JPS6422510A - Molding method - Google Patents

Molding method

Info

Publication number
JPS6422510A
JPS6422510A JP17865287A JP17865287A JPS6422510A JP S6422510 A JPS6422510 A JP S6422510A JP 17865287 A JP17865287 A JP 17865287A JP 17865287 A JP17865287 A JP 17865287A JP S6422510 A JPS6422510 A JP S6422510A
Authority
JP
Japan
Prior art keywords
half side
print substrate
article
resin
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17865287A
Other languages
Japanese (ja)
Inventor
Fujio Baba
Shinichi Horinouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Keiki Inc
Original Assignee
Tokyo Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Keiki Co Ltd filed Critical Tokyo Keiki Co Ltd
Priority to JP17865287A priority Critical patent/JPS6422510A/en
Publication of JPS6422510A publication Critical patent/JPS6422510A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a mold of perfect sealing structure, by a method wherein the half side of a molded part is prepared previously and an article to be molded is arranged on the half side to cover the whole of the article by top and bottom forces while resin is poured into a gap between the molds and the article. CONSTITUTION:The half side 11 of a molded part is prepared by resin for molding or the like. Next, articles to be molded are arranged on the half side 11. In this case, electric parts 13b, 13c are arranged so that they are fitted to a recess 11a and a groove 11b, thereafter, the half side 11 and a print substrate 12 are positioned. Subsequently, the half side 11, on which the print substrate 12 is arranged, is covered by a bottom force 14 and a top force 15, then, resin or the material of the mold is poured into a gap 16 formed between the top force 15 and the print substrate 12 as well as the half side 11 whereby the print substrate 12 can be obtained.
JP17865287A 1987-07-17 1987-07-17 Molding method Pending JPS6422510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17865287A JPS6422510A (en) 1987-07-17 1987-07-17 Molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17865287A JPS6422510A (en) 1987-07-17 1987-07-17 Molding method

Publications (1)

Publication Number Publication Date
JPS6422510A true JPS6422510A (en) 1989-01-25

Family

ID=16052208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17865287A Pending JPS6422510A (en) 1987-07-17 1987-07-17 Molding method

Country Status (1)

Country Link
JP (1) JPS6422510A (en)

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