JPS5878433A - Resin sealing molding device for semiconductor device - Google Patents

Abstract

PURPOSE:To shorten time until injection and elevation and pressing from the charge of resin tablets for sealing by incorporating an injection mechanism into the dreg of molding dies and charging the resin tablets to the upper resin receiving section of the injection mechanism from an upper section in the drag. CONSTITUTION:Each lead frame to which integrated circuits are set up is entered into respective surface die of the drag 32 between the molding dies 30 previously heated. The resin tablets for sealing are preheated, entered into the resin receiving port 34a of the drag 32 and placed onto a plunger 39, a clamping mechanism 2 is operated to elevate a drag holding base 8, and the tablets are clamped and pressed between the drag 32 and a cope 31. The injection mechanism 35 incorporated into the drag 32 is operated and the plunger 39 is elevated by means of a piston rod 38, resin for sealing is pressed and injected into the molding dies 30, and several semiconductor integrated circuit is sealed and molded with resin.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a resin sealing molding apparatus for semiconductor devices such as semiconductor integrated circuits.

Resin encapsulation molding of semiconductor devices such as semiconductor integrated circuits generally uses thermosetting resin, and a part of the semiconductor integrated circuit is molded with light emitting elements and light receiving elements using an injection molding method known as transfer molding. In this case, the sealing resin must be an epoxy resin called clear resin, which is a thermosetting resin but does not contain any fillers or pigments. This clear resin is different from the epoxy resin used in general resin-sealed semiconductor devices, and the weight of the sealing resin tablet before injection molding is limited (approximately 30 g) due to the heat of reaction.
, and cannot exceed this limit.

A conventional resin encapsulation molding apparatus using the injection molding method is shown in a front view in FIG. (1) is a stand frame that supports the mold clamping mechanism (2) inside, and has four support columns (3
) is fixed and protrudes upward. (4) is a molding die,
It consists of an upper mold (5) and a lower mold (6). The upper mold (5) is attached to the lower part of the upper mold support stand (7) fixed to the upper part of each support column (3). (not shown) is provided.

The lower mold (6) is mounted on a lower mold support stand (8) supported vertically by each support column (3), and has a number of seals on the upper surface corresponding to the upper mold (5). A noodle mold (not shown) for the lower half of the body is provided. The lower mold support stand (8) is raised and lowered by the mold clamping mechanism (2)K. (9) is the upper mold (5
The resin tablet inlet (QO) provided in the resin tablet inlet (QO) is a resin receiver provided penetrating from the center of this inlet toward the lower mold (6) side, and is generally called a pot masha chamber. The α force is an injection mechanism, consisting of a hydraulic cylinder ia installed on the upper mold support (7), a piston (to), and a piston rod Q4 extending downward from the piston. (G) is a control panel for operating the electrical system, hydraulic system, etc. The main parts of the mold clamping mechanism (2) are shown in the front view in Figure 2. α・ is fixed, and each support column (3) is fixed to this fixing base and extended. Mold clamping mechanism (2)
is the hydraulic cylinder αη attached to the fixed stand αQK.

The above-mentioned injection mechanism (1) has a piston (to) and a piston rod α, and the piston rod DI extended upward is in contact with the lower part of the lower mold support (8) to raise and lower the injection mechanism (
FIG. 3 shows a longitudinal cross-sectional view of the main part of section b). Piston rod α
A plunger (E) is fixed to the lower end of ◆, and the upper mold (5
) The resin receiver provided in communication with the center of the resin tablet inlet (9) descends and rises along the inner diameter of portion αQ as shown by the chain line.

In the above-mentioned conventional apparatus, each lead frame mounted with an integrated circuit is placed in each of the lower molds (6) of the molding mold (4) that has been preheated to 1500 to 180°C. Next, the lower mold holder (8) is raised by the mold clamping mechanism (2), and mold clamping pressure is applied between the lower m1 (6) and the upper mold (5). A sealing resin tablet preformed into a cylindrical shape is preheated to around 90°C, and is introduced into the resin receiver part Q□ from the tablet inlet (9) of the upper mold (5), and then inserted into the injection mechanism Ql. ) is activated to lower the plunger (E), and a sealing resin is injected under pressure into the molding die (4), thereby molding each semiconductor integrated circuit with the resin.

In addition, as mentioned above, when the weight of the sealing resin tablet is limited by the clear resin and the number of molded products that can be obtained from one set of molding molds (4) is small, or when using a small molding mold. Conventionally, there was a molding apparatus shown in a front view in FIG. The figure shows a case where two sets of molding molds (4) are installed and resin sealing molding is performed simultaneously. Stand frame (2)
A mold clamping mechanism (2) is attached to the mold clamping mechanism (2). Each support column (3
) is fixed at the top of the nine.

Two sets of upper molds (5) are attached to the lower part of the upper mold holding stand (support), and two sets of injection mechanisms α force are attached to the upper part, corresponding to each upper fJ (5) K. There is. Lower mold holding stand (2)
is supported by each support column (3)K so that it can move up and down, and has two sets of lower molds (6) attached to the upper part, and is raised and lowered by a mold clamping mechanism (2)K.

In this way, when the weight of the sealing resin tablet is limited, a plurality of sets of molding molds are installed and molding is performed simultaneously, thereby making it possible to mold a large number of tablets.

In the conventional apparatus described above, it took about 60 seconds for mold clamping 4 to insert the resin tablet, to inject and lower, and then to apply pressure. This is because the resin tablet must be manually inserted into the input slot (9) in the depth direction during the process, which takes time. Also,
Resin tablet inlet (9) is on top! Since it was located within m1 (5), mold clamping pressure was not applied to this part, and resin leakage occurred at the part corresponding to the tablet inlet (9) during molding. Furthermore, it is necessary to use clear resin, and the molding mold (
4) If the number of injection mechanisms is increased, it will take time to insert the resin tablets if multiple sets of injection mechanisms α forces are provided, and in addition, due to the resin tablet input port (11>), the mold (4) will not move in the depth direction. They cannot be increased in number, and can only be increased by arranging them in the horizontal direction, which results in a special type of device, high cost, and disadvantages such as lack of rigidity.

This invention was made to eliminate the above-mentioned drawbacks of the conventional device, and the injection mechanism is incorporated into the lower mold of the molding die, and the sealing resin tablet is injected from above into the lower mold into the resin receiver on the upper part of the injection mechanism. This reduces the time from the injection of the resin tablet to the injection rise and pressurization, and the area of the mold that is not affected by the clamping pressure becomes extremely small, eliminating resin leakage during molding. , placement of the injection mechanism also in the depth direction,
Alternatively, it is an object of the present invention to provide a resin encapsulation molding apparatus for a semiconductor device that allows molds to be arranged side by side, allows the apparatus to be reused by replacing only the molds, and has high general requirements.

FIG. 5 is a front view of a resin sealing molding apparatus according to an embodiment of the present invention, and shows (1) to (a), (8), and (g).
is the same as the above-mentioned conventional device. oC () is a molding die, consisting of an upper mold (0) and a lower mold (0). It is attached to the lower part of the mold holder (1), and the upper half of the mold (not shown) for a large number of sealing bodies is provided on the lower surface. The lower mold) is mounted on the lower lid holding stand (8), and the upper mold eI is mounted on the upper surface.
A lower half mold (not shown) for a large number of sealing bodies is provided correspondingly. (to) is an injection mechanism mounted below the mounting hole (material) provided vertically in the lower mold. The main parts of this injection mechanism (to) are shown in a longitudinal sectional view in FIG. It consists of a plunger (■) fixed to the upper end of this piston rod. The upper side of the device hole (B) has a resin socket (3 mm), through which the plunger (2) moves up and down.

Resin sealing molding using the apparatus of the above embodiment is performed as follows. Each lead frame equipped with an integrated circuit is placed in each of the lower molds (to) of a molding mold that has been previously heated to 1) 08 to 180°C. Preheat the sealing resin tablet to approximately 90°C, and place the resin holder on the bottom cover (34
a) and place it on the plunger.

Next, operate the mold clamping mechanism (2) to close the lower mold holding table (8).
is raised and the lower mold (2) is clamped and pressurized between it and the upper mold (2).

Next, the injection mechanism (2) built into the lower mold (to) K is activated, the plunger (to) is raised by the piston rod (to), and the sealing resin is injected under pressure into the mold shaft. , performs resin encapsulation molding of each semiconductor integrated circuit.

In this way, the process is as follows: inserting the sealing resin tablet → tightening → ejecting and lifting, and the distance of the injection and lifting is shorter than before, and the subsequent steps can be automatically operated by inserting the tablet manually at the beginning. This reduces work time to approximately half of the conventional method. In addition, the lower mold (to) does not have a resin inlet in the depth direction like the conventional upper mold, and the resin receiver is only the opening (34a) in the part where the mold clamping pressure does not apply, and the upper and lower drawings are ), the occurrence of resin leakage is eliminated.

FIG. 7 is a front view of a molding apparatus according to another embodiment of the present invention, which is applied when the weight of the resin tablet sealed with clear resin is limited.

Four support columns (3) are protruding from the pedestal frame (toward) side.

The mold ring consists of an upper mold (2) attached to an upper mold holder and a lower mold (2) attached to a lower mold holder.

The figure shows an example in which two sets of injection mechanisms (2) are arranged in the horizontal direction in the lower mold, and the required number of sets are also arranged in the depth direction. The number of molded resin molded bodies is increased. The upper mold holding unit is fixed to the top of each support column (3). The lower holding stand (goods) is supported by each support column (3) so as to be able to move up and down, and is raised and lowered by a mold clamping mechanism (2).

According to the device of the other embodiment described above, the resin tablet is placed in the mouth (34a) of each resin holder before being lowered into the lower mold and tightened.
) The I/C is inserted, and thereafter resin sealing is performed in the same manner as in the apparatus shown in FIG. 5 above.

In the embodiment shown in FIG. 7, the area of the gold m- is increased and the number of injection mechanisms is increased, but the total number of ejection mechanisms may be increased.

As described above, according to the present invention, the injection mechanism is incorporated in the lower part of the molding die, and the sealing resin tablet is introduced from above into the resin receiver above the injection mechanism of the lower mold. The time from inserting the resin tablet to sealing molding has been shortened to approximately half of the conventional time, improving productivity, and reducing the size of the mold in the depth direction as well, which indicates resin leakage during molding. Alternatively, the number can be increased, and the device can be used with high rigidity by replacing the required gold layer.

[Brief explanation of the drawing]

Figure 1 is a front view showing the company's conventional resin encapsulation molding apparatus, Figure 2 is a front view of the mold clamping mechanism shown in Figure 1, Figure 3 is an enlarged vertical sectional view of the injection mechanism shown in Figure 1, 4 is a front view showing a conventional resin sealing molding apparatus according to another example, FIG. 5 is a front view showing a resin sealing molding apparatus according to an embodiment of the present invention, and FIG. 6 is a front view showing the injection molding apparatus of FIG. FIG. 7 is an enlarged longitudinal cross-sectional view of the mechanism section and a front view of a resin sealing device according to another embodiment of the present invention. 1... Platform frame, 2... Mold clamping mechanism, 3... Support column,
8... Lower mold support stand, 30... Molding die, 31...
Upper mold, 32... Lower mold, 33... Upper mold support, 34.
...Mounting hole, 34a...Resin receiver is mouth, 35...Injection mechanism, 39...Base wa<, 40...Molding mold, 41...
...Upper mold, 42...Lower mold, 43...Upper mold support, 4
4...Lower die support stand Note that the same reference numerals in the drawings indicate the same or equivalent parts. Agent Shin Kuzuno - (1 other person) Figure 2 Figure 3 Figure 41 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] (i) An upper die attached to the lower part of an upper support stand fixed to the upper part of a plurality of support columns fixed to the platform side, and the upper mold is movable up and down on the support columns. In a resin encapsulation molding apparatus equipped with a mold made of a mold, the lower mold is mounted on a lower mold support that is raised and lowered by a cotton-making mechanism installed below. A vertical mounting hole is provided, an injection mechanism is mounted at the bottom of this mounting hole, the upper part of the mounting hole is used as a resin receiver, and a sealing resin bullet is injected from above and injection molded by the injection mechanism. 4. A resin sealing molding apparatus for a semiconductor device, characterized in that: (2) A resin sealing molding apparatus for a semiconductor device according to claim 1, wherein a plurality of mounting holes are provided in the lower mold, and an injection mechanism is mounted on each of the mounting holes.(3) An upper mold; 2. The resin encapsulation molding apparatus for a semiconductor device according to claim 1, further comprising a plurality of molding molds each comprising a lower mold equipped with an injection mechanism.