JPS55134951A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55134951A
JPS55134951A JP4336679A JP4336679A JPS55134951A JP S55134951 A JPS55134951 A JP S55134951A JP 4336679 A JP4336679 A JP 4336679A JP 4336679 A JP4336679 A JP 4336679A JP S55134951 A JPS55134951 A JP S55134951A
Authority
JP
Japan
Prior art keywords
heatsink
inner lead
island
adhesive
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4336679A
Other languages
Japanese (ja)
Inventor
Kenji Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4336679A priority Critical patent/JPS55134951A/en
Publication of JPS55134951A publication Critical patent/JPS55134951A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body

Abstract

PURPOSE:To improve productivity and obtain a device of high heat emission effect by properly separating a heatsink from an inner lead with its own weight. CONSTITUTION:On a jig 28 a heatsink 26 is set, thereon through adhesive 29 an island 22 of a lead frame 21 is fixed, through adhesive 29 a semiconductor element 23 is put on and heated. Next, the inner lead 24 and the element 23 are connected and sealed with resin 27. For example, when using the heatsink weighting about 0.8g of a 0.15mm thick Fe-Ni alloy, its own weight can separate the heatsink about 0.1-0.2mm from the inner lead. Cosequently it enables to use a plate-shaped heatlink easy to be processed thus remarkably improving productivity. Moreover the element, island and heatsink can be simultaneously fixed en bloc on a heated jig thus enabling to raise the respective adhesion and to improve the heat emission effect.
JP4336679A 1979-04-10 1979-04-10 Semiconductor device Pending JPS55134951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4336679A JPS55134951A (en) 1979-04-10 1979-04-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4336679A JPS55134951A (en) 1979-04-10 1979-04-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55134951A true JPS55134951A (en) 1980-10-21

Family

ID=12661841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4336679A Pending JPS55134951A (en) 1979-04-10 1979-04-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55134951A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983003712A1 (en) * 1982-04-05 1983-10-27 Motorola Inc A self-positioning heat spreader
US4541005A (en) * 1982-04-05 1985-09-10 Motorola, Inc. Self-positioning heat spreader
US5434105A (en) * 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983003712A1 (en) * 1982-04-05 1983-10-27 Motorola Inc A self-positioning heat spreader
US4541005A (en) * 1982-04-05 1985-09-10 Motorola, Inc. Self-positioning heat spreader
US5434105A (en) * 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation
US5581119A (en) * 1994-03-04 1996-12-03 National Semiconductor Corporation IC having heat spreader attached by glob-topping

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