JPS59114038A - Transfer forming device - Google Patents
Transfer forming deviceInfo
- Publication number
- JPS59114038A JPS59114038A JP22298682A JP22298682A JPS59114038A JP S59114038 A JPS59114038 A JP S59114038A JP 22298682 A JP22298682 A JP 22298682A JP 22298682 A JP22298682 A JP 22298682A JP S59114038 A JPS59114038 A JP S59114038A
- Authority
- JP
- Japan
- Prior art keywords
- pot
- cavities
- molding material
- forming material
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はトランスファ成形装置、特に、成形材料を移送
するための多数のプランジャビンを有するトランスファ
成形装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transfer molding apparatus, and more particularly to a transfer molding apparatus having multiple plunger bins for transferring molding material.
従来、トランスファ成形は成形材料がトランスファボッ
トに投入され、ここで加熱され、プランジャによシラン
ナーを紅で金型キャビティ内へ加圧移送され、そのキャ
ビティ内で成形材料が硬化するという過程で実施されて
いる。Conventionally, transfer molding is carried out through a process in which the molding material is put into a transferbot, where it is heated, and a plunger transfers the syringe under pressure into the mold cavity, where the molding material hardens. ing.
このように、トランスファ成形法では、キャビティをあ
らかじめ閉じ切っておいて、ここにすてに可塑化された
軟かい材料を短時間で注入するので、キャビティでの埋
込み金具の保持を確実に行ある。In this way, in the transfer molding method, the cavity is closed in advance and a soft plasticized material is injected into the cavity in a short period of time, making it possible to securely hold the embedded metal fitting in the cavity. .
しかしながら、従来のトランスファ成形においては次の
ような欠点を有している。トランスファボットはただひ
とつであるので、トランスファボットから個々の金型キ
ャビティまでをつなぐランナが長く複雑となる。トラン
スファボット及びランナに残る成形材料すなわち無駄に
なる成形材料が多くなる。−回の成形に使用される成形
材料はかなシの量であるので、通常タブレット化し、予
熱する必要がある。However, conventional transfer molding has the following drawbacks. Since there is only one transferbot, the runners from the transferbot to the individual mold cavities are long and complex. More molding material remains in the transferbot and runner, that is, more molding material is wasted. - Since the molding material used in the molding process is of a small quantity, it usually needs to be tabletted and preheated.
本発明はこのようガ欠点のないトランスファ成形法を開
発すべく検討して為されたものである。The present invention was developed in an effort to develop a transfer molding method free of such defects.
本発明を図面により説明する。The present invention will be explained with reference to the drawings.
図は本発明のトランスファ成形装置の一例である。第１
図は型開きした状態の図で、（ａ）は断面図、（ｂ）は
下型の斜視断面図である。第２図は下型にリードフレー
ムをセットし、トランスファポットに成形材料が投入さ
れた状態における下型の要部拡大した斜視断面図である
。第３図は型締めしだ状下型（２）には成形材料をキャ
ビティ（３）へ移送するだめのプランジャビン（５）が
キャビティ１〜数個当シ１個設けられている。下型にお
いて、各プランジャピン（５）の上方には成形材料が投
入されるスモールポット（以下単に「ポット」という）
（４）が形成されている。プランジャピン（５）は油圧
シリンダー（７）によりプランジャ突出板（６）を介し
て押上げられる。プランジャ突出板（６）はプランジャ
ピン（５）の下に空隙部（８）を有し、その中に弾性体
（９）が収納されプランジャピン（５）を上方へ押し上
げている。これにより各ポット（４）に投入される成形
材料に量的なバラツキがあっても、このバラツキによる
プランジャピンの押上刃（注入圧力）に差を生じること
がなく、成形品の充填不良や過充填によるパリ発生を防
止することができる。The figure shows an example of a transfer molding apparatus of the present invention. 1st
The figures show the mold in an opened state, where (a) is a cross-sectional view and (b) is a perspective cross-sectional view of the lower mold. FIG. 2 is an enlarged perspective sectional view of the main part of the lower mold in a state in which the lead frame is set in the lower mold and the molding material is poured into the transfer pot. FIG. 3 shows that the clamping ridge-like lower mold (2) is provided with one plunger bin (5) for each cavity (1 to several cavities) for transferring the molding material to the cavities (3). In the lower mold, above each plunger pin (5) is a small pot (hereinafter simply referred to as "pot") into which the molding material is charged.
(4) is formed. The plunger pin (5) is pushed up by the hydraulic cylinder (7) via the plunger protrusion plate (6). The plunger projecting plate (6) has a cavity (8) below the plunger pin (5), and an elastic body (9) is housed in the cavity to push the plunger pin (5) upward. As a result, even if there is a quantitative variation in the molding material put into each pot (4), this variation will not cause a difference in the push-up blade (injection pressure) of the plunger pin, resulting in insufficient filling or overfilling of the molded product. It is possible to prevent the occurrence of flaking due to filling.
型開きの状態でリードフレーム翰を下型にセットシ、成
形材料１国をポット（４）に投入する（第２図）。With the mold open, set the lead frame holder on the lower mold, and pour one piece of molding material into the pot (4) (Figure 2).
リードフレームｔＪ旬は下型に設けられた位置合せピン
（ｕ）とリードフレームの位品αカにより所定位置にセ
ットされる。これらの操作はリードフレームと成形材料
を保持する特定の治具を下型の上に一時セットして、と
の治具からリードフレームと成形材料を下型の所定位置
に落下させるようにするとよい。個々のポットに投入さ
れる成形材料の量は少量であるので、投入に先だって成
形材料をタブレット化する必要もなく、予熱の必要もな
い。The lead frame tJ is set in a predetermined position by positioning pins (u) provided on the lower die and the quality α of the lead frame. For these operations, it is best to temporarily set a specific jig that holds the lead frame and molding material on top of the lower mold, and then allow the lead frame and molding material to fall from the jig to the specified position on the lower mold. . Since the amount of molding material charged into each pot is small, there is no need to tablet the molding material prior to charging, and there is no need for preheating.
次に、型締めしたのち、油圧シリンダー（７）により各
プランジャピン（５）を押上げ、各ポット（４）内の成
形材料−をランナーａくを経てキャビティ（３）へ移送
させる（第３図）。ポット（４）とキャビティ（３）と
は近い距離にあるのでランナー（１４）は短くてよい。Next, after the mold is clamped, each plunger pin (5) is pushed up by the hydraulic cylinder (7), and the molding material in each pot (4) is transferred to the cavity (3) via the runner a (third figure). Since the pot (4) and the cavity (3) are close to each other, the runner (14) may be short.
従って成形材料（Ｉｍは抵抗なく各キャビティ（３）内
へ短時間で移送される。Therefore, the molding material (Im) is transferred into each cavity (3) in a short time without resistance.
所定の成形時間経過後、成形品と、ランナー及びポット
に残っている硬化した成形材料とを突出しピンａＳとプ
ランジャピン（５）で取出し、１サイクルの成形操作が
終了する。After a predetermined molding time has elapsed, the molded product and the hardened molding material remaining in the runner and pot are taken out using the ejector pin aS and the plunger pin (5), and one cycle of molding operation is completed.
本発明のトランスファ成形装置は次のような特長を有し
ている。The transfer molding apparatus of the present invention has the following features.
（１）多数のプランジャを有し、これにより個々のポッ
ト内に投入された成形材料を移送するので、一つのポッ
トに投入される成形材料の量は少なく、従って成形材料
の予熱を省くことができ、成形時間も短縮される。(1) Since it has a large number of plungers and uses these to transfer the molding material put into each pot, the amount of molding material put into one pot is small, so preheating of the molding material can be omitted. This also reduces molding time.
・（１１）下型に形成される多数のポット内に成形材料
を投入するので、簡単な治具を用いることにより成形材
料をタブレット化する必要がなく、粉末状のまま投入す
ることができ、成形材料の投入とインサート金具のセッ
トとを同時に行うことができる０
（ｌｉｌ）１〜数個のキャビティに対して１個のポット
及ヒフランジャビンがちシ、キャビティとポットの距離
も短いので、ランナの形状が単純でしかも５−
短い。従って、成形材料の無駄が非常に少ない。・(11) Since the molding material is poured into a large number of pots formed in the lower mold, there is no need to tablet the molding material by using a simple jig, and the molding material can be poured in powder form. The injection of molding material and the setting of the insert fittings can be done at the same time. (lil) One pot and hyfran jar are required for one to several cavities, and the distance between the cavity and the pot is short, so the runner The shape is simple and short. Therefore, there is very little waste of molding material.
（１ｖ）プランジャピンの下部に、成形材料の秤量のバ
ラツキを吸収しうる弾性体を設けることができる。これ
により各キャビティの成形圧力が均等となり、成形不良
が少なくなる。(1v) An elastic body capable of absorbing variations in the weight of the molding material can be provided below the plunger pin. This equalizes the molding pressure in each cavity, reducing molding defects.
（Ｖ）装置の構造は、上型にプランジャを設けた場合に
比較して簡単となる。(V) The structure of the device is simpler than when a plunger is provided on the upper mold.
図面は本発明のトランスファ成形装置の一例である。第
１図は型開きした状態の図で、（ａ）は断面図、（ｂ）
は下型の斜視断面図である。第２図はリードフレームを
セットし、成形材料を投入した状態における下型の要部
拡大した斜視断面図である。
第３図は型締めした状態の断面図である。
特許出願人 住友ベークライト株式会社６−
第１図（０）
第１図（ｂ）
第２図
第３図The drawing shows an example of the transfer molding apparatus of the present invention. Figure 1 shows the mold in its opened state, (a) is a cross-sectional view, (b)
is a perspective cross-sectional view of the lower mold. FIG. 2 is an enlarged perspective sectional view of the main part of the lower die in a state in which the lead frame is set and the molding material is charged. FIG. 3 is a sectional view of the mold in a closed state. Patent applicant Sumitomo Bakelite Co., Ltd. 6- Figure 1 (0) Figure 1 (b) Figure 2 Figure 3
Claims (1)
ビティが設けられておシ、下型には成形材料をキャビテ
ィへ移送するためのスモールポット及びプランジャピン
がキャビテイ１〜数個箔りそれぞれ１個設けられている
トランスファ成形装置。A large number of cavities are provided between the upper mold and the lower mold to form a molded product, and the lower mold has one to several small pots and plunger pins for transferring the molding material to the cavities. A transfer molding device equipped with one piece for each foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22298682A JPS59114038A (en) | 1982-12-21 | 1982-12-21 | Transfer forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22298682A JPS59114038A (en) | 1982-12-21 | 1982-12-21 | Transfer forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59114038A true JPS59114038A (en) | 1984-06-30 |
| JPS6153210B2 JPS6153210B2 (en) | 1986-11-17 |
Family
ID=16791005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22298682A Granted JPS59114038A (en) | 1982-12-21 | 1982-12-21 | Transfer forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59114038A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255315A (en) * | 1991-02-07 | 1992-09-10 | Nec Kyushu Ltd | Resin-sealing mold |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109255A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
| JPS57123222U (en) * | 1981-01-26 | 1982-07-31 |
-
1982
- 1982-12-21 JP JP22298682A patent/JPS59114038A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109255A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
| JPS57123222U (en) * | 1981-01-26 | 1982-07-31 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255315A (en) * | 1991-02-07 | 1992-09-10 | Nec Kyushu Ltd | Resin-sealing mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153210B2 (en) | 1986-11-17 |
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