JPS5414672A - Bonding electrode structure of semiconductor device - Google Patents

Bonding electrode structure of semiconductor device

Info

Publication number
JPS5414672A
JPS5414672A JP7987577A JP7987577A JPS5414672A JP S5414672 A JPS5414672 A JP S5414672A JP 7987577 A JP7987577 A JP 7987577A JP 7987577 A JP7987577 A JP 7987577A JP S5414672 A JPS5414672 A JP S5414672A
Authority
JP
Japan
Prior art keywords
film
semiconductor device
electrode structure
bonding electrode
bump electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7987577A
Other languages
Japanese (ja)
Inventor
Koji Nose
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7987577A priority Critical patent/JPS5414672A/en
Publication of JPS5414672A publication Critical patent/JPS5414672A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To evade the deterioration of adhesive strength of a bump electrode with a film prevented from cracking, by proviously interposing a lamination film of a Ni-Cr film and Pd film adjoining to the edge part of an Al film when forming the bump electrode on the Al film formed as an electrode base material on a passivation film.
COPYRIGHT: (C)1979,JPO&Japio
JP7987577A 1977-07-06 1977-07-06 Bonding electrode structure of semiconductor device Pending JPS5414672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7987577A JPS5414672A (en) 1977-07-06 1977-07-06 Bonding electrode structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7987577A JPS5414672A (en) 1977-07-06 1977-07-06 Bonding electrode structure of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5414672A true JPS5414672A (en) 1979-02-03

Family

ID=13702391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7987577A Pending JPS5414672A (en) 1977-07-06 1977-07-06 Bonding electrode structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5414672A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472730A (en) * 1980-12-29 1984-09-18 Nippon Electric Co., Ltd. Semiconductor device having an improved moisture resistance
US4733289A (en) * 1980-04-25 1988-03-22 Hitachi, Ltd. Resin-molded semiconductor device using polyimide and nitride films for the passivation film
US5501006A (en) * 1993-09-22 1996-03-26 Motorola, Inc. Method for connection of signals to an integrated circuit
US5854513A (en) * 1995-07-14 1998-12-29 Lg Electronics Inc. Semiconductor device having a bump structure and test electrode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733289A (en) * 1980-04-25 1988-03-22 Hitachi, Ltd. Resin-molded semiconductor device using polyimide and nitride films for the passivation film
US4472730A (en) * 1980-12-29 1984-09-18 Nippon Electric Co., Ltd. Semiconductor device having an improved moisture resistance
US5501006A (en) * 1993-09-22 1996-03-26 Motorola, Inc. Method for connection of signals to an integrated circuit
US5854513A (en) * 1995-07-14 1998-12-29 Lg Electronics Inc. Semiconductor device having a bump structure and test electrode

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