JPH0432600A - Method and device for plating - Google Patents

Abstract

PURPOSE:To prevent the infiltration of a plating soln. into the succeeding device by inclining a holding plate above the plating soln. at the time of pulling up the holding plate to which plural plating electrodes carrying a member to be plated are fixed from a plating bath, etc. CONSTITUTION:A substrate holder H is held by a conveyor mechanism 13 through a hand 18, and a member 3 to be plated is placed on plural plating electrodes 10 fixed to the holding plate 1 of the holder H and pressed by a flat spring 22. The holder H is then dipped in the plating bath to plate the member 3 and then pulled up. At this time, the hand 18 is turned in direction of the arrow a1 along with the holder H above the plating soln. surface to incline the plate 1 of the holder H, and the plating soln. deposited on the member 3 and plate 1 is dropped. Consequently, the infiltration of the plating soln. into the succeeding water washing tank is prevented, the infiltration of cleaning water into the plating bath from the water washing tank before the plating bath is also prevented, and plating is excellently carried out.

Description

[Detailed Description of the Invention] [Summary] Regarding a plating method and a plating processing apparatus in a plating apparatus in which a plate-shaped member to be plated is plated in a horizontal state, the present invention relates to the movement of a processing liquid between a plating tank and front and rear cleaning water tanks. The purpose of this system is to prevent changes in the composition of the plating bath and cleaning water caused by this process, as well as to prevent discoloration and stains on the plating surface. In plating processing equipment where the holding plate is placed in the plating layer and cleaning tank together with the holding plate for plating and cleaning, when the holding plate is pulled up from the plating layer and the cleaning tank, the holding plate is placed above the liquid level. Tilt the plate to drain the liquid better.

[Industrial Application Field] The present invention relates to a plating method and a plating apparatus in a plating apparatus in which a plate-shaped member to be plated is plated in a horizontal state.

[Conventional technology]

To manufacture thin-film magnetic heads, a large number of thin-film magnetic circuits and coils are created on a substrate all at once, and then each thin-film magnetic head is separated at the end. Trying to get a type head.

The lower magnetic pole and upper magnetic pole in a thin-film magnetic head are made by plating permalloy and patterning.

FIG. 6 is a perspective view showing a substrate holder H in a conventional apparatus for plating a substrate for a thin film magnetic head. A window hole 2 is made in the center of a substrate holding plate 1, and a substrate 3 to be plated is placed and held in the window hole 2. A transport frame 5 is attached above the holding plate 1 via a plurality of support columns 4 .

FIG. 7 is a central sectional view of a conventional substrate holder. The lower surface of the holding plate 1 includes a plated electrode plate 6 and an insulating spacer plate 7.
, an auxiliary electrode plate 8 are laminated in this order, and an insulating bolt 9
It is fixed to the holding plate l. The plated electrode plate 6, the insulator spacer plate 7, and the auxiliary electrode plate 8 are ring-shaped, and the plated electrode part 10 protrudes into the window hole 2 of the holding plate l, and the substrate 3 is placed thereon. has been done.

When this substrate holder is placed in a plating bath and the plating electrode plate 6 is connected to the negative electrode of the power source, as shown in FIG.
During plating filling, the substrate 3 is connected to the negative electrode of the power source, and the auxiliary electrode plate 8 is also connected to the negative electrode of the power source. In the plating bath, an anode plate 12 is disposed facing the substrate 3.

In this way, by disposing the auxiliary electrode plate 8 near the substrate 3, which is the member to be plated, so that the auxiliary electrode plate 8 is also plated, the plating process on the substrate 3 can be uniformly performed. .

[Problems to be Solved by the Invention] The substrate 3 is plated in a horizontal state in the plating tank 11, and when the plating process is finished, the transport mechanism 13 disposed above the plating tank 11 is moved to the bottom. Then, the substrate holder H is lifted out of the plating tank by rising with the hook 14 engaged with the hook 15 of the transport frame 5. After the transport mechanism 13 moves to the top of the next cleaning tank, it descends and immerses the substrate 3 in the cleaning tank to perform cleaning. Water washing after this plating treatment is usually performed about five times. Further, as a pretreatment for plating, water washing is performed about three times. Therefore, three pre-treatment rinsing tanks are arranged before the plating tank, and five post-treatment rinsing tanks are arranged after the plating tank.

When the plating process in the plating tank is completed, the substrate holder is lifted up from the plating solution in the plating tank by the transport mechanism 13 as described above, but since the plating process in the plating tank is performed with the substrate 3 in a horizontal state, Even when the substrate 3 is pulled up from the plating solution, the plating solution 16 remains on the substrate 3 and the holding plate 1 in a raised state due to surface tension, as shown in FIG. Therefore, the plating solution 16 containing many cationized molecules near the negative polarity is always carried to the next post-processing washing tank.
As a result, the composition of the plating bath in the plating tank gradually changes.

Also, when transferred from the pre-treatment washing tank to the plating tank,
The pretreatment cleaning water remaining on the substrate 3 and the holding plate 1 when lifted from the pretreatment washing tank is carried into the plating tank. As a result, the plating bath is diluted with water, and the composition of the plating bath changes more quickly, resulting in extremely poor stability.

When transferred between each pre-treatment rinsing tank or between each post-treatment rinsing tank, the purity of the washing water in each tank decreases as the washing water is transferred to the next tank. go.

As mentioned above, the plating electrode [6] consisting of a ring-shaped plate, the insulator spacer plate 7, and the auxiliary electrode plate 8 are stacked and fixed on the lower surface of the holding plate 1, and the plating solution is also applied to the gap between them. This also allows the plating solution and cleaning water to move between species.

Another problem is that the lower surface 17 of the substrate 3, that is, the surface on which the plating process has been performed, tends to discolor and stain. When the substrate holder is lifted out of the plating bath, the plating solution adhering to the substrate 3 is removed from the bottom surface 17 where the plating process has been performed.
At this point, it becomes a water droplet. As these water droplets grow in size, they eventually fall under their own weight. In this way, the plating surface 1 of the substrate 3
When water droplets are locally generated in step 7, the plating action of the plating solution progresses only in that area, resulting in discoloration and staining, deteriorating the plating quality.

The technical problem of the present invention is to focus on such problems, and to prevent changes in the composition of the plating bath and cleaning water caused by the movement of processing liquid between the plating tank and the front and rear cleaning tanks, and to improve the quality of the plating surface. The purpose is to prevent discoloration and stains.

(Means for Solving the Problems) Fig. 1 is a partial cross-sectional side view illustrating the basic principle of the plating method and plating processing apparatus according to the present invention. A member to be plated (substrate) 3 is placed on a plurality of plating electrodes 10 attached to the plating layer and is placed in a cleaning tank to perform plating and cleaning.

Claim 1: The transport mechanism 13 includes a hand portion 18 that grips the holder H.
is attached, and this hand portion 18 can rotate in the direction of arrow a1 while gripping the holder H. When pulling up the holder H holding the plated member 3 from the plating layer and the cleaning tank, the holding plate 1 of the holder H is tilted by rotating the hand portion 18 at a position above the liquid level.

Claim 2 The holding Fi,l of the substrate holder H used in the method according to claim 1 has a window hole 2 at which the member to be plated is attached.
A plurality of plating electrodes 10 attached to the lower surface of the holding plate 1 protrude into the window hole 2, and plating and cleaning are performed with the substrate 3, which is the member to be plated, placed thereon. It will be done.

The edge of the window hole 2 is tapered as shown at 19 on the upper side of the holding plate 1. Moreover, when the holding plate 1 is tilted by the method according to claim 1, the inclination angle β of the window hole edge 20 located on the lower side is smaller than the inclination angle α of the tapered inclined portion 19. .

Claim 3 The holding plate 1 of the substrate holder H used in the method according to claim 1 has a window hole 2 at the position where the member to be plated is attached, and a plurality of plating plates attached to the lower surface of the holding plate 1. Plating and cleaning are performed with the electrode 10 protruding into the window hole 2 and the substrate 3, which is a member to be plated, placed thereon.

A plated electrode plate 6 with a window hole and an auxiliary electrode plate 8 with a window hole are attached to the lower surface of the second holding plate 1 with an insulator spacer 21 in between, and a plurality of plated electrode plates 6 protrude into the window hole 2. The member to be plated 3 is placed on the plating electrode IO formed on the tongue piece 6b.

Insulator 2 between the plated electrode plate 6 and the auxiliary electrode plate 8
1 is disposed at a plurality of locations and in a local area, and acts as a spacer.

Further, the lower surface of the holding plate 1 and the plated electrode plate 6 are in contact with each other at multiple locations and in local areas, and the plated electrode plate 6, the insulating spacer 21, and the auxiliary electrode plate 8 are is fixed to the retaining plate l in a local area of .

[Effect]

Claim 1: Since the horizontal holding plate 1 is tilted above the plating bath, the plating solution on the substrate 3, which is the member to be plated, and the holding plate 1 easily flows down along the slope. As a result, problems such as the plating solution being taken out to the next post-treatment washing tank and the composition of the plating bath changing can be suppressed. In addition, since the holding plate 1 is tilted in the same way when lifting from each washing tank, compositional fluctuations in the plating bath due to wash water being brought into the plating tank when transferred from the pre-treatment washing tank to the plating tank are also suppressed. be done.

In addition, since the holding plate 1 is tilted immediately after being lifted from the plating bath 11, the plating solution on the plating surface 17 of the substrate 3 also flows down smoothly, so water droplets will not float on the plating surface 17 of the substrate 3. (Prevents discoloration and stains caused by water droplets.

Claim 2: The upper edge of the window hole 2 of the holding plate 1 is tapered as shown at 19 so that the board 3 can be easily mounted. However, when the holding plate l is tilted, the lower part becomes almost horizontal as shown by the chain line, and the plating solution accumulates in this part. It becomes easier. However, in the present invention, the angle of inclination of the lower part where the plating solution tends to accumulate is extremely small, as shown by β, so that when the holding plate 1 is tilted, the angle of inclination is the same as that of the surface of the substrate 3, etc. The plating solution flows down reliably and smoothly without accumulating.

Claim 3: On the lower surface of the holding plate l of the substrate holder H used in the method according to claim 1, a plating electrode Fi6 with a window hole and an auxiliary electrode Fi8 with a window hole are arranged with an insulator spacer 21 in between. The installation is fixed with this insulator spacer 2.
1 are arranged at multiple locations and in localized areas. Therefore, the area without the insulator spacer 21 becomes a space, and the only area where a minute gap between adjacent members, through which the plating solution permeates, occurs is the insulator spacer 210 portion. As a result, the conventional problem of plating solution and cleaning water penetrating into minute gaps, accumulating therein, and being transferred to the next tank is resolved.

Furthermore, since the holding plate 1 and the plating electrode IfJi6 are in contact with each other at multiple locations and in a localized area, the area of the gap is greatly reduced in this area as well, and the plating solution and cleaning water are in contact with each other. The amount of seepage can be suppressed.

〔Example〕

Next, examples will be used to explain how the plating method and plating apparatus according to the present invention are actually implemented.

Embodiment of Claim 1 When the substrate 3 is pulled up from the plating tank or the cleaning tank, the angle of inclination of the holding plate 1 is preferably around 45 degrees, but it may be tilted to a larger angle. It only takes a few seconds to tilt. Also, rotate the holding plate 1 at 45 degrees or 45 degrees in the opposite direction.
By tilting it more than a degree, it is possible to tilt it in the opposite direction or swing it several times above the liquid level.

The rotation and swing of the substrate holder H is controlled by the hand unit 18 by a motor M attached to the transport mechanism 13, for example, as shown in the figure.
This is possible by rotating the .

The hand portion 18 can be opened and closed by using the motor M or by using a separately provided air cylinder.

Embodiment 2 FIG. 2 is a plan view and a sectional view taken along line bb, showing an embodiment of a holding plate for a member to be plated. As is clear from the plan view shown in (a), the upper edge of the window hole 2 formed in the holding Fi, 1 has a tapered slope as shown by 19,
The board 3 can be easily inserted into the window hole 2.

Further, when the holding plate 1 is tilted, the inclination angle β of the window hole edge 12 [D] located on the lower side is small. This angle is
A temperature of several degrees to around 10 degrees is suitable.

Further, the lower edge portion 20 of this window hole also serves as a retraction portion for the pressing leaf spring 22 of the substrate 3. A leaf spring 22 is used to press the substrate 3 so that it does not move or fall when the holding plate 1 is tilted or during transportation. FIG. 3 is a cross-sectional view taken along line III-III in FIG.
One end 23 of the leaf spring 22 bent into a letter shape is attached to the screw 2.
4, it is rotatably supported on the upper surface of the holding plate 1, and the downwardly bent portion 25 at the tip is pressed against the upper surface of the substrate 3 by spring force.

This leaf spring 22 is attached with screws 2 as shown by the chain line.
4 to the lower edge 20 side, the holding part of the board 3, that is, the downward bent part 25, touches the lower edge 2.
0 and falls, and the pressing force on the substrate 3 is released.

In this way, by reducing the inclination angle of the lower edge 20 of the window hole 2, a retraction area for the substrate pressing spring 22 is formed,
Further, a step is formed between the upper surface of the substrate 3 and the upper surface of the substrate 3. Therefore, when the suction arm moves in the direction of arrow a2 and hits the upward protrusion 26 of the leaf spring 22, the leaf spring 22 slides on the upper surface of the board 3 and finally falls onto the lower edge 20. . Next, the substrate 3 can be taken out using a suction cup or the like, making automation possible.

Note that after inserting the next board into the window hole 2, the leaf spring 22
The moving from the lower edge 20 onto the substrate 3 is done manually.

Embodiment 3 FIG. 4 is an exploded perspective view showing how the plated electrode plate 6, the insulating spacer 21 and the auxiliary electrode plate 8 are attached to the lower surface of the holding plate 1. The holding plate 1 is made of an insulator, and mounting seats 27 are integrally formed on the lower surface of the holding plate 1 at a plurality of locations around the window hole portion 2 and protruding by a step t. Each installation has an insertion hole 28 for a fixed nand at the position of the seat 27,
Dowels 29 and 30 for positioning are formed.

The plated electrode plate 6 and the auxiliary electrode plate 8 attached to the back surface of the holding plate 1 have window holes 6a and 8a of approximately the same size as the window hole 2 of the holding plate 1. Furthermore, the plated electrode plate 6 is attached to the holding plate 1 at a position corresponding to the seat 27...
It has a tongue piece 6b that protrudes toward the window hole 6a side. Similarly, the auxiliary electrode plate 8 is attached to the holding plate 1 at the seat 27...
At a position corresponding to the tongue piece 8b protruding toward the window hole 8a side...
·have.

Further, the auxiliary electrode plate 8 has nuts 35 fixedly attached thereto at positions corresponding to the respective tongues 8b, as shown in FIG.

21 is an insulating spacer, which is sandwiched between the plated electrode plate 6 and the auxiliary electrode plate 8. The conventional insulating spacer has a ring shape with a window hole like the plated electrode plate 6 and the auxiliary electrode plate 8, so it contacts the plated electrode plate 6 and the auxiliary electrode plate 8 on its entire surface, reducing the area of the minute gap. becomes larger. Therefore, there was a problem that a large amount of plating solution and cleaning water seeped into the plate. In the present invention, as shown in the figure, the insulating spacer 2
1 is attached to a small piece having an insertion hole 31 for a nut 35, an insertion hole 32, 33 for a positioning dowel 29, 30, and a tongue piece 34.

When assembling, the holding plate 1 is attached by placing the plated electrode plate 6 on the seat 27, and placing four insulating spacers 2 on top of it.
The auxiliary electrode plate 8 is placed with 1... sandwiched therebetween.

At this time, the nut 35 of the auxiliary electrode plate 8 passes through the hole 31 of the insulating spacer 21 and the hole 6c of the plated electrode plate 6, and enters the nut storage hole 28 of the holding plate 1. Also, the installation is done on seat 2.
The dowels 29 and 30 of No. 7 are the positioning holes 3 of the plating electrode plate 6.
6. Through 37, the positioning hole 3 of the insulating spacer 21
Insert into 2.33. In this state, holding Fj,1
By inserting the bolt 38 from the opposite side and fitting it to the nut 35, the assembly is completed as shown in FIG.

In this assembled state, the tongue piece 6b of the plating electrode plate 6 is placed on the tongue piece 8b of the auxiliary electrode plate 8 with the tongue piece 34 of the insulating spacer 21 in between.

Then, a plating electrode 10 is attached to the tongue piece 6b of the plating electrode plate 6.
is formed in a protruding shape, so when a substrate is placed on the plating electrode 10, the load is transferred to the tongue piece 8 of the auxiliary electrode plate 8.
Supported by b.

The seat 27 and the insulating spacer 21 are installed between the holding plate 1 and the plated electrode plate 6, and between the plated electrode plate 6 and the auxiliary electrode plate 8.
This is to create a gap between the plating solution and cleaning water that is at least 0.
It requires a thickness of about 5 to 1.0 mm. The holding plate 1 may be mounted in a flat shape without forming the seat 27, and a small insulating spacer similar to the insulating spacer 21 may be sandwiched therebetween.

It should be noted that the plated electrode plate 6 is coated with Teflon on the area other than the plated electrode 10, and the auxiliary electrode plate 8 is coated with Teflon on the side facing the plated electrode plate 6.

The bolts 35 and bolts 38 are also coated with Teflon to insulate their surfaces.

[Effects of the Invention] As described above, according to the present invention, a space is provided between the plating electrode plate 6, the holding plate 1, and the auxiliary electrode plate 8 to prevent the plating solution and cleaning water from penetrating. At the same time, when the substrate 3, which is a member to be plated, is pulled up from the plating tank or the cleaning tank, the substrate 3 is tilted above the liquid level, so that the plating solution and cleaning water easily and reliably flow down. Also, the board 3
To prevent processing liquid from accumulating on the lower edge of the window hole when mounting the board, the angle of inclination is made smaller only on the lower side.
Since the inclination is about the same as that of the substrate 3, the processing liquid is less likely to accumulate.

As a result, the problem of plating solution being carried out to the next cleaning tank, or cleaning water being brought into the plating tank from the pre-treatment rinsing tank, changes the composition of the plating bath and makes the bath composition unstable. be done.

In addition, water drains better and there is no risk of water droplets forming and floating on the plated surface of the substrate 3, which eliminates problems such as discoloration and staining of the plated surface.

[Brief explanation of the drawing]

Fig. 1 is a partially sectional side view explaining the basic principle of the plating method and plating processing apparatus according to the present invention, Fig. 2 is a plan view and a sectional view showing an embodiment of a holding plate for a member to be plated, and Fig. Figure 2 is a cross-sectional view taken along ■-■ in Figure 2, Figure 4 is an exploded perspective view showing how the plated electrode plate, insulating spacer, and auxiliary electrode plate are attached to the lower surface of the retainer plate, and Figure 5 is an exploded perspective view showing the attachment of the plated electrode plate, insulating spacer, and auxiliary electrode plate to the lower surface of the retainer plate. FIG. 6 is a perspective view of a substrate holder in a conventional plating device; FIG. 7 is a central sectional view of a conventional substrate holder; FIG. It is a wiring diagram in a plating processing apparatus. In the figure, H is a substrate holder, 1 is a holding plate, 2 is a window hole, 3 is a member to be plated (substrate), 6 is a plating electrode plate, 6
a is the window hole part, 6b is the tongue piece, 6c is the slot, G is the insertion hole, 7.2
1 is an insulating spacer, 8 is an auxiliary electrode plate, 8a is a window hole portion, 8
b is a tongue piece, 10 is a plating electrode, 13 is a transport mechanism, 16 is a plating treatment liquid, 17 is a plating surface (lower surface of the substrate), 18 is a hand part, 19 is a tapered inclined surface, 20 is a lower edge, 2
2 is a leaf spring (substrate holding spring), 26 is an upward protrusion,
Reference numeral 27 indicates a mounting seat, 28 indicates a nut storage hole, 35 indicates a nut, and 38 indicates a bolt. Patent Applicant Fujitsu Co., Ltd. Sub-Agent Patent Attorney Yasushi Fukushima Text of the Invention Kiho Rirman/r21 Figure 4, 82, Figure 5, 86

Claims (1)

[Claims] 1. A plurality of plating electrodes (10
), the plated member (3) is placed in the plating layer and cleaning tank together with the holding plate (1), and plating and cleaning are carried out in the plating processing equipment. A plating method characterized in that the holding plate (1) is tilted at a position above the liquid level when the holding plate (1) is pulled up. 2. The holding plate (1) used in the method according to claim 1 has a window hole (2) at the position where the member to be plated (3) is attached, and the plated member (3) is attached to the lower surface of the holding plate (1). multiple electrodes (
10) protrudes into the window hole (2) and the member to be plated (3) is placed on top of it, and the edge of the window hole (2) is connected to the holding plate (1). ) has a tapered upper side, and the retaining plate (1) is formed by the method according to claim 1.
A plating apparatus characterized in that the inclination angle (β) of the window hole edge (20) located on the lower side when the window hole edge (20) is tilted is smaller than the inclination angle (α) of the tapered inclined portion. 3. The holding plate (1) used in the method according to claim 1 has a window hole (2) at the position where the member to be plated (3) is attached, and on the lower surface of this holding plate (1), The plated electrode plate (6) with a window hole and the auxiliary electrode plate (8) with a window hole are attached with an insulating spacer (21) in between, and the plated electrode plate (6) is attached.
A plurality of tongue pieces (6b) are made to protrude into the window hole (2) from the window hole (2),
A member to be plated (3) is placed on the plating electrode (10) formed on the tongue (6b), and between the plating electrode plate (6) and the auxiliary electrode plate (8). The above-mentioned insulating spacer (21) is sandwiched in a plurality of places and in a local area, and the holding plate (
1) The lower surface of the plated electrode plate (6) is in contact with the plated electrode plate (6) at multiple locations and in local areas, and the plated electrode plate (6), the insulator spacer (21), and the auxiliary electrode plate (8) are in contact with each other at multiple locations and in local areas. . A plating apparatus, characterized in that it is fixed to a holding plate (1) in the plurality of local areas.