrix assembly comprising two parts movable in relation to each other for determining at least one shaped cavity

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655057A (en) * 1979-10-12 1981-05-15 Fujitsu Ltd Manufacture of semiconductor device
JPS5753659B2 (en) * 1979-10-12 1982-11-13
JPS5926244U (en) * 1982-08-09 1984-02-18 坂東　一雄 Molding equipment for semiconductor resin encapsulation molding
JPS6233317Y2 (en) * 1982-08-09 1987-08-26
JPS59159717A (en) * 1983-03-03 1984-09-10 有限会社　コンペックス Artificial seeding log or fugal bed and mushroom culturing method
JPS6016525A (en) * 1983-07-07 1985-01-28 岡本　広司 Production of raw log for mushroom culture
JPS61274918A (en) * 1985-04-15 1986-12-05 ベルント・シエンク Device for manufacturing synthetic resin molded part, particularly, synthetic resin hollow body
JPS6431425A (en) * 1987-07-27 1989-02-01 Mitsubishi Electric Corp Resin sealing apparatus for semiconductor device
NL1005283C2 (en) * 1997-02-14 1998-08-18 3P Licensing Bv Matrix assembly comprising two parts movable in relation to each other for determining at least one shaped cavity

Also Published As

Publication number Publication date
JPS614183B2 (en) 1986-02-07

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