JPS5660024A - Composite type semiconductor device - Google Patents

Composite type semiconductor device

Info

Publication number
JPS5660024A
JPS5660024A JP13516979A JP13516979A JPS5660024A JP S5660024 A JPS5660024 A JP S5660024A JP 13516979 A JP13516979 A JP 13516979A JP 13516979 A JP13516979 A JP 13516979A JP S5660024 A JPS5660024 A JP S5660024A
Authority
JP
Japan
Prior art keywords
lead
wire
electrode
wiring
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13516979A
Other languages
Japanese (ja)
Inventor
Heiji Moroshima
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13516979A priority Critical patent/JPS5660024A/en
Publication of JPS5660024A publication Critical patent/JPS5660024A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain the wiring free of short-circuit defects for the subject semiconductor with a plurality of semiconductor elements connected by a bonding wire by a method wherein a floated lead without an external terminal is provided and a wiring performed using said terminal as a junction section. CONSTITUTION:For application to signal-phase bridge rectifying circuit, parts of the lead L1 and L3 are formed into two branches and a lead L5 without an exterior terminal is prepared. On the lead frame as prepared above, diodes D1, D2, D3 and D4 are connected respectively, and each electrode is wire-connected to the corresponding lead. In this case, firstly, the diode D1 electrode is wire-connected to the part L5 and then it is wire-connected to the part L2 of the lead through the electrode of the diode D4 located on the part L4 of the leaf. Consequently, as a jumping wiring can be eliminated by utilizing the floating lead and the electrode of the element as a junction section, the short-circuit caused by the deformation of a wire and the like can be prevented.
JP13516979A 1979-10-22 1979-10-22 Composite type semiconductor device Pending JPS5660024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13516979A JPS5660024A (en) 1979-10-22 1979-10-22 Composite type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13516979A JPS5660024A (en) 1979-10-22 1979-10-22 Composite type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5660024A true JPS5660024A (en) 1981-05-23

Family

ID=15145438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13516979A Pending JPS5660024A (en) 1979-10-22 1979-10-22 Composite type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5660024A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166166U (en) * 1984-04-12 1985-11-05 沖電気工業株式会社 Light emitting element array head
JPS6156471A (en) * 1984-07-28 1986-03-22 Fujitsu Ltd Semiconductor device
JPS6157540U (en) * 1984-09-19 1986-04-17
JPS6161847U (en) * 1984-09-28 1986-04-25
CN102420219A (en) * 2011-01-06 2012-04-18 陈荣红 Discrete semiconductor paster ultrathin rectifier

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166166U (en) * 1984-04-12 1985-11-05 沖電気工業株式会社 Light emitting element array head
JPS6156471A (en) * 1984-07-28 1986-03-22 Fujitsu Ltd Semiconductor device
JPS6157540U (en) * 1984-09-19 1986-04-17
JPS6161847U (en) * 1984-09-28 1986-04-25
JPH0322925Y2 (en) * 1984-09-28 1991-05-20
CN102420219A (en) * 2011-01-06 2012-04-18 陈荣红 Discrete semiconductor paster ultrathin rectifier

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