JPS5037400U - - Google Patents

Info

Publication number
JPS5037400U
JPS5037400U JP8876673U JP8876673U JPS5037400U JP S5037400 U JPS5037400 U JP S5037400U JP 8876673 U JP8876673 U JP 8876673U JP 8876673 U JP8876673 U JP 8876673U JP S5037400 U JPS5037400 U JP S5037400U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8876673U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8876673U priority Critical patent/JPS5037400U/ja
Publication of JPS5037400U publication Critical patent/JPS5037400U/ja
Pending legal-status Critical Current

Links

JP8876673U 1973-07-26 1973-07-26 Pending JPS5037400U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8876673U JPS5037400U (en) 1973-07-26 1973-07-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8876673U JPS5037400U (en) 1973-07-26 1973-07-26

Publications (1)

Publication Number Publication Date
JPS5037400U true JPS5037400U (en) 1975-04-18

Family

ID=28274093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8876673U Pending JPS5037400U (en) 1973-07-26 1973-07-26

Country Status (1)

Country Link
JP (1) JPS5037400U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380463A (en) * 1976-12-27 1978-07-15 Fujitsu Ltd Transfer molding machine
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5821344A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Supplying device for resin pellet
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device
JPS60121729A (en) * 1983-12-05 1985-06-29 Toshiba Corp Semiconductor resin-sealing metal mold

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380463A (en) * 1976-12-27 1978-07-15 Fujitsu Ltd Transfer molding machine
JPS5548984B2 (en) * 1976-12-27 1980-12-09
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5821344A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Supplying device for resin pellet
JPS6146051B2 (en) * 1981-07-29 1986-10-11 Matsushita Electric Ind Co Ltd
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device
JPS6248372B2 (en) * 1981-11-04 1987-10-13 Mitsubishi Electric Corp
JPS60121729A (en) * 1983-12-05 1985-06-29 Toshiba Corp Semiconductor resin-sealing metal mold
JPH0426214B2 (en) * 1983-12-05 1992-05-06 Tokyo Shibaura Electric Co

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