JPS5611236A - Method and metallic mold for plastic molding - Google Patents

Method and metallic mold for plastic molding

Info

Publication number
JPS5611236A
JPS5611236A JP8766079A JP8766079A JPS5611236A JP S5611236 A JPS5611236 A JP S5611236A JP 8766079 A JP8766079 A JP 8766079A JP 8766079 A JP8766079 A JP 8766079A JP S5611236 A JPS5611236 A JP S5611236A
Authority
JP
Japan
Prior art keywords
cavity
molding
molding material
pot
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8766079A
Other languages
Japanese (ja)
Inventor
Kazuo Bando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOWA SEIMITSU KOGYO KK
Original Assignee
TOWA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOWA SEIMITSU KOGYO KK filed Critical TOWA SEIMITSU KOGYO KK
Priority to JP8766079A priority Critical patent/JPS5611236A/en
Publication of JPS5611236A publication Critical patent/JPS5611236A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To improve yield and also to increase number of cavities by a method wherein a molding material is supplied into a plural pots being arranged adjacently to each cavity, pressurized and poured to a cavity side directly from each pot for molding. CONSTITUTION:A lead frame 4 provided with a semiconductor chip is placed on the face of a lower mold body 22 at each cavity block, and a preheated thermosetting resin molding material is supplied into each pot 31. Next, the lead frame 4 is placed accurately in position on a face 3 whereat upper and lower molds 1, 2 come in contact by closing the molds, an oil is fed into each cylinder 30 of an oil mechanism 27 to lift each plunger 36, and the molding material in the pot is pressurized to plasticize with a curl 12. The plasticized molding material is fed in each cavity 11 through a gate 13, and each semiconductor chip is sealed for molding. Next, the molds are opened to release a molding 37 in the cavity 11 of the upper mold from the cavity 11 together with the lead frame 4, thus obtaining desired molding.
JP8766079A 1979-07-10 1979-07-10 Method and metallic mold for plastic molding Pending JPS5611236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8766079A JPS5611236A (en) 1979-07-10 1979-07-10 Method and metallic mold for plastic molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8766079A JPS5611236A (en) 1979-07-10 1979-07-10 Method and metallic mold for plastic molding

Publications (1)

Publication Number Publication Date
JPS5611236A true JPS5611236A (en) 1981-02-04

Family

ID=13921101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8766079A Pending JPS5611236A (en) 1979-07-10 1979-07-10 Method and metallic mold for plastic molding

Country Status (1)

Country Link
JP (1) JPS5611236A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123221U (en) * 1981-01-26 1982-07-31
JPS57123222U (en) * 1981-01-26 1982-07-31
JPS5821344A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Supplying device for resin pellet
JPS5821345A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Resin sealing method for electronic part and device thereof
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device
JPS5887337U (en) * 1982-07-05 1983-06-14 有限会社ティ・アンド・ケイ・インターナショナル研究所 Mold equipment for semiconductor resin encapsulation molding
JPS594634U (en) * 1982-07-01 1984-01-12 第一精工株式会社 Encapsulation molding equipment
JPS5936937A (en) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp Forming apparatus for semiconductor device
JPS59114038A (en) * 1982-12-21 1984-06-30 Sumitomo Bakelite Co Ltd Transfer forming device
JPS59201429A (en) * 1983-04-28 1984-11-15 Toshiba Corp Semiconductor resin sealing apparatus
JPS6096424A (en) * 1983-11-01 1985-05-30 Nec Corp Molding die
JPS60168617A (en) * 1984-02-13 1985-09-02 Idemitsu Petrochem Co Ltd Press molding device
JPH01103417A (en) * 1987-10-16 1989-04-20 Fujitsu Ltd Molding device for multi-plunger molding die
WO1999024234A1 (en) * 1997-11-10 1999-05-20 Sumitomo Electric Industries, Ltd. A method for manufacturing precision-molded parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037400U (en) * 1973-07-26 1975-04-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037400U (en) * 1973-07-26 1975-04-18

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123222U (en) * 1981-01-26 1982-07-31
JPS57123221U (en) * 1981-01-26 1982-07-31
JPS6146051B2 (en) * 1981-07-29 1986-10-11 Matsushita Electric Ind Co Ltd
JPS5821344A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Supplying device for resin pellet
JPS5821345A (en) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd Resin sealing method for electronic part and device thereof
JPS6354218B2 (en) * 1981-07-29 1988-10-27 Matsushita Electric Ind Co Ltd
JPS5878433A (en) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp Resin sealing molding device for semiconductor device
JPS6248372B2 (en) * 1981-11-04 1987-10-13 Mitsubishi Electric Corp
JPS594634U (en) * 1982-07-01 1984-01-12 第一精工株式会社 Encapsulation molding equipment
JPS635227Y2 (en) * 1982-07-05 1988-02-12
JPS5887337U (en) * 1982-07-05 1983-06-14 有限会社ティ・アンド・ケイ・インターナショナル研究所 Mold equipment for semiconductor resin encapsulation molding
JPS5936937A (en) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp Forming apparatus for semiconductor device
JPS6153210B2 (en) * 1982-12-21 1986-11-17 Sumitomo Bakelite Co
JPS59114038A (en) * 1982-12-21 1984-06-30 Sumitomo Bakelite Co Ltd Transfer forming device
JPS59201429A (en) * 1983-04-28 1984-11-15 Toshiba Corp Semiconductor resin sealing apparatus
JPS6096424A (en) * 1983-11-01 1985-05-30 Nec Corp Molding die
JPH0153614B2 (en) * 1983-11-01 1989-11-15 Nippon Electric Co
JPS60168617A (en) * 1984-02-13 1985-09-02 Idemitsu Petrochem Co Ltd Press molding device
JPH01103417A (en) * 1987-10-16 1989-04-20 Fujitsu Ltd Molding device for multi-plunger molding die
JPH0747286B2 (en) * 1987-10-16 1995-05-24 富士通株式会社 Multi Plunger Mold Molding Equipment
WO1999024234A1 (en) * 1997-11-10 1999-05-20 Sumitomo Electric Industries, Ltd. A method for manufacturing precision-molded parts

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