JP2008174770A - Plating fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating fixture, which reduces an amount of a plating solution carried out by a plating fixture, finely adjusts power-feeding electrodes connected to a surface side of a wafer, and performs rapid detachment and attachment of the wafer. <P>SOLUTION: The plating fixture 1 is composed of a fixture body 3, a plurality of resilient plate-like power-feeding electrodes 15A, 15B and 15C and a substrate attachment/detachment device 23. The fixture body 3 is equipped with a plating hole 9 and a substrate-holding part 11 installed along the edge of the plating hole 9, wherein an electronic circuit card 7 to be plated is placed on the substrate-holding part 11 with its surface 7A facing outward. The power-feeding electrodes 15A, 15B and 15C are installed at a plurality of sites on the substrate-holding part 11 and form connections with the electronic circuit card 7 by a bias working in the direction of holding down the surface 7A of the electronic circuit card 7 with tips of the plate-like power-feeding electrodes. The substrate attachment/detachment device 23 detaches and releases each of the power-feeding electrodes 15 from the surface 7A of the electronic circuit card 7 by resisting against the bias or fixes the electronic circuit card 7 by holding down the electronic circuit card 7 by the bias. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plating jig, and more particularly to a plating jig for holding an electronic circuit board such as a wafer to be plated and plating the surface of the electronic circuit board. The plating jig relates to a wafer plating process in the semiconductor package field, and affects the product.

  Generally, for example, the surface of a wafer as an electronic circuit board on which a semiconductor is mounted is plated with copper. For this purpose, after the wafer is set and held on the plating jig, the entire plating jig is immersed in, for example, a copper plating solution in a plating tank to perform copper plating.

  Referring to FIG. 8, as a conventional plating jig 101, for example, as shown in Patent Document 1, a plate-like base member 103 is provided along the opening periphery of an opening 105 that penetrates vertically. A plurality of power supply electrodes 107 are provided. The first seal member 109 has a ring shape arranged along the opening periphery of the opening 105 of the base member 103, and the surface 111 </ b> A of the wafer 111 formed in a plate shape is electrically connected to the power supply electrode 107. It is the structure set and mounted so that it may connect. In FIG. 8, on the outer peripheral side of the first seal member 109, there is provided an elastic body 109a on which the horizontal portion of the power supply electrode 107 is placed and has an elastic reaction force against a load from above.

  The cover member 113 covers the entire back surface 111B of the wafer 111 set on the first seal member 109. The pressing member 115 contacts between the cover member 113 and the back surface 111B of the wafer 111 to press the wafer 111 toward the first seal member 109. The pressing member 115 and the wafer 111 are in contact with each other via a ring-shaped elastic member 117, and a screw-type projection 119 is formed in the center of the pressing member 115 so as to protrude toward the cover member 113. The presser member 115 and the cover member 113 are in contact with each other via the protrusion 119.

  The second seal member 121 has a ring shape arranged along the outer periphery of the pressing member 115. The cover member 113 and the base member 103 are configured to be fastened with, for example, screws 123 as a plurality of fasteners with the second seal member 121 interposed therebetween.

Therefore, when the cover member 113 and the base member 103 are fastened by a plurality of fastener screws 123, the pressing member 115 causes the ring-shaped elastic member 117 to move through the protrusion 119 due to the pressing force W of the cover member 113. Then, the wafer 111 is pressed toward the first seal member 109 so that the wafer 111 is sealed by the ring-shaped first seal member 109 disposed around the surface 111A with which the plating solution of the wafer 111 contacts. Further, the back surface 111 </ b> B side of the wafer 111 is sealed with a second seal member 121 sandwiched between the cover member 113 and the base member 103. As a result, when copper plating is performed on the wafer 111 set and held on the plating jig 101, the plating solution can be surely prevented from leaking to the back surface 111 </ b> B of the wafer 111.
JP 2006-16649 A

  By the way, the conventional plating jig 101 of Patent Document 1 is roughly divided into three members: a base member 103, a pressing member 115, and a cover member 113. There was a problem that the amount of carry-out was large and the running cost of the plating solution and the load on wastewater treatment were high.

  Further, when pressing the pressing member 115 with a fastener such as a clamper, the pressing force W against the wafer 111 cannot be controlled, and it takes time to attach and detach the wafer 111. In addition, when pressing using the fasteners of the plurality of screws 123, it takes a lot of adjustment time to control the pressing force W on the wafer 111, and the plurality of screws 123 are tightened or loosened and removed. There was a problem that it took time to desorb. In brief, the conventional plating jig 101 is roughly composed of three members, that is, a base member 103, a pressing member 115, and a cover member 113. Therefore, it takes time to attach and detach the wafer 111.

  Further, the conventional plating jig 101 has a problem in that fine adjustment of the connection position of the feeding electrode 107 cannot be performed after the wafer 111 is attached.

  Further, since the resist film has to be pierced by the power supply electrode 107 on the wafer 111 where the power supply electrode 107 is connected, the conventional plating jig 101 is difficult to adapt. There was a point.

  When the multi-layer plating process is performed, the conventional plating jig 101 is roughly composed of the base member 103, the pressing member 115, and the cover member 113 as described above. Since the amount of the plating solution brought out due to adhesion to the surface is large, it has been required to reduce the number of constituent members of the plating jig 101. Moreover, since the power supply electrode 107 needs to be connected to the seed layer in order to perform multilayer plating on the surface of the copper layer, the resist layer exposed on the outer peripheral surface of the wafer 111 by the power supply electrode 107 as described above. However, the conventional plating jig 101 is difficult to adapt.

In order to achieve the problem to be solved by the present invention, a plating jig of the present invention includes a substrate mounting portion that includes a hole for plating and places the surface of the electronic circuit board to be plated facing outward. A jig body provided along the periphery of the plating hole;
A plate-like power supply electrode having elasticity arranged at a plurality of locations on the substrate mounting portion, and is applied to the electronic circuit board with a biasing force in a direction of sandwiching the surface of the electronic circuit board from above with the plate-shaped tip. A plurality of feeding electrodes to be connected;
A substrate detaching device that switches the power supply electrodes to be released from the surface of the electronic circuit substrate against the biasing force, and to switch the electronic circuit substrate to be sandwiched and fixed by the biasing force of the power supply electrodes; It is characterized by being comprised.

  Further, the plating jig of the present invention is the plating jig, wherein the substrate detaching device separates the power supply electrode from the surface of the electronic circuit board against the biasing force, and the power supply electrode. A shaft member constituted by a small-diameter portion that can be returned to the original position where the electronic circuit board is sandwiched by the urging force is provided so as to be slidable in a direction substantially perpendicular to the extending direction of the feeding electrode below each feeding electrode. Is preferred.

  In the plating jig of the present invention, in the plating jig, the substrate detaching apparatus places at least one of the plurality of feeding electrodes on the plurality of board mounting portions. It is preferable to be provided so as to be able to advance and retract toward the substrate.

  As understood from the means for solving the problems as described above, according to the plating jig of the present invention, when roughly classified, it is constituted only by the jig main body, so that a pool of plating solution is generated. There is no place, and the amount of plating solution taken out can be reduced.

  In addition, since the plurality of power supply electrodes are exposed on the jig body, it is possible to easily visually check whether or not each power supply electrode is connected to the surface of the electronic circuit board. Therefore, even in an electronic circuit board in which a resist layer is formed at a place where power supply is connected, since the power supply electrode can easily break through the resist layer and connect the power supply, for example, multilayer plating can be performed. .

  In addition, a plurality of power supply electrodes are provided on the jig body so as to be exposed, and a substrate detaching device is provided so that each power supply electrode is released from the electronic circuit board against the urging force, or each power supply electrode is attached. Since the electronic circuit board can be switched so as to be fixed by force, the power feeding electrodes can be easily finely adjusted after the electronic circuit board is set on the jig body. In addition, the electronic circuit board can be quickly attached and detached, and the removal time can be greatly reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIGS. 1 to 3, a plating jig 1 according to this embodiment has a jig body 3 having a rectangular flat plate shape and made of vinyl chloride, and is provided with a clamping hole 5 at the top. In the lower part, for example, a surface 7A of a wafer 7 as an electronic circuit board to be plated is provided with a plating hole 9 penetrating vertically in FIG. At this time, the wafer 7 is previously plated with copper, and the surface 7A of the copper layer is subjected to multilayer plating.

  Further, as shown in FIG. 1, a substrate placement portion 11 for placing the surface 7 </ b> A of the wafer 7 facing outward is provided along the periphery of the plating hole 9. The substrate mounting portion 11 can be configured to place the wafer 7 directly on the entire periphery of the plating hole portion 9, but in this embodiment, at least three power supply blocks 13A, 13B, and 13C are used for plating. The substrate mounting portion 11 is configured by being provided with a substantially uniform arrangement along the peripheral edge of the hole portion 9, for example, at an interval of an angle of about 120 °. The power supply block 13A is located at the upper part of the jig body 3, and the power supply blocks 13B and 13C are located at the lower part of the jig body 3.

  Further, the substrate mounting portion 11 is provided with power supply electrodes 15 for energizing the wafer 7 in at least three places. In this embodiment, three power supply electrodes 15A, 15B, and 15C are provided corresponding to the above three power supply blocks 13A, 13B, and 13C, and each of the power supply electrodes 15A, 15B, and 15C has an elastic band. It is formed in a plate shape.

  As shown in FIG. 3, at least three power supply terminal portions for supplying power to the wafer 7 located below the clamp hole portion 5 are provided on the back surface of the jig body 3. For example, the electrode pins 17 are exposed, and conductive wires 19 are provided to connect the electrode pins 17 to the power supply electrodes 15A, 15B, and 15C. The conductive wire 19 is made of a titanium cable.

  Further, one wafer support block 21 for temporarily placing the wafer 7 is provided between the power supply blocks 13A and 13B and between the power supply blocks 13A and 13C. That is, the wafer support block 21 temporarily supports the wafer 7 in order to prevent the wafer 7 from dropping when the wafer 7 is set on the substrate platform 11.

  Further, the substrate mounting portion 11 is provided with a substrate detaching device 23 for switching the power feeding electrodes 15A, 15B, and 15C to be connected to and separated from the wafer 7.

  The substrate desorbing device 23 will be described in detail with reference to the drawings. The substrate detaching apparatus 23 is substantially the same at the positions of the feeding electrodes 15A, 15B, and 15C, and therefore, the substrate detaching apparatus 23 for the feeding electrode 15A will be described as an example.

  4 and 7 together, the power supply block 13A includes a wafer mounting table 25 positioned on the lower side in FIG. 4 and mounting the wafer 7, and both left and right sides of the wafer mounting table 25 in FIG. Left and right side walls 27A and 27B, a slide rail 29 arranged on the upper side in FIG. 4, and a slide member 31 that is guided by the slide rail 29 and slides up and down in FIG. Yes.

  Further, the power supply electrode 15 </ b> A is positioned on the slide member 31 approximately at the center of the left-right width in FIG. 4 and fixed by a shaft screw member 33. The shaft screw member 33 extends vertically in FIG. 5 so that the shaft screw member 33 is inserted into a long hole 35 provided in the jig body 3 in the same direction as the slide direction of the slide member 31 and protrudes from the back side of the jig body 3. Stretched. A conductive wire 19 connected to the electrode pin 17 described above is connected and fixed to the lower end of the shaft screw member 33 in FIG.

  Further, as shown in FIGS. 4 and 5, the feeding electrode 15A has a horizontal piece 39 formed in a strip shape having elasticity, and a substantially right angle downward from the tip of the horizontal piece 39 in FIG. It is comprised by the terminal piece 41 bent by. As described above, the rear end side of the horizontal piece 39 is fixed to the slide member 31 by the shaft screw member 33, and the tip of the terminal piece 41 on the front end side of the horizontal piece 39 has, for example, a plurality of chevron shapes. The wafer 7 placed and set on the mounting table 25 is surely pierced.

  Therefore, the feeding electrode 15A is connected to the wafer 7 by the biasing force in the direction of sandwiching the surface 7A of the wafer 7 from above at the tip of the terminal piece 41 on the tip side of the elastic band plate, and the wafer 7 is fixed. can do.

  Further, as the substrate detaching device 23, a shaft member 47 constituted by a large diameter portion 43 and a small diameter portion 45 is provided on the left and right side walls 27A and 27B of the wafer mounting table 25 via bushes 49, and the feeding electrode 15A. On the lower side, it is slidable in a direction substantially perpendicular to the extending direction of the feeding electrode 15A. 4 and 5, the large diameter portion 43 separates the terminal piece 41 of the feeding electrode 15A from the surface 7A of the wafer 7 against the urging force. As shown in FIGS. 6 and 7, the portion 45 returns the power supply electrode 15 </ b> A to the original position where the wafer 7 is sandwiched by the biasing force.

  Further, both end sides of the shaft member 47 are slidably supported by collar members 51 provided on the jig body 3.

  Note that the substrate removal apparatus 23 of the power supply blocks 13B and 13C is not provided with the slide rail 29 and the slide member 31 of the substrate attachment / detachment apparatus 23 of the power supply block 13A, and the others are the same.

  With the above configuration, as shown in FIG. 2, the wafer 7 faces the front surface 7 </ b> A outward, that is, the back surface 7 </ b> B of the wafer 7 is the peripheral edge of the plating hole 9 of the jig body 3 of the plating jig 1. 4, the slide member 31 is indicated by a two-dot chain line in FIG. 4 in the substrate detachment apparatus 23 of the power supply block 13 </ b> A. As shown in FIG. 4, the power supply electrode 15 </ b> A is also retracted. Further, in the substrate attachment / detachment device 23 of the power supply blocks 13A, 13B, and 13C, the shaft member 47 is arranged such that the large diameter portion 43 is positioned below the power supply electrodes 15A, 15B, and 15C as indicated by the arrows in FIG. To the right.

  Accordingly, each of the power supply electrodes 15A, 15B, and 15C is lifted upward against the above-described downward biasing force by the large diameter portion 43 of the shaft member 47 as shown in FIG. , 15B, 15C, the tips of the terminal pieces 41 are separated from the wafer mounting table 25. FIG. 5 shows a state in which the slide member 31 and the power supply electrode 15A are moving forward. Actually, however, the slide member 31 and the power supply electrode 15A are moved backward before the wafer 7 is placed. When the wafer 7 is placed, the terminal piece 41 on the distal end side of the feeding electrode 15A does not get in the way.

  As a result, the wafer 7 is easily mounted on the wafer mounting table 25 of the power supply blocks 13A, 13B, and 13C. At this time, the wafer 7 is temporarily supported and temporarily placed (temporarily fixed) by the wafer support block 21 so as not to fall, and then positioned at a predetermined position of the wafer mounting table 25 of the power supply blocks 13A, 13B, and 13C. Tweaked.

  Next, in the substrate attaching / detaching device 23 of the power supply block 13A, the slide member 31 is advanced downward in FIG. 4 as shown by the solid line in FIG. 4, and thereby the power supply electrode 15A is advanced.

  Then, in the board | substrate removal | desorption apparatus 23 of electric power feeding block 13A, 13B, 13C, as the shaft member 47 is shown by the arrow of FIG. 6, the small diameter part 45 is located below electric power feeding electrode 15A, 15B, 15C. Moved to the left. Accordingly, each of the power supply electrodes 15A, 15B, 15C is moved to the lower original position by the aforementioned biasing force by the small diameter portion 45 of the shaft member 47 by the difference from the large diameter portion 43 as shown in FIG. Therefore, the terminal pieces 41 of the power supply electrodes 15A, 15B, and 15C can easily connect to the wafer 7 by sandwiching the wafer 7 of the wafer mounting table 25, and can fix the wafer 7.

  Further, when removing the wafer 7 from the plating jig 1, it can be easily performed by performing an operation opposite to the operation of mounting the wafer 7 on the plating jig 1 described above.

  As described above, the plating jig 1 according to this embodiment is roughly composed of only the jig body 3, so that there is no place where the plating liquid pool is generated, and the amount of the plating liquid taken out is reduced. Reduction can be achieved.

  Further, since the plurality of power supply electrodes 15A, 15B, and 15C are provided on the jig body 3 so as to be exposed, it is possible to easily visually check whether or not the power supply electrodes 15A, 15B, and 15C are connected to the surface 7A of the wafer 7. . Therefore, even in the wafer 7 in which a resist layer is formed at a place where power supply is connected, the power supply electrode 15A, 15B, 15C can easily break through the resist layer and be connected to supply power. It can be performed.

  In addition, the plurality of power supply electrodes 15A, 15B, and 15C are provided on the jig body 3 so as to be exposed, and the substrate detachment device 23 is provided, so that each of the power supply electrodes 15A, 15B, and 15C is resisted against the biasing force. Since the wafer 7 can be switched to be released or fixed by the urging force, the power supply electrodes 15A, 15B, and 15C can be easily finely adjusted after the wafer 7 is placed and set on the jig body 3. can do.

  That is, by using the shaft member 47 constituted by the large diameter portion 43 and the small diameter portion 45, the substrate detaching device 23 of the power supply blocks 13A, 13B, 13C can be installed on the surface of the jig body 3. The power supply electrodes 15A, 15B, and 15C can be easily attached to and detached from the wafer 7 with a simple structure, and the wafer 7 can be easily finely adjusted by the wafer mounting table 25.

  In addition, since the substrate desorbing device 23 is provided as described above, the demounting of the wafer 7 can be performed quickly, and the desorption time can be greatly reduced.

It is a top view of the surface side of the plating jig of embodiment of this invention. It is sectional drawing of the arrow II-II line | wire of FIG. It is a top view of the back surface side of FIG. FIG. 4 is an enlarged plan view of the substrate detaching apparatus in the IV part of FIG. 1. It is sectional drawing of the arrow VV line | wire of FIG. FIG. 4 is an enlarged plan view of the substrate detaching apparatus in the IV part of FIG. 1. It is sectional drawing of the arrow VII-VII line of FIG. It is sectional drawing of the conventional plating jig.

Explanation of symbols

1 Plating jig 3 Jig body 5 Clamping hole 7 Wafer (electronic circuit board)
7A Surface (of wafer)
7B Back side (wafer)
9 Plating hole 11 Substrate placement part 13, 13A, 13B, 13C Power supply block 15, 15A, 15B, 15C Power supply electrode 17 Electrode pin (power supply terminal part)
19 Conductive wire 21 Wafer support block 23 Substrate removing device 25 Wafer mounting table 27A, 27B Left, right side wall 29 Slide rail 31 Slide member 33 Shaft screw member 35 Long hole 37 Nut member 39 Horizontal piece 41 Terminal piece 43 Large diameter portion 45 Small diameter Part 47 Shaft member

Claims (3)

A jig body provided with a substrate mounting portion provided with a plating hole portion and mounted on the outer periphery of the surface of the electronic circuit board to be plated along the periphery of the plating hole portion;
A plate-like power supply electrode having elasticity arranged at a plurality of locations on the substrate mounting portion, and is applied to the electronic circuit board with a biasing force in a direction of sandwiching the surface of the electronic circuit board from above with the plate-shaped tip. A plurality of feeding electrodes to be connected;
A substrate detaching device that switches the power supply electrodes to be released from the surface of the electronic circuit substrate against the biasing force, and to switch the electronic circuit substrate to be sandwiched and fixed by the biasing force of the power supply electrodes; A plating jig characterized by comprising.   The substrate detaching device has a large diameter part that moves the power supply electrode away from the surface of the electronic circuit board against the biasing force, and a small diameter that returns the power supply electrode to the original position that sandwiches the electronic circuit board by the biasing force. The plating jig according to claim 1, wherein a shaft member constituted by a portion is provided so as to be slidable in a direction substantially orthogonal to the extending direction of the power supply electrode below each of the power supply electrodes.   The said board | substrate removal | desorption apparatus provided the at least 1 power supply electrode of these several power supply electrodes so that advancement / retraction was possible toward the electronic circuit board mounted in these board | substrate mounting part. The plating jig according to 1 or 2.

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