KR100981159B1 - Wafer zig for plating apparatus - Google Patents

Abstract

The present invention relates to a wafer jig for plating equipment, which places a wafer in a plating bath of a plating equipment, improves internal airtightness, prevents penetration of a plating solution, and can be used regardless of the thickness of the wafer, and is easy to assemble and disassemble.

The wafer jig for the plating equipment of the present invention is a wafer jig for plating equipment that carries a plating in a wafer by carrying a wafer in a plating bath in which a plating solution is stored and conducting the wafer, wherein a conduction part for conducting electricity is connected to a rear side of the wafer jig. And a circular base plate having a circular head positioned in the plating bath, a circular base plate provided in front of the head and energized through an energization unit connected to the head, and having a groove for wafer mounting, and provided in front of the base plate. A ring-shaped plate which is energized through contact with and defines a wafer loading region, a dummy plate having a shape corresponding to the wafer to be inserted into the hole of the ring-shaped plate and loaded with the wafer, the dummy plate and the ring-shaped plate And to receive the base plate A circular cover having an opening portion coupled to the head and exposing the wafer at the front of the head, a first sealing member sealing between the front circumference of the base plate and the inside of the cover, and an inner circumference of the opening of the cover; And a second sealing member sealing between the front circumference of the wafer and a plurality of electrode pins mounted inside the second sealing member of the cover and contacting the wafer and the ring-shaped plate boundary when the cover and the head are coupled.

Plating equipment, wafers, jigs, sealings, heads, covers, electrode pins

Description

Wafer jig for plating equipment {WAFER ZIG FOR PLATING APPARATUS}

The present invention relates to a wafer jig, and more particularly, to place the wafer in the plating bath of the plating equipment to improve the internal airtightness to prevent the penetration of the plating liquid and to use regardless of the thickness of the wafer, and easy to assemble and disassemble plating A wafer jig for equipment.

In general, the plating process in the process for manufacturing a semiconductor device is widely used as a technique having excellent deposition characteristics.

Plating refers to an operation of coating a thin layer of a metal or alloy on the surface of the object to be treated. Plating may be classified in various ways depending on the method and purpose, but the electroplating method is widely used. .

Briefly explaining the principle of electroplating, the object to be plated is a cathode, the metal to be electrodeposited is an anode, and these are put in an electrolyte solution containing metal ions to be electrodeposited and the two electrodes are energized. It is to utilize the phenomenon that the desired metal ions are deposited on the surface of the object to be treated by electrolysis.

Such an electroplating method is currently in the manufacture of high density integrated semiconductor device (semiconductor device), such as ULSI (Ultra Large Scale Integration) and packaging (packaging) process of it, or the manufacturing of microsystem (MEMS), etc. It is recognized as an important process.

In general, in the semiconductor field, plating equipment includes a plating solution tank in which an electrolyte is accommodated and a wafer jig for placing a wafer in the plating solution tank.

Description of the jig which is a component of such plating equipment has been disclosed in the title of "electroplating jig" in the Republic of Korea Patent Application No. 2006-54988 (filed June 19, 2006).

The "electroplating jig" disclosed in Korean Patent Application No. 2006-54988 (filed June 19, 2006) includes the first and second insulating plates, the inner sealing member, the outer sealing member, the conductive rubber which is a conductive plate, a metal plate, and an elastic sheet. do.

The electroplating jig of this technology is provided with a sealing member only between the metal plate behind the wafer and the conductive rubber, and there is a disadvantage in that the plating liquid penetration between the second insulating plate in front of the wafer and the wafer cannot be prevented.

An object of the present invention is to provide a sealing member between a ring-shaped plate and a case for energizing, and to mount a sealing member between a wafer circumference and a case, and to provide both sealing members inside the case, thereby reducing the device size and increasing airtightness. The present invention provides a wafer jig for plating equipment.

It is also an object of the present invention to provide a wafer jig for plating equipment that is easy to assemble and disassemble by fastening a one-touch clamp without bolt fastening.

In addition, the present invention is to provide a wafer jig for plating equipment that can be mounted to a variable thickness of the dummy plate having a different thickness to load a wafer of various thickness.

In addition, an object of the present invention is to provide a wafer jig for plating equipment to form a removable groove in the direction toward the center on the inner peripheral surface of the ring-shaped plate to facilitate the removal of the wafer.

The wafer jig for plating equipment of the present invention for solving the above problems is a wafer jig for plating equipment that carries a plating in a wafer by carrying a wafer in a plating bath in which a plating liquid is stored and energizing the wafer, and energizing for energizing backwards. A circular base plate which is additionally connected and locates the wafer in the plating bath, is provided in front of the head and is energized through an energization portion connected to the head, and has a circular base plate having a groove for mounting the wafer, and is provided in front of the base plate. A ring-shaped plate having a hole configured to be energized through contact with the base plate to define a wafer loading region, a dummy plate inserted into a hole of the ring-shaped plate and having a shape corresponding to the wafer so that the wafer is loaded, and the dummy plate; The ring-shaped plate and the base play A circular cover having an opening portion coupled to the head at the front of the head to expose the wafer, a first sealing member sealing between the front circumference of the base plate and the inside of the cover, and an opening portion of the cover. A second sealing member sealing between the inner circumference and the front circumference of the wafer, and a plurality of electrode pins mounted inside the second sealing member of the cover and contacting the wafer and the ring-shaped plate boundary when the cover and the head are coupled. .

Here, the cover and the head can be fastened in a one-touch type through the clamp type fastening means.

In addition, the dummy plate may be variably mounted according to the thickness of the wafer and applied to wafers of various thicknesses.

In addition, a detachable groove may be formed at an inner circumference of the ring-shaped plate front in a direction toward the center to facilitate wafer removal.

In addition, the electrode pin is mounted to the cover through the elastic member to be in close contact with the wafer and the ring-shaped plate through the elastic force is electrically stable contact between the two.

The present invention prevents an increase in the size of the equipment for separate sealing by mounting sealing members at both ends of the inner circumference of the case, and further reduces the cost by saving the plating liquid through reducing the size of the plating solution, and improves the airtightness inside the case. There is an advantage that can be improved to improve the process reliability.

The present invention has the advantage that can be easily assembled and disassembled by improving the productivity by fastening the cover and the head using a one-touch clamp without the conventional bolt fastening.

In addition, the present invention has the advantage that the practicality can be improved by varying the mounting of the dummy plate having a different thickness to apply a wafer of various thickness.

In addition, the present invention has an advantage that the productivity can be improved by forming a removable groove in the direction toward the center on the ring-shaped plate to facilitate the removal of the wafer.

1 is a front bonded perspective view of a wafer jig for plating equipment according to a first embodiment of the present invention, FIG. 2 is a rear bonded perspective view of a wafer jig for plating equipment according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view of FIG. 4, and FIG. 4 is a cross-sectional view taken along the line AA ′ of FIG. 2. The present invention relates to a wafer jig for plating equipment that supports a wafer by carrying a wafer in a plating bath in which a plating solution is stored and energizing the wafer. will be.

1 to 4, the present invention provides a head 1, a base plate 2, a ring-shaped plate 3, a dummy plate 4, a cover 6, and a first sealing member ( 7a), the second sealing member 7b and the plurality of electrode pins 8 are included.

The head 1 is connected to an energization part (not shown) for energization at the rear and positions the wafer in the plating bath. In the embodiment of the present invention, an energization shaft (not shown) is inserted therethrough to rotate the energization shaft. By rotating the wafer or by adjusting the angle of the wafer in the plating bath.

To this end, the head 1 is composed of a disk-shaped body 11, the through hole 111 is formed in the center of the body 11, the through hole 111 is extended to the rear of the body 11 is energized It has a structure in which an insertion tube 12 into which a shaft (not shown) is inserted is formed.

At this time, the embodiment of the present invention is to use the energizing head as the energizing part for energizing the head 1, but through the other modified embodiment to mount the plate-shaped energizing part to the rear of the head 1, the head ( 1) can be configured to be mounted through a mounting member such as a ring in a bar-shaped mounting portion disposed in a plating solution tank of known technology.

FIG. 5 is an enlarged cross-sectional view of the base plate of FIG. 3, wherein the base plate 2 is provided in front of the head 1 and is energized through contact with the energizing shaft.

Here, the base plate 2 is composed of a disk body 21 having a groove 23 for wafer mounting in the front, and through the center of the body 11 of the head 1 at the rear of the disk body 21. An insertion protrusion 22 is inserted into the hole 111.

According to this configuration, the insertion protrusion 22 of the base plate 2 is inserted into the through hole 111 in the center of the head 1, and bolts passing through the base plate 2 are coupled to the front surface of the head 1. It is integrated by doing so.

FIG. 6 is an enlarged perspective view in which the ring-shaped plate, the dummy plate and the wafer of FIG. 3 are disassembled, and the ring-shaped plate 3 is provided in front of the base plate 2 to be energized through contact with the base plate 2.

In the ring-shaped plate 3, a hole 31 is formed at the center to define the wafer loading region, and a step 32 is formed to load the dummy plate.

At this time, in the inner circumference of the front of the ring-shaped plate 3, it is preferable that the removable groove 33 is formed in the direction toward the center to facilitate wafer removal.

That is, the dummy plate 4 is loaded on the step 32 of the groove portion 23 of the ring-shaped plate 3, and the wafer 5 is detached and grooved 33 in a state in which the wafer 5 is in close contact therewith. Easily taken out via

The dummy plate 4 is inserted into the hole 31 of the ring-shaped plate 3 and has a shape corresponding to the wafer 5 so that the wafer is loaded.

Here, the dummy plate 4 may be variably mounted in a dummy plate of various thicknesses according to the thickness of the wafer 5.

Accordingly, not only the wafer having a single thickness but also the wafer 5 having various thicknesses can be mounted, thereby improving the practicality.

The cover 6 is engaged with the head 1 at the front of the head 1 to receive the dummy plate 4, the ring-shaped plate 3 and the base plate 2, and exposes the wafer 5 forward.

To this end, the cover 6 is formed in a circular shape having an opening 61 for exposing the wafer 5 on its front surface and a space for accommodating each component.

FIG. 7 is an enlarged view of portion “B” of FIG. 4, in which the first sealing member 7a seals between the front circumference of the base plate 2 and the inside of the cover 6, and the second sealing member 7b is covered. The gap between the inner periphery of the opening of 6 and the front periphery of the wafer 5 is sealed.

In this case, since the first sealing member 7a and the second sealing member 7b are inserted into the case and do not need to be sealed separately, the jig size can be downsized, and furthermore, the plating on which the jig is carried. It is possible to reduce the size of the jaw.

The plurality of electrode pins 8 are mounted inside the second sealing member 7b of the cover 6, respectively, so that the wafer 5 and the ring-shaped plate 3 when the cover 6 and the head 1 are coupled to each other. By contacting the boundary portion, the ring-shaped plate 3 and the wafer 5 are energized.

In addition, each electrode pin 8 is mounted to the cover 6 through an elastic member 81, such as a spring, in close contact with the wafer 5 and the ring-shaped plate 3 through an elastic force, thereby making it electrically stable. do.

That is, as the electrode pin 8 contacts the boundary between the wafer 5 and the ring-shaped plate 3, the wafer 5 is energized through the ring-shaped plate 3.

At this time, the height of the electrode pin 8 is automatically adjusted according to the height of the wafer 5 by the elastic force of the elastic member 81, thereby making stable electrical contact regardless of the thickness of the wafer 5.

According to the configuration of the present invention, the head 1 and the base plate (1) through the bolt 24 in a state where the insertion protrusion 22 of the base plate 2 is first inserted into the central through hole 111 of the head 1. 2) is integrally combined.

The ring plate 3 is fitted into the groove 23 of the base plate 2, and the dummy plate 4 is inserted into the hole 31 formed in the center of the ring plate 3.

In addition, the wafer 5 is loaded in front of the dummy plate 4.

In this state, when the cover 6 is engaged with the head 1 in a state where the first sealing member 7a and the second sealing member 7b are fitted inside the cover 6, respectively, the first sealing member 7a is connected to the first sealing member 7a. It seals between the cover 6 and the base plate 2, and the boundary part of the cover 6 and the wafer 6 is sealed by the 2nd sealing member 7b.

As the cover 6 and the head 1 are coupled to each other, a plurality of electrode pins 8 provided on the inner circumference of the cover 8 contact the boundary between the wafer 5 and the ring-shaped plate 3 and the wafer ( 5) and the ring-shaped plate 3 are energized.

8 is a front coupling perspective view of a wafer jig for plating equipment according to a second embodiment of the present invention, FIG. 9 is a rear coupling perspective view of a wafer jig for plating equipment according to a second embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line C-C 'of FIG. 9, and descriptions of the same components as those of the first exemplary embodiment of the present invention and an operation thereof will be omitted.

8 to 11, in the second embodiment of the present invention, the cover 6 and the head 1 are fastened by the one-touch type through the clamp type fastening means 9, so that assembly and disassembly are easy.

That is, in the past, assembling and disassembling by disassembling the bolt, but the present invention can be assembled and disassembled with one touch without using the bolt type.

To this end, the clamp-type fastening means 9 includes a support 91 which is integrally coupled to the rear circumference of the head 1 and a clamp 92 rotatably provided on the outside of the support, and around the outer circumferential surface of the cover 6. It is provided with a hook 93 is formed with a locking jaw 931 at the bottom to fasten the clamp 92.

At this time, the clamp 92 is not shown in detail, but may be configured to allow height adjustment through a separate screw coupling adjustment.

Accordingly, the fastening height can be varied according to the components, in particular, the wafer thickness, which is accommodated between the cover 6 and the head 1, thereby increasing the practicality.

1 is a front coupled perspective view of a wafer jig for plating equipment according to a first embodiment of the present invention.

Figure 2 is a perspective view of the rear coupling of the wafer jig for plating equipment according to the first embodiment of the present invention.

3 is an exploded perspective view of FIG. 2;

4 is a cross-sectional view taken along the line AA ′ of FIG. 2.

5 is an enlarged cross-sectional view of the base plate of FIG.

FIG. 6 is an enlarged perspective view in which the ring-shaped plate, the dummy plate, and the wafer of FIG. 3 are disassembled.

7 is an enlarged view of a portion “B” of FIG. 4.

Figure 8 is a perspective view of the front coupling of the wafer jig for plating equipment according to a second embodiment of the present invention.

9 is a perspective view of the rear coupling of the wafer jig for plating equipment according to a second embodiment of the present invention.

10 is an exploded perspective view of FIG.

FIG. 11 is a cross-sectional view taken along the line CC ′ in FIG. 9. FIG.

<Description of the symbols for the main parts of the drawings>

1: head

11: body

111: through hole

12: insertion tube

2: base plate

21: disc

22: insertion protrusion

23: groove

24: Bolt

3: ring type plate

31: Hall

32: step

33: removable groove

4: dummy plate

5: wafer

6: cover

61: opening

7a: first sealing member

7b: second sealing member

8: electrode pin

81: elastic member

9: clamp type fastening means

91: support

92: clamp

93: hook

Claims (5)

In the wafer jig for plating equipment to support the plating in the wafer by holding the wafer in the plating bath in which the plating liquid is stored and energizing the wafer, A circular head connected to an energization portion for energization at the rear and for positioning the wafer in the plating bath; A circular base plate provided in front of the head and energized through an energization unit connected to the head and having a groove portion for wafer mounting; A ring-shaped plate provided in front of the base plate, the ring-shaped plate having a hole for energizing through contact with the base plate and defining a wafer loading region; A dummy plate inserted into a hole of the ring-shaped plate and having a shape corresponding to the wafer so that the wafer is loaded; A circular cover having an opening portion coupled to the head at the front of the head to expose the dummy plate, the ring-shaped plate and the base plate, and having an opening to expose the wafer; A first sealing member sealing between the front circumference of the base plate and the inside of the cover; A second sealing member for sealing between the inner circumference of the opening of the cover and the entire front circumference of the wafer; A plurality of electrode pins mounted inside the second sealing member of the cover and contacting the wafer and the ring-shaped plate boundary when the cover and the head are coupled; Wafer jig for plating equipment, characterized in that the cover and the head is fastened in one-touch type through the clamp type fastening means. delete The method of claim 1, The dummy plate is a wafer jig for plating equipment, it characterized in that the variable mounting mounted according to the thickness of the wafer. The method of claim 1, Wafer jig for plating equipment, characterized in that the removable groove in the direction toward the center is formed in the inner circumference of the front of the ring-shaped plate to facilitate the removal of the wafer. The method of claim 1, The electrode pin is mounted to the cover through the elastic member is in close contact with the wafer and the ring-shaped plate through the elastic force is configured to enable a stable electrical connection of the wafer jig for the plating equipment.

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