JPS56103482A - Manufacture of semiconductor device for photoelectric conversion - Google Patents

Manufacture of semiconductor device for photoelectric conversion

Info

Publication number
JPS56103482A
JPS56103482A JP545080A JP545080A JPS56103482A JP S56103482 A JPS56103482 A JP S56103482A JP 545080 A JP545080 A JP 545080A JP 545080 A JP545080 A JP 545080A JP S56103482 A JPS56103482 A JP S56103482A
Authority
JP
Japan
Prior art keywords
conversion unit
metal mold
lens
photoelectric conversion
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP545080A
Other languages
Japanese (ja)
Inventor
Takeo Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP545080A priority Critical patent/JPS56103482A/en
Publication of JPS56103482A publication Critical patent/JPS56103482A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

PURPOSE:To exactly position a lens to be formed by a method wherein when a chip provided with a photoelectric conversion unit is held with an upper metal mold having a transparent resin injection opening and a lower metal mold having a lens- shaped concave corresponding to the photoelectric conversion unit, positioning pins surrounding the concave are provided on the lower metal mold. CONSTITUTION:The face and the reverse of the chip 1 of which photoelectric conversion unit 2 is burried in the concave formed on the surface are fixedly attached to a substrate 8 of a lead frame or the like, and input/output pins 9 of the frame are connected with electrodes each provided in the conversion unit 2 using wires 11. Then, with ends of the pins 9 projected outside, the upper metal mold 13 is disposed on the substrate 8 side and the lower metal mold 14 on the conversion unit side respectively. In this construction, the upper metal mold 13 is formed with the injection opening 15 into which the transparent resins such as epoxy, acryl, and silicon are injected, and the lower metal mold 14 is provided with the lens- shaped concave 16 for forming the lens on the conversion unit 2 and with the projected positioning pins 17 which surround the concave. Thus, the lens is formed at the correct position on the conversion unit 2.
JP545080A 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion Pending JPS56103482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP545080A JPS56103482A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP545080A JPS56103482A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Publications (1)

Publication Number Publication Date
JPS56103482A true JPS56103482A (en) 1981-08-18

Family

ID=11611540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP545080A Pending JPS56103482A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Country Status (1)

Country Link
JP (1) JPS56103482A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8206876B2 (en) 2006-02-22 2012-06-26 Panasonic Corporation Fuel cartridge for a fuel cell having a flexible outer casing
GB2536886A (en) * 2015-03-27 2016-10-05 Allen Chipawe Tinashe An Airless, Fluid dispensing assembly and system
JP2018511069A (en) * 2015-02-10 2018-04-19 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Image recording system and automobile

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8206876B2 (en) 2006-02-22 2012-06-26 Panasonic Corporation Fuel cartridge for a fuel cell having a flexible outer casing
JP2018511069A (en) * 2015-02-10 2018-04-19 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Image recording system and automobile
US10321034B2 (en) 2015-02-10 2019-06-11 Robert Bosch Gmbh Image recording system and a motor vehicle
GB2536886A (en) * 2015-03-27 2016-10-05 Allen Chipawe Tinashe An Airless, Fluid dispensing assembly and system

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