JPS5414672A - Bonding electrode structure of semiconductor device - Google Patents
Bonding electrode structure of semiconductor deviceInfo
- Publication number
- JPS5414672A JPS5414672A JP7987577A JP7987577A JPS5414672A JP S5414672 A JPS5414672 A JP S5414672A JP 7987577 A JP7987577 A JP 7987577A JP 7987577 A JP7987577 A JP 7987577A JP S5414672 A JPS5414672 A JP S5414672A
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- electrode structure
- bonding electrode
- bump electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To evade the deterioration of adhesive strength of a bump electrode with a film prevented from cracking, by proviously interposing a lamination film of a Ni-Cr film and Pd film adjoining to the edge part of an Al film when forming the bump electrode on the Al film formed as an electrode base material on a passivation film.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7987577A JPS5414672A (en) | 1977-07-06 | 1977-07-06 | Bonding electrode structure of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7987577A JPS5414672A (en) | 1977-07-06 | 1977-07-06 | Bonding electrode structure of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5414672A true JPS5414672A (en) | 1979-02-03 |
Family
ID=13702391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7987577A Pending JPS5414672A (en) | 1977-07-06 | 1977-07-06 | Bonding electrode structure of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5414672A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4472730A (en) * | 1980-12-29 | 1984-09-18 | Nippon Electric Co., Ltd. | Semiconductor device having an improved moisture resistance |
US4733289A (en) * | 1980-04-25 | 1988-03-22 | Hitachi, Ltd. | Resin-molded semiconductor device using polyimide and nitride films for the passivation film |
US5501006A (en) * | 1993-09-22 | 1996-03-26 | Motorola, Inc. | Method for connection of signals to an integrated circuit |
US5854513A (en) * | 1995-07-14 | 1998-12-29 | Lg Electronics Inc. | Semiconductor device having a bump structure and test electrode |
-
1977
- 1977-07-06 JP JP7987577A patent/JPS5414672A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4733289A (en) * | 1980-04-25 | 1988-03-22 | Hitachi, Ltd. | Resin-molded semiconductor device using polyimide and nitride films for the passivation film |
US4472730A (en) * | 1980-12-29 | 1984-09-18 | Nippon Electric Co., Ltd. | Semiconductor device having an improved moisture resistance |
US5501006A (en) * | 1993-09-22 | 1996-03-26 | Motorola, Inc. | Method for connection of signals to an integrated circuit |
US5854513A (en) * | 1995-07-14 | 1998-12-29 | Lg Electronics Inc. | Semiconductor device having a bump structure and test electrode |
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