JPS5419649A - Wafer holding jig for electrtolytic plating - Google Patents
Wafer holding jig for electrtolytic platingInfo
- Publication number
- JPS5419649A JPS5419649A JP8427177A JP8427177A JPS5419649A JP S5419649 A JPS5419649 A JP S5419649A JP 8427177 A JP8427177 A JP 8427177A JP 8427177 A JP8427177 A JP 8427177A JP S5419649 A JPS5419649 A JP S5419649A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electrtolytic
- holding jig
- wafer holding
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To reduce potential differneces of respective parts and obtain plating film thicknesses of high evenness by holding semiconductor wafers with the protrusions provided to ring-form upper frame and lower frame thereby simultaneously performing the plating treatment in electrolyte for all parts.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8427177A JPS5419649A (en) | 1977-07-15 | 1977-07-15 | Wafer holding jig for electrtolytic plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8427177A JPS5419649A (en) | 1977-07-15 | 1977-07-15 | Wafer holding jig for electrtolytic plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5419649A true JPS5419649A (en) | 1979-02-14 |
Family
ID=13825782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8427177A Pending JPS5419649A (en) | 1977-07-15 | 1977-07-15 | Wafer holding jig for electrtolytic plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5419649A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339319A (en) * | 1980-08-16 | 1982-07-13 | Seiichiro Aigo | Apparatus for plating semiconductor wafers |
US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
JPH0432600A (en) * | 1990-05-30 | 1992-02-04 | Fujitsu Ltd | Method and device for plating |
US5135636A (en) * | 1990-10-12 | 1992-08-04 | Microelectronics And Computer Technology Corporation | Electroplating method |
JP2007119923A (en) * | 1998-11-28 | 2007-05-17 | Acm Research Inc | Methods and apparatus for holding and positioning semiconductor workpiece during electropolishing and/or electroplating of the workpiece |
WO2019003891A1 (en) * | 2017-06-28 | 2019-01-03 | 株式会社荏原製作所 | Substrate holder and plating device |
JP2019007075A (en) * | 2017-06-28 | 2019-01-17 | 株式会社荏原製作所 | Substrate holder and plating device |
CN110359079A (en) * | 2018-04-10 | 2019-10-22 | 中国科学院半导体研究所 | Electroplating clamp |
-
1977
- 1977-07-15 JP JP8427177A patent/JPS5419649A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339319A (en) * | 1980-08-16 | 1982-07-13 | Seiichiro Aigo | Apparatus for plating semiconductor wafers |
JPH0432600A (en) * | 1990-05-30 | 1992-02-04 | Fujitsu Ltd | Method and device for plating |
JP2608485B2 (en) * | 1990-05-30 | 1997-05-07 | 富士通株式会社 | Plating equipment |
US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
US5135636A (en) * | 1990-10-12 | 1992-08-04 | Microelectronics And Computer Technology Corporation | Electroplating method |
JP2007119923A (en) * | 1998-11-28 | 2007-05-17 | Acm Research Inc | Methods and apparatus for holding and positioning semiconductor workpiece during electropolishing and/or electroplating of the workpiece |
WO2019003891A1 (en) * | 2017-06-28 | 2019-01-03 | 株式会社荏原製作所 | Substrate holder and plating device |
JP2019007075A (en) * | 2017-06-28 | 2019-01-17 | 株式会社荏原製作所 | Substrate holder and plating device |
CN110799677A (en) * | 2017-06-28 | 2020-02-14 | 株式会社荏原制作所 | Substrate holder and plating device |
KR20200021919A (en) * | 2017-06-28 | 2020-03-02 | 가부시키가이샤 에바라 세이사꾸쇼 | Board Holders & Plating Devices |
JP2021191902A (en) * | 2017-06-28 | 2021-12-16 | 株式会社荏原製作所 | Substrate holder and plating device |
US11299817B2 (en) | 2017-06-28 | 2022-04-12 | Ebara Corporation | Holder for holding substrate and system for plating |
TWI786136B (en) * | 2017-06-28 | 2022-12-11 | 日商荏原製作所股份有限公司 | Substrate holder and plating device |
US11718925B2 (en) | 2017-06-28 | 2023-08-08 | Ebara Corporation | Holder for holding substrate and system for plating |
CN110359079A (en) * | 2018-04-10 | 2019-10-22 | 中国科学院半导体研究所 | Electroplating clamp |
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