JPS56108236A - Method and apparatus for resin seal for semiconductor device - Google Patents

Method and apparatus for resin seal for semiconductor device

Info

Publication number
JPS56108236A
JPS56108236A JP1177180A JP1177180A JPS56108236A JP S56108236 A JPS56108236 A JP S56108236A JP 1177180 A JP1177180 A JP 1177180A JP 1177180 A JP1177180 A JP 1177180A JP S56108236 A JPS56108236 A JP S56108236A
Authority
JP
Japan
Prior art keywords
resin
cavity
constitution
supplying part
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1177180A
Other languages
Japanese (ja)
Inventor
Akira Shinohara
Akira Kamikubo
Hiroaki Yamamoto
Ryosuke Hosobane
Hisakazu Omoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1177180A priority Critical patent/JPS56108236A/en
Publication of JPS56108236A publication Critical patent/JPS56108236A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To effectively utilize resin and uniform the molding conditions by providing, instead of the runners, a hole for the exclusive use of casting resin material at the position extremely close to the cavity and directly connecting the resin supplying part and the cavity by a gate. CONSTITUTION:The upper mold 6 is provided with a resin material casting hole 16 and alighned with the lower mold 17. A thermosetting resin 18 is cast 16 and pressurized by a plunger 9. The resin melted by the heated mold is forced into the cavity. In said constitution, because the resin passage is extremely short, the filling into the cavity is completed within several seconds. The volume of the resin becomes one over several tens of that by the conventional transfer molding method, and the resin flows without preheating. Because there is no runner the amount of the resin used decreases, so that the utilization rate of the material improves remarkably. Moreover, because the positional relationship between the resin supplying part and the cavity is improved, the injection pressure of the resin and the filling speed into the cavity are uniformed, so that the resin can be molded under extremely uniform conditions.
JP1177180A 1980-02-01 1980-02-01 Method and apparatus for resin seal for semiconductor device Pending JPS56108236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1177180A JPS56108236A (en) 1980-02-01 1980-02-01 Method and apparatus for resin seal for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1177180A JPS56108236A (en) 1980-02-01 1980-02-01 Method and apparatus for resin seal for semiconductor device

Publications (1)

Publication Number Publication Date
JPS56108236A true JPS56108236A (en) 1981-08-27

Family

ID=11787229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1177180A Pending JPS56108236A (en) 1980-02-01 1980-02-01 Method and apparatus for resin seal for semiconductor device

Country Status (1)

Country Link
JP (1) JPS56108236A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070320A1 (en) * 1981-01-26 1983-01-26 Dai-Ichi Seiko Co. Ltd. Sealing and molding machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070320A1 (en) * 1981-01-26 1983-01-26 Dai-Ichi Seiko Co. Ltd. Sealing and molding machine

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