JPS5419649A - Wafer holding jig for electrtolytic plating - Google Patents

Wafer holding jig for electrtolytic plating

Info

Publication number
JPS5419649A
JPS5419649A JP8427177A JP8427177A JPS5419649A JP S5419649 A JPS5419649 A JP S5419649A JP 8427177 A JP8427177 A JP 8427177A JP 8427177 A JP8427177 A JP 8427177A JP S5419649 A JPS5419649 A JP S5419649A
Authority
JP
Japan
Prior art keywords
plating
electrtolytic
holding jig
wafer holding
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8427177A
Other languages
Japanese (ja)
Inventor
Tetsuro Hino
Hiroshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8427177A priority Critical patent/JPS5419649A/en
Publication of JPS5419649A publication Critical patent/JPS5419649A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To reduce potential differneces of respective parts and obtain plating film thicknesses of high evenness by holding semiconductor wafers with the protrusions provided to ring-form upper frame and lower frame thereby simultaneously performing the plating treatment in electrolyte for all parts.
COPYRIGHT: (C)1979,JPO&Japio
JP8427177A 1977-07-15 1977-07-15 Wafer holding jig for electrtolytic plating Pending JPS5419649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8427177A JPS5419649A (en) 1977-07-15 1977-07-15 Wafer holding jig for electrtolytic plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8427177A JPS5419649A (en) 1977-07-15 1977-07-15 Wafer holding jig for electrtolytic plating

Publications (1)

Publication Number Publication Date
JPS5419649A true JPS5419649A (en) 1979-02-14

Family

ID=13825782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8427177A Pending JPS5419649A (en) 1977-07-15 1977-07-15 Wafer holding jig for electrtolytic plating

Country Status (1)

Country Link
JP (1) JPS5419649A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339319A (en) * 1980-08-16 1982-07-13 Seiichiro Aigo Apparatus for plating semiconductor wafers
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
JPH0432600A (en) * 1990-05-30 1992-02-04 Fujitsu Ltd Method and device for plating
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
JP2007119923A (en) * 1998-11-28 2007-05-17 Acm Research Inc Methods and apparatus for holding and positioning semiconductor workpiece during electropolishing and/or electroplating of the workpiece
WO2019003891A1 (en) * 2017-06-28 2019-01-03 株式会社荏原製作所 Substrate holder and plating device
JP2019007075A (en) * 2017-06-28 2019-01-17 株式会社荏原製作所 Substrate holder and plating device
CN110359079A (en) * 2018-04-10 2019-10-22 中国科学院半导体研究所 Electroplating clamp

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339319A (en) * 1980-08-16 1982-07-13 Seiichiro Aigo Apparatus for plating semiconductor wafers
JPH0432600A (en) * 1990-05-30 1992-02-04 Fujitsu Ltd Method and device for plating
JP2608485B2 (en) * 1990-05-30 1997-05-07 富士通株式会社 Plating equipment
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
JP2007119923A (en) * 1998-11-28 2007-05-17 Acm Research Inc Methods and apparatus for holding and positioning semiconductor workpiece during electropolishing and/or electroplating of the workpiece
WO2019003891A1 (en) * 2017-06-28 2019-01-03 株式会社荏原製作所 Substrate holder and plating device
JP2019007075A (en) * 2017-06-28 2019-01-17 株式会社荏原製作所 Substrate holder and plating device
CN110799677A (en) * 2017-06-28 2020-02-14 株式会社荏原制作所 Substrate holder and plating device
KR20200021919A (en) * 2017-06-28 2020-03-02 가부시키가이샤 에바라 세이사꾸쇼 Board Holders & Plating Devices
JP2021191902A (en) * 2017-06-28 2021-12-16 株式会社荏原製作所 Substrate holder and plating device
US11299817B2 (en) 2017-06-28 2022-04-12 Ebara Corporation Holder for holding substrate and system for plating
TWI786136B (en) * 2017-06-28 2022-12-11 日商荏原製作所股份有限公司 Substrate holder and plating device
US11718925B2 (en) 2017-06-28 2023-08-08 Ebara Corporation Holder for holding substrate and system for plating
CN110359079A (en) * 2018-04-10 2019-10-22 中国科学院半导体研究所 Electroplating clamp

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