JPS6422511A - Molding method - Google Patents

Molding method

Info

Publication number
JPS6422511A
JPS6422511A JP17865387A JP17865387A JPS6422511A JP S6422511 A JPS6422511 A JP S6422511A JP 17865387 A JP17865387 A JP 17865387A JP 17865387 A JP17865387 A JP 17865387A JP S6422511 A JPS6422511 A JP S6422511A
Authority
JP
Japan
Prior art keywords
mold
molding material
molded
gap
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17865387A
Other languages
Japanese (ja)
Inventor
Fujio Baba
Shinichi Horinouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Keiki Inc
Original Assignee
Tokyo Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Keiki Co Ltd filed Critical Tokyo Keiki Co Ltd
Priority to JP17865387A priority Critical patent/JPS6422511A/en
Publication of JPS6422511A publication Critical patent/JPS6422511A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

PURPOSE:To obtain a structural body of perfect sealing, which is molded so as to have a predetermined thickness, by a method wherein an article to be molded is put on a mold and a gap between the article and the mold is filled with molding material, then, the mold is turned and the other mold is covered thereon while the gap in the mold is filled with the molding material. CONSTITUTION:An article to be molded is put on a mold 13. Next, the other mold 14 for the upper half thereof is covered on the mold 13 and molding material 16 such as resin or the like is poured into a gap 15 formed between the other mold 14 and a print substrate 11. Next, after the molding material 16 is cured, the mold 13 is removed and the print substrate 11 and the other mold 14 are turned. Thereafter, another mold 17 is put on the mold 14 and the molding material is poured into the gap 18, formed between the print substrate 11 and another mold 17, whereby a sealed structure may be molded.
JP17865387A 1987-07-17 1987-07-17 Molding method Pending JPS6422511A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17865387A JPS6422511A (en) 1987-07-17 1987-07-17 Molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17865387A JPS6422511A (en) 1987-07-17 1987-07-17 Molding method

Publications (1)

Publication Number Publication Date
JPS6422511A true JPS6422511A (en) 1989-01-25

Family

ID=16052225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17865387A Pending JPS6422511A (en) 1987-07-17 1987-07-17 Molding method

Country Status (1)

Country Link
JP (1) JPS6422511A (en)

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