JP2006016649A - Plating fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating fixture capable of ensuring a secure sealed state at the time when being sunk into a plating liquid. <P>SOLUTION: The plating fixture is composed of: a base member 3 comprising a plurality of power feeding electrodes 7 provided along the opening periphery of an opening 5 penetrated up and down; a ring-shaped first sealing member 9 arranged along the opening periphery of the opening 5 and mounted and set with the surface of a plating body 17 formed into a sheet shape electrically connected with the power feeding electrode 7; a covering member 21 of covering the whole of the back face of the plating body 17 set in the first sealing member 9; a plating body pressing member 19 coming into contact with the covering member 21 and the back face of the plating body 17, respectively, and pressing the plating body 17 toward the first sealing member 9; and a ring-shaped secondary sealing member 27 arranged along the outer circumference of the plating body pressing member 19, and the covering member 21 and the base member 3 are joined with a plurality of joining tools 9 with the second sealing member 27 sandwiched. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plating jig suitable for plating only the surface of a wafer or the like.

  In general, copper plating is applied to the surface of a wafer or the like on which a semiconductor or the like is mounted.

  In order to perform copper plating on the surface of the wafer, plating is performed by immersing the entire wafer in a plating tank filled with a plating solution. However, as described above, plating is performed only on the surface of the wafer. It has become. When plating is performed on the peripheral edge and part of the back surface of the wafer, it is discarded as a defective product. Therefore, in the plating operation, set the plating jig so that only the wafer surface is exposed. The means to sink into the tank is taken.

  An outline of a general known plating jig is that a wafer is set in a rubber seal cover, which is sealed so that the plating solution does not invade the peripheral portion and the back side by the elastic force, and only the front surface. It has an exposed structure.

  The rubber seal cover covers the entire surface except for the wafer surface. However, if the wafer is not properly set on the seal cover, the plating solution will wrap around the plating solution and become a defective product. There is a problem of connection, and how to increase the yield is an issue.

  Therefore, an object of the present invention is to provide a plating jig capable of ensuring a reliable sealing state when submerged in a plating solution.

  In order to achieve the above object, in the present invention, a base member having a plurality of feeding electrodes provided along an opening periphery of an opening penetrating vertically, and disposed along the opening periphery of the opening. A ring-shaped first seal member on which the surface of the plate-shaped object to be electrically connected to the power supply electrode is placed and set, and the back surface of the object to be plated set on the first seal member A cover member that covers the entire surface, a plate holding member that contacts the cover member and the back surface of the member to be plated and presses the member to be plated toward the first seal member, and an outer periphery of the plate holding member. A ring-shaped second seal member disposed along the plurality of fasteners that fasten the cover member and the base member with the second seal member interposed therebetween.

  According to the plating jig of the present invention, the opening through which the surface of the object to be plated is exposed is reliably sealed by the ring-shaped first seal member, and the plating solution entering from the peripheral edge of the opening can be reliably prevented.

  Further, since the cover member and the base member are fastened with the ring-shaped second seal member sandwiched therebetween, the entire circumference is surely sealed by the second seal member, and the periphery of the object to be plated and the back surface are sealed. Intrusion of the plating solution can be surely prevented, and the yield can be improved.

  First, the pressed member to be plated includes a ring-shaped disk, a protrusion that is provided at a central portion of the disk and that can be adjusted in the vertical direction to contact the inner wall surface of the cover member, and the disk And a ring-shaped elastic member elastically contacting along the outer peripheral edge of the back surface of the object to be plated so that a substantially uniform sealing pressure acts on the entire peripheral surface.

  Second, the feeding electrode is formed of a horizontal portion and a vertical portion formed in a strip shape, and the horizontal portion has a repulsive force against an input load input through the vertical portion. A structure in which the tip end of the vertical portion is electrically connected to the object to be plated and the tip of the feeding electrode is securely connected to the object to be plated by utilizing an elastic reaction force by the elastic body while being supported by the elastic body. And

  Thirdly, the vertical edge of the feeding electrode has a plurality of chevron shapes, and the chevron shape ensures a connection state in which the tip of the power feeding electrode reliably pierces the object to be plated.

  Hereinafter, embodiments of the present invention will be specifically described with reference to FIGS. 1 to 5.

  FIG. 1 is a schematic sectional view of the plating jig, and FIG. 2 is a schematic exploded sectional view of the plating jig.

  The base member 3 of the plating jig 1 includes a plurality of power supply electrodes 7 that serve as cathodes with respect to an opening 5 penetrating vertically in FIG. 1 and an anode provided in a plating tank outside the drawing. Have. A ring-shaped first seal member 9 is provided on the opening periphery of the opening 5 along the opening periphery.

  The feeding electrode 7 includes a horizontal portion 11 formed in a strip shape and a vertical portion 13 rising vertically from the horizontal portion 11, and the horizontal portion 11 is elastic with an elastic reaction force against a load from above. It is placed on the upper surface of the body 15. In this case, the elastic body 15 may be provided independently, or may be integrally formed with the first seal member 9.

  The vertical portion 13 extends upward along the first seal member 9, and the vertical portion tip edge 13 a has a plurality of chevron shapes as shown in FIG. 3 and is placed on the first seal member 9. It is ensured to pierce the object 17 such as a wafer to be plated. In this case, the chevron shape is double, but it may be triple or quadruple.

  The object to be plated 17 is formed in a plate shape, and copper plating is applied only to the surface 17 a through the opening 5. A plated member 19 and a cover member 21 that covers the entire plated member 19 are provided on the back surface 17b of the object 17 to be plated.

  The to-be-plated holding member 19 includes a disc 20 having surface rigidity with a predetermined plate thickness, a screw-type protrusion 23 provided at a central portion of the disc 20, and a rear outer peripheral edge of the disc 20. It is formed with the ring-shaped elastic member 25 arrange | positioned along.

  The ring-shaped elastic member 25 is elastically contacted along the outer peripheral edge of the back surface 17b of the body 17 to be plated placed and set on the first seal member 9.

  The protrusion 23 is a screw screw provided with a male screw on the outer periphery, and is screwed into a female screw hole provided in the center of the disk 20 and rotated left or right, so that the protrusion 20 moves upward from the upper surface of the disk 20. The amount of protrusion can be adjusted. Accordingly, the load W from above due to the front end of the protrusion 23 abutting against the inner wall surface of the cover member 21 is coupled with the condition that the protrusion 23 is positioned at the central portion, and the disk 20. Is transmitted almost uniformly to the elastic member 25 via the. As a result, the outer peripheral edge of the object 7 to be plated is pressed evenly downward in FIG. 1 to ensure a uniform sealing pressure by the first seal member 9 over the entire peripheral surface.

  The cover member 21 is formed in a round plate shape and can be fastened to the base member 3 with the ring-shaped second seal member 27 interposed therebetween. A second seal member setting groove 28 is provided on the entire inner periphery of the cover member 21 and seven fastening holes 30 are provided outside the cover member 21 at predetermined intervals.

  The second seal member 27 is arranged in a ring shape along the outer periphery of the plated presser member 19 and seals between the base member 3 and the cover member 21 over the entire periphery.

  A fastener 29 that fastens the cover member 21 and the base member 3 is a bolt type, and is inserted from the fastening hole 30 of the cover member 21, and the tip portion is screwed into the screw hole 3 a of the base member 3. It has a shape. In this case, the fastener 29 may be a set bolt type in which a nut is screwed after rising from the base member 3 and passing through the fastening hole 30.

  Therefore, by removing the fasteners 29, it is possible to remove the member to be plated 19 and the cover member 21 from the base member 3, and the object to be plated 17 can be set.

  According to the plating jig 1 configured in this way, after the object to be plated 17 such as a wafer is set as shown in FIG. 1, the fastener 29 is tightened to sandwich the second seal member 27. The fastening state of the member 21 and the base member 3 is ensured, and a reliable sealing state is obtained over the entire circumference.

  At the time of this fastening, the load W from the cover member 21 is transmitted to the protrusion 23. At this time, even if the fastening force by the fastener 29 varies depending on the location, the projection 23 in the central portion is transmitted almost uniformly to the elastic member 25 via the disk 20 and presses the object 17 to be plated. The pressed object to be plated 17 presses the vertical end edge 13a of the feeding electrode 7 downward against the elastic reaction force of the first seal member 9 and the elastic body 15 as shown by the solid line from the chain line in FIG. . Due to the elastic reaction force accumulated by this pressing, the first seal member 9 is in close contact with the object to be plated 17 and a reliable sealing state is obtained over the entire circumference.

  At the same time, the power supply electrode 7 is pierced into the plated body 17 by the elastic reaction force of the elastic body 15 so that the mountain-shaped vertical tip end line 13a is pierced into the plated body 17 so that a reliable connection state is obtained.

  Therefore, by setting the base member 3 of the plating jig 1 on which the object to be plated 17 is set vertically in a plating tank not shown in the drawing, copper plating can be reliably obtained only on the surface of the object 17 to be plated. Thus, the yield can be improved.

The outline sectional view of the plating jig concerning the present invention. The outline exploded sectional view of a plating jig. The outline perspective view of a feed electrode. Explanatory drawing which shows the connection state of the to-be-plated body and the vertical-part front-end edge of a feed electrode. The outline top view which looked at the base member and the cover member removed from the base member from the back.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 ... Base member 5 ... Opening 7 ... Feed electrode 9 ... 1st sealing member 11 ... Horizontal part 13 ... Vertical part 13a ... Vertical part front edge 15 ... Elastic body 17 ... Plated body 19 ... Plated pressing member 20 ... Disc 21 ... Cover member 23 ... Projection body 25 ... Elastic member 27 ... Second seal member 29 ... Fastener

Claims (4)

  A base member having a plurality of power supply electrodes provided along an opening periphery of an opening penetrating vertically, and a plate shape disposed along the opening periphery of the opening and electrically connected to the power supply electrode A ring-shaped first seal member on which the surface of the object to be plated is placed and set, a cover member that covers the entire back surface of the object to be plated set on the first seal member, the cover member, and the object to be plated A to-be-plated holding member that presses the object to be plated against the first seal member, and a ring-shaped second seal member disposed along the outer periphery of the to-be-plated holding member, A plating jig comprising a plurality of fasteners for fastening the cover member and the base member with the second seal member interposed therebetween.   The plate member to be plated is a ring-shaped disk, a protrusion that is provided at a central portion of the disk and that can be adjusted to expand and contract in contact with the inner wall surface of the cover member, and the disk. The plating jig according to claim 1, comprising a ring-shaped elastic member that elastically contacts along the outer peripheral edge of the back surface of the object to be plated.   The feeding electrode is formed of a horizontal portion and a vertical portion formed in a strip shape, and the horizontal portion is an elastic body having an elastic reaction force with respect to an input load input through the vertical portion. The plating jig according to claim 1, wherein the tip edge of the vertical portion is electrically connected to the object to be plated while being supported. The plating jig according to claim 3, wherein the leading edge of the vertical portion of the power supply electrode has a plurality of chevron shapes.

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