KR100968195B1 - Wafer zig for plating apparatus - Google Patents

Abstract

The present invention relates to a wafer jig for plating equipment to facilitate assembly by coupling the head and the cover using a fastening means coupled through rotation without bolt fastening.

The wafer jig for plating equipment of the present invention for this purpose, a circular head, a circular base plate mounted on the circular head, a ring-shaped plate provided on the base plate, and inserted into the ring-shaped plate on the wafer A dummy plate having a corresponding shape, a circular cover having an opening coupled to the head and exposing a wafer, a first sealing member sealing a front circumference of the base plate and the cover, and an inside of the opening of the cover A wafer jig for a plating equipment comprising a second sealing member for sealing between a circumference and a front circumferential front surface of a wafer, and a plurality of electrode pins in contact with the wafer and the ring-shaped plate boundary, wherein the circular cover has a bottom inward direction. A plurality of protrusions protruding and the upper surface is inclined upward in one direction is formed And a fastening member having a plurality of fastening jaws formed around the inclined upward direction in the opposite direction to the inclined direction of the protruding jaw and coupled to the protruding jaw through rotation.

 Plating equipment, wafers, jigs, seals, fasteners

Description

Wafer jig for plating equipment {WAFER ZIG FOR PLATING APPARATUS}

The present invention relates to a wafer jig for plating equipment, and more particularly, to a wafer jig for plating equipment to facilitate assembly by combining the head and the cover by using a fastening means that is coupled through rotation without bolt fastening.

In general, the plating process in the process for manufacturing a semiconductor device is widely used as a technique having excellent deposition characteristics.

Plating refers to an operation of coating a thin layer of a metal or alloy on the surface of the object to be treated. Plating may be classified in various ways depending on the method and purpose, but the electroplating method is widely used. .

Briefly explaining the principle of electroplating, the object to be plated is a cathode, the metal to be electrodeposited is an anode, and these are put in an electrolyte solution containing metal ions to be electrodeposited and the two electrodes are energized. It is to utilize the phenomenon that the desired metal ions are deposited on the surface of the object to be treated by electrolysis.

Such an electroplating method is important for the manufacture of high density integrated semiconductor devices such as ULSI (Ultra Large Scale Integration) and the packaging process thereof, or the manufacture of microsystems. It is recognized as a process.

In general, in the semiconductor field, plating equipment includes a plating solution tank in which an electrolyte is accommodated and a wafer jig for placing a wafer in the plating solution tank.

Description of the jig which is a component of such plating equipment has been disclosed in the title of "electroplating jig" in the Republic of Korea Patent Application No. 2006-54988 (filed June 19, 2006).

The "electroplating jig" disclosed in Korean Patent Application No. 2006-54988 (filed June 19, 2006) includes the first and second insulating plates, the inner sealing member, the outer sealing member, the conductive rubber which is a conductive plate, a metal plate, and an elastic sheet. do.

The electroplating jig of this technology is provided with a sealing member only between the metal plate and the conductive rubber under the wafer, there is a disadvantage that can not prevent the penetration of the plating solution between the second insulating plate and the wafer on the wafer.

Techniques for resolving these shortcomings have been disclosed in the Korean Patent Application No. 2008-0035289 filed by the present applicant entitled "wafer jig for plating equipment".

This technology is a technique for mounting a sealing member between the ring-shaped plate and the cover for energization, and by installing a sealing member between the wafer circumference and the cover to secure airtightness and prevent penetration of the plating liquid.

In addition, this technology facilitates assembly and disassembly by fastening the case and cover to the one-touch clamp without bolting.

However, in this technology, the sealing member is mounted on the ring-shaped plate and assembled with the cover for sealing the ring-type plate and the cover tooth, so that the ring-type plate and the cover have high adhesion by the sealing member, so that the cover is not easily disassembled when disassembling the wafer jig. This has a hard disadvantage.

In addition, since the fastening is performed by the one-touch clamp, the load is increased only on the second sealing member between the ring-shaped plate and the cover, and the fastening force of the first sealing member mounted between the wafer and the cover is weakened, so that the sealing solution is difficult to penetrate. There is a problem.

An object of the present invention for improving the problems of the prior art, by using a fastening member that is fastened to the screw type by rotating the cover and the head uniformly load and applied to the sealing member for sealing the front and rear of the cover It is to provide a wafer jig for plating equipment to facilitate disassembly.

In addition, an object of the present invention is to provide a wafer jig for plating equipment to facilitate the disassembly of the cover and the base plate by inserting a sealing member for sealing the base plate and the back of the cover into the inner sealing groove of the cover.

The wafer jig for plating equipment of the present invention includes a circular head, a circular base plate mounted on an upper portion of the circular head, a ring-shaped plate provided on the base plate, and inserted into an upper portion of the ring-shaped plate to correspond to a wafer. A dummy plate having a shape, a circular cover having an opening coupled to the head to expose the wafer, a first sealing member sealing the front circumference of the base plate and the cover, and an inner circumference of the opening of the cover; In the wafer jig for plating equipment comprising a second sealing member for sealing between the front circumferential front surface of the wafer and a plurality of electrode pins in contact with the wafer and the ring-shaped plate boundary, protruding inward in the lower portion of the circular cover A plurality of protrusions inclined upward in one direction is formed, the stone It characterized in that a plurality of fastening projection through the oblique direction and an upward slope is rotated in the opposite direction of the jaws coupled to the protruding jaw comprises a fastening member formed on the circumference.

The first sealing groove is formed in the outer circumferential shape on the top of the cover and the second sealing groove is formed in the circumferential shape inside the first sealing groove to insert the second sealing member. Is formed.

The present invention by using a fastening member that is fastened to the screw type by rotating the cover and the head, it is easy to assemble and disassemble can improve the work efficiency to improve productivity.

In addition, the present invention by using a screw-type fastening member instead of the conventional clamp fastening means to improve the problem of the sealing of the front sealing member is not good so that the uniform load is applied to the front and rear sealing member to penetrate the plating solution Prevention can improve reliability.

In addition, the present invention by inserting a sealing member for sealing the back of the base plate and the cover in the inner sealing groove of the cover to facilitate the disassembly of the cover and the base plate can increase the work efficiency.

1 is a bottom coupled perspective view of a wafer jig for plating equipment according to an embodiment of the present invention, Figure 2 is a bottom perspective view of a wafer jig for plating equipment according to an embodiment of the present invention, Figure 3 according to an embodiment of the present invention A-A 'cross-sectional view of the wafer jig for plating equipment, Figure 4 is an enlarged view of the portion B of Figure 3, the present invention is a plating sheet for supporting the wafer in the plating bath in which the plating liquid is stored and energizing the wafer to perform plating on the wafer The cost relates to wafer jig.

1 to 4, the present invention provides a head 1, a base plate 2, a ring-shaped plate 3, a dummy plate 4, a cover 6, and a fastening member 7. And a plurality of electrode pins 8.

The head 1 is connected to an electricity supply portion (not shown) for energizing the lower portion and to position the wafer in the plating bath. In the embodiment of the present invention, an electricity supply shaft (not shown) is inserted through the rotation of the electricity supply shaft. By rotating the wafer or by adjusting the angle of the wafer in the plating bath.

To this end, the head 1 is composed of a disc-shaped body 11, the through hole 111 is formed in the center of the body 11, the through hole 111 is extended to the lower portion of the body 11 It has a structure in which an insertion tube 12 into which a shaft (not shown) is inserted is formed.

At this time, the embodiment of the present invention is to use the energizing head as the energizing part for energizing the head 1, but through the other modified embodiment to mount the plate-shaped energizing part under the head 1, the head ( 1) can be configured to be mounted through a mounting member such as a ring in a bar-shaped mounting portion disposed in a plating solution tank of known technology.

The base plate 2 is provided on the upper part of the head 1 and is energized through contact with an energizing shaft. The base plate 2 is formed of a disc body 21 having a groove 23 for mounting a wafer. The lower part of the 21 is formed with an insertion protrusion 22 inserted into the through hole 111 formed in the center of the body 11 of the head (1).

According to this configuration, the insertion protrusion 22 of the base plate 2 is inserted into the through hole 111 in the center of the head 1, and bolts passing through the base plate 2 are coupled to the front surface of the head 1. It is integrated by doing so.

The ring-shaped plate 3 is provided on the base plate 2 and is energized through contact with the base plate 2. A hole 31 is formed in the center of the ring-shaped plate 3, Step 32 is formed so that the dummy plate is loaded.

At this time, it is preferable that the removable groove 33 is formed in the radial direction around the upper portion of the ring-shaped plate 3 to facilitate wafer removal.

That is, the dummy plate 4 is loaded on the step 32 of the groove 23 of the ring-shaped plate 3, and the wafer 5 is detached from the wafer 33 while the wafer 5 is in close contact therewith. You can easily take it out.

The dummy plate 4 is inserted into the hole 31 of the ring-shaped plate 3 and has a shape corresponding to the wafer 5 so that the wafer is loaded.

Here, the dummy plate 4 may be variably mounted in a dummy plate of various thicknesses according to the thickness of the wafer 5.

Accordingly, not only the wafer having a single thickness but also the wafer 5 having various thicknesses can be mounted, thereby improving the practicality.

The cover 6 is engaged with the head 1 at the top of the head 1 to receive the dummy plate 4, the ring-shaped plate 3 and the base plate 2, and exposes the wafer 5 to the top.

To this end, the cover 6 is formed in a circular shape having an opening 61 for exposing the wafer 5 on its front surface and a space for accommodating each component.

In addition, according to a characteristic aspect of the present invention, a plurality of protruding jaws 62 protruding in the inner direction and inclined upward in one direction are formed under the cover 6.

And, the fastening member 7 is composed of a ring-shaped fastening plate 71 and a plurality of fastening jaw 711 formed around the fastening plate 71, the fastening jaw 711 is a protrusion of the cover 6 ( 62) It is formed to be inclined upwardly in the opposite direction to the inclined direction so that the protrusion jig and the fastening jaw are coupled to each other so as to assemble the wafer jig.

In addition, the fastening member 7 is provided with a handle 72 in the lower portion so as to be assembled or disassembled by rotating the fastening plate 71. At this time, the handle 72 is preferably provided with at least two so as to be assembled by applying a uniform load when assembling the fastening member (7) to the cover (6).

Meanwhile, as shown in FIG. 5, the first sealing groove 63a and the second sealing groove 63b having a circumferential shape are formed in the upper portion of the cover 6, and the second sealing groove 63b is an opening portion. It is formed in the circumference | surroundings of 61, and the 1st sealing groove 63a is formed in the outer periphery of the 2nd sealing groove 63b.

The first sealing member 631a is inserted into the first sealing groove 63a to seal between the front circumference of the base plate 2 and the inside of the cover 6.

The second sealing member 631b is inserted into the second sealing groove 63b to seal between the inner circumference of the opening of the cover 6 and the front circumference of the wafer 5.

In this case, since the first sealing member 631a and the second sealing member 631b are inserted into the inside of the case and do not need to be sealed separately, the jig size can be downsized and the jig is supported. It is possible to reduce the size of the plating bath.

Here, in the conventional method, the base plate 2 and the cover 6 are assembled with the sealing member sealing between the front circumference of the base plate 2 and the inside of the cover 6 being fitted around the upper circumference of the base plate 2. However, in the present invention, a sealing groove is formed in the cover 6, and the sealing member is inserted into the sealing groove, thereby easily disassembling the base plate 2 and the cover 6.

That is, in the past, the cover was hardly disassembled due to the adhesion between the sealing member and the cover 6 fitted to the base plate 2, but according to the present invention, since the sealing member is inserted into the groove of the cover 6, the cover is inserted. (6) and base plate 2 are easy to disassemble.

In addition, before and after the jaw 62 of the cover 6, a groove 64 into which the fastening jaw 711 of the fastening member 7 is inserted is formed, and then the fastening jaw 711 is inserted into the groove 64. By rotating, the fastening hair 71 and the protrusion jaw 62 are screwed together to complete the wafer jig assembly.

On the other hand, the plurality of electrode pins (8) are each mounted inside the second sealing member (631b) of the cover 6, the wafer 5 and the ring-shaped plate (3) when the cover 6 and the head (1) is combined By contacting the boundary portion, the ring-shaped plate 3 and the wafer 5 are energized.

In addition, each electrode pin 8 is mounted to the cover 6 through an elastic member 81 such as a spring, and electrically contacts the wafer 5 and the ring-shaped plate 3 through an elastic force.

That is, as the electrode pin 8 contacts the boundary between the wafer 5 and the ring-shaped plate 3, the wafer 5 is energized through the ring-shaped plate 3.

At this time, the height of the electrode pin 8 is automatically adjusted according to the height of the wafer 5 by the elastic force of the elastic member 81, thereby making stable electrical contact regardless of the thickness of the wafer 5.

Thus, in the present invention, by assembling the fastening member 7 rotating in the screw type to the cover 6, the load applied to each of the sealing members 631a and 631b can be equalized.

That is, when the conventional one-touch clamp is used, there is a problem that the sealing of the front sealing member is not performed smoothly due to the large load applied to the rear sealing member, but the present invention adopts a structure that is assembled through rotation to the front and rear sealing members. Both sides are smoothly sealed by applying a uniform load.

According to the configuration of the present invention, the head 1 and the base plate (1) through the bolt 24 in a state where the insertion protrusion 22 of the base plate 2 is first inserted into the central through hole 111 of the head 1. 2) is integrally combined.

The ring plate 3 is fitted into the groove 23 of the base plate 2, and the dummy plate 4 is inserted into the hole 31 formed in the center of the ring plate 3.

In addition, the wafer 5 is loaded on the dummy plate 4.

The first sealing member 631a and the second sealing member 631b are inserted into the sealing grooves 63a and 63b of the cover, respectively.

In this state, the cover 6 is coupled to the head 1 using the fastening member 7.

That is, as shown in FIG. 6, the fastening member 7 is positioned on the cover 6, and the fastening jaw 711 is inserted into the groove 6 of the cover 6, as shown in FIG. 6. Holding the handle 72 and rotating the fastening plate 71, as shown in FIG. 8, the fastening jaw 711 slides the projecting jaw 62 is screwed, the fastening jaw 711 and the projecting jaw ( 62), the wafer jig assembly is completed.

1 is a perspective view of the bottom coupling of the wafer jig for plating equipment according to an embodiment of the present invention.

Figure 2 is a bottom perspective view of the wafer jig for plating equipment according to an embodiment of the present invention.

Figure 3 is a cross-sectional view taken along the line A-A 'of the wafer jig for plating equipment according to an embodiment of the present invention.

4 is an enlarged view of a portion B of FIG. 3;

5 is a cross-sectional view of the cover of FIG.

6 and 7 are perspective views illustrating the assembly process of the wafer jig for the plating equipment of the present invention.

<Description of the symbols for the main parts of the drawings>

1: head

11: body

111: through hole

12: insertion tube

2: base plate

21: disc

22: insertion protrusion

23: groove

24: Bolt

3: ring type plate

31: Hall

32: step

33: removable groove

4: dummy plate

5: wafer

6: cover

61: opening

62: protruding jaw

63a: first sealing groove

63b: second sealing groove

631a: first sealing member

631b: second sealing member

7: fastening member

71: fastening plate

711: fastening jaw

72: handle

8: electrode pin

81: elastic member

Claims (2)

A circular head 1, a circular base plate 2 mounted on the circular head, a ring-shaped plate 3 provided on the base plate, and a shape inserted in the upper portion of the ring-shaped plate and corresponding to the wafer. A dummy plate (4) having a shape, a circular cover (6) having an opening portion coupled to the head and exposing a wafer, a first sealing member (631a) sealing the front circumference of the base plate and the cover; Wafer jig for plating equipment including a second sealing member 631b for sealing between the inner circumference of the opening of the cover and the entire front circumference of the wafer, and a plurality of electrode pins 8 contacting the wafer and the ring-shaped plate boundary. To A plurality of protruding jaws 62 protruding in an inner direction and inclined upward in one direction are formed below the circular cover 6, It includes a fastening member 7 formed around the plurality of fastening jaw 711 is inclined upward in the direction opposite to the inclined direction of the protruding jaw 62 and coupled to the protruding jaw through rotation, The upper part of the cover 6 is formed in a circumferential shape on the outside and the first sealing groove (63a) is inserted into the first sealing member 631a, and formed in a circumferential shape inside the first sealing groove and the first 2. A wafer jig for plating equipment, characterized in that a second sealing groove 63b into which the sealing member 631b is inserted is formed. delete

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