NL81606C
(en)
*
|
1952-07-05 |
|
|
|
US2882209A
(en)
*
|
1957-05-20 |
1959-04-14 |
Udylite Res Corp |
Electrodeposition of copper from an acid bath
|
US3649509A
(en)
*
|
1969-07-08 |
1972-03-14 |
Buckbee Mears Co |
Electrodeposition systems
|
US3727620A
(en)
*
|
1970-03-18 |
1973-04-17 |
Fluoroware Of California Inc |
Rinsing and drying device
|
US3770598A
(en)
*
|
1972-01-21 |
1973-11-06 |
Oxy Metal Finishing Corp |
Electrodeposition of copper from acid baths
|
US4027686A
(en)
*
|
1973-01-02 |
1977-06-07 |
Texas Instruments Incorporated |
Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
|
SE444822B
(en)
*
|
1975-03-11 |
1986-05-12 |
Oxy Metal Industries Corp |
BATHROOM AND ELECTROLYTIC DEPOSIT OF COPPER
|
US4111772A
(en)
*
|
1975-05-22 |
1978-09-05 |
Pitt Metals And Chemicals, Inc. |
Process for electrodialytically controlling the alkali metal ions in a metal plating process
|
JPS5271871A
(en)
*
|
1975-12-11 |
1977-06-15 |
Nec Corp |
Washing apparatus
|
JPS5819350B2
(en)
*
|
1976-04-08 |
1983-04-18 |
富士写真フイルム株式会社 |
Spin coating method
|
US4326940A
(en)
*
|
1979-05-21 |
1982-04-27 |
Rohco Incorporated |
Automatic analyzer and control system for electroplating baths
|
US4405416A
(en)
*
|
1980-07-18 |
1983-09-20 |
Raistrick Ian D |
Molten salt lithium cells
|
US4315059A
(en)
*
|
1980-07-18 |
1982-02-09 |
The United States Of America As Represented By The United States Department Of Energy |
Molten salt lithium cells
|
US4304641A
(en)
*
|
1980-11-24 |
1981-12-08 |
International Business Machines Corporation |
Rotary electroplating cell with controlled current distribution
|
US4336114A
(en)
*
|
1981-03-26 |
1982-06-22 |
Hooker Chemicals & Plastics Corp. |
Electrodeposition of bright copper
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
EP0076569B1
(en)
*
|
1981-10-01 |
1986-08-27 |
EMI Limited |
Electroplating arrangements
|
US4489740A
(en)
*
|
1982-12-27 |
1984-12-25 |
General Signal Corporation |
Disc cleaning machine
|
US4428815A
(en)
*
|
1983-04-28 |
1984-01-31 |
Western Electric Co., Inc. |
Vacuum-type article holder and methods of supportively retaining articles
|
US4789445A
(en)
*
|
1983-05-16 |
1988-12-06 |
Asarco Incorporated |
Method for the electrodeposition of metals
|
US4510176A
(en)
*
|
1983-09-26 |
1985-04-09 |
At&T Bell Laboratories |
Removal of coating from periphery of a semiconductor wafer
|
US4518678A
(en)
*
|
1983-12-16 |
1985-05-21 |
Advanced Micro Devices, Inc. |
Selective removal of coating material on a coated substrate
|
US4466864A
(en)
*
|
1983-12-16 |
1984-08-21 |
At&T Technologies, Inc. |
Methods of and apparatus for electroplating preselected surface regions of electrical articles
|
US4519846A
(en)
*
|
1984-03-08 |
1985-05-28 |
Seiichiro Aigo |
Process for washing and drying a semiconductor element
|
US4693805A
(en)
*
|
1986-02-14 |
1987-09-15 |
Boe Limited |
Method and apparatus for sputtering a dielectric target or for reactive sputtering
|
US4732785A
(en)
*
|
1986-09-26 |
1988-03-22 |
Motorola, Inc. |
Edge bead removal process for spin on films
|
US5235995A
(en)
*
|
1989-03-27 |
1993-08-17 |
Semitool, Inc. |
Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
|
US5230743A
(en)
*
|
1988-05-25 |
1993-07-27 |
Semitool, Inc. |
Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
|
US5224504A
(en)
*
|
1988-05-25 |
1993-07-06 |
Semitool, Inc. |
Single wafer processor
|
US5092975A
(en)
*
|
1988-06-14 |
1992-03-03 |
Yamaha Corporation |
Metal plating apparatus
|
US5316974A
(en)
*
|
1988-12-19 |
1994-05-31 |
Texas Instruments Incorporated |
Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer
|
US5039381A
(en)
*
|
1989-05-25 |
1991-08-13 |
Mullarkey Edward J |
Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
|
US5162260A
(en)
*
|
1989-06-01 |
1992-11-10 |
Hewlett-Packard Company |
Stacked solid via formation in integrated circuit systems
|
US5055425A
(en)
*
|
1989-06-01 |
1991-10-08 |
Hewlett-Packard Company |
Stacked solid via formation in integrated circuit systems
|
US5155336A
(en)
*
|
1990-01-19 |
1992-10-13 |
Applied Materials, Inc. |
Rapid thermal heating apparatus and method
|
US5222310A
(en)
*
|
1990-05-18 |
1993-06-29 |
Semitool, Inc. |
Single wafer processor with a frame
|
US5259407A
(en)
*
|
1990-06-15 |
1993-11-09 |
Matrix Inc. |
Surface treatment method and apparatus for a semiconductor wafer
|
US5252807A
(en)
*
|
1990-07-02 |
1993-10-12 |
George Chizinsky |
Heated plate rapid thermal processor
|
US5256274A
(en)
*
|
1990-08-01 |
1993-10-26 |
Jaime Poris |
Selective metal electrodeposition process
|
US5368711A
(en)
*
|
1990-08-01 |
1994-11-29 |
Poris; Jaime |
Selective metal electrodeposition process and apparatus
|
JP2524436B2
(en)
*
|
1990-09-18 |
1996-08-14 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
Surface treatment method
|
CA2059841A1
(en)
*
|
1991-01-24 |
1992-07-25 |
Ichiro Hayashida |
Surface treating solutions and cleaning method
|
JPH0544075A
(en)
*
|
1991-08-15 |
1993-02-23 |
Nippon Riironaale Kk |
Copper striking method substituted for electroless copper plating
|
JP3200468B2
(en)
*
|
1992-05-21 |
2001-08-20 |
日本エレクトロプレイテイング・エンジニヤース株式会社 |
Wafer plating equipment
|
JP2654314B2
(en)
*
|
1992-06-04 |
1997-09-17 |
東京応化工業株式会社 |
Backside cleaning device
|
US5328589A
(en)
*
|
1992-12-23 |
1994-07-12 |
Enthone-Omi, Inc. |
Functional fluid additives for acid copper electroplating baths
|
US5718813A
(en)
*
|
1992-12-30 |
1998-02-17 |
Advanced Energy Industries, Inc. |
Enhanced reactive DC sputtering system
|
US5608943A
(en)
*
|
1993-08-23 |
1997-03-11 |
Tokyo Electron Limited |
Apparatus for removing process liquid
|
US5415890A
(en)
*
|
1994-01-03 |
1995-05-16 |
Eaton Corporation |
Modular apparatus and method for surface treatment of parts with liquid baths
|
US5625170A
(en)
*
|
1994-01-18 |
1997-04-29 |
Nanometrics Incorporated |
Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
|
JP3377849B2
(en)
*
|
1994-02-02 |
2003-02-17 |
日本エレクトロプレイテイング・エンジニヤース株式会社 |
Wafer plating equipment
|
US5528118A
(en)
*
|
1994-04-01 |
1996-06-18 |
Nikon Precision, Inc. |
Guideless stage with isolated reaction stage
|
US5651865A
(en)
*
|
1994-06-17 |
1997-07-29 |
Eni |
Preferential sputtering of insulators from conductive targets
|
US5705223A
(en)
*
|
1994-07-26 |
1998-01-06 |
International Business Machine Corp. |
Method and apparatus for coating a semiconductor wafer
|
US5730801A
(en)
*
|
1994-08-23 |
1998-03-24 |
Applied Materials, Inc. |
Compartnetalized substrate processing chamber
|
US5516412A
(en)
*
|
1995-05-16 |
1996-05-14 |
International Business Machines Corporation |
Vertical paddle plating cell
|
FR2745589B1
(en)
*
|
1996-02-29 |
1998-04-30 |
Snecma |
HIGH STRENGTH-TO-MASS HYBRID PART AND METHOD FOR PRODUCING THE SAME
|
US5838121A
(en)
*
|
1996-11-18 |
1998-11-17 |
Applied Materials, Inc. |
Dual blade robot
|
JPH1180989A
(en)
*
|
1997-09-02 |
1999-03-26 |
Oki Electric Ind Co Ltd |
Plating apparatus
|
US6024856A
(en)
*
|
1997-10-10 |
2000-02-15 |
Enthone-Omi, Inc. |
Copper metallization of silicon wafers using insoluble anodes
|
US6179983B1
(en)
*
|
1997-11-13 |
2001-01-30 |
Novellus Systems, Inc. |
Method and apparatus for treating surface including virtual anode
|
EP1055020A2
(en)
*
|
1998-02-12 |
2000-11-29 |
ACM Research, Inc. |
Plating apparatus and method
|
US6113771A
(en)
*
|
1998-04-21 |
2000-09-05 |
Applied Materials, Inc. |
Electro deposition chemistry
|
KR100616198B1
(en)
*
|
1998-04-21 |
2006-08-25 |
어플라이드 머티어리얼스, 인코포레이티드 |
Electro-chemical deposition system and method of electroplating on substrates
|
US6071388A
(en)
*
|
1998-05-29 |
2000-06-06 |
International Business Machines Corporation |
Electroplating workpiece fixture having liquid gap spacer
|
US6228232B1
(en)
*
|
1998-07-09 |
2001-05-08 |
Semitool, Inc. |
Reactor vessel having improved cup anode and conductor assembly
|
US6395152B1
(en)
*
|
1998-07-09 |
2002-05-28 |
Acm Research, Inc. |
Methods and apparatus for electropolishing metal interconnections on semiconductor devices
|
US6773571B1
(en)
*
|
2001-06-28 |
2004-08-10 |
Novellus Systems, Inc. |
Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
|
US6251251B1
(en)
*
|
1998-11-16 |
2001-06-26 |
International Business Machines Corporation |
Anode design for semiconductor deposition
|
US6258220B1
(en)
*
|
1998-11-30 |
2001-07-10 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6254760B1
(en)
*
|
1999-03-05 |
2001-07-03 |
Applied Materials, Inc. |
Electro-chemical deposition system and method
|
US6267853B1
(en)
*
|
1999-07-09 |
2001-07-31 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6113759A
(en)
*
|
1998-12-18 |
2000-09-05 |
International Business Machines Corporation |
Anode design for semiconductor deposition having novel electrical contact assembly
|
US6582578B1
(en)
*
|
1999-04-08 |
2003-06-24 |
Applied Materials, Inc. |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
|
US6571657B1
(en)
*
|
1999-04-08 |
2003-06-03 |
Applied Materials Inc. |
Multiple blade robot adjustment apparatus and associated method
|
US6551484B2
(en)
*
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Reverse voltage bias for electro-chemical plating system and method
|
US6585876B2
(en)
*
|
1999-04-08 |
2003-07-01 |
Applied Materials Inc. |
Flow diffuser to be used in electro-chemical plating system and method
|
US6837978B1
(en)
*
|
1999-04-08 |
2005-01-04 |
Applied Materials, Inc. |
Deposition uniformity control for electroplating apparatus, and associated method
|
US6557237B1
(en)
*
|
1999-04-08 |
2003-05-06 |
Applied Materials, Inc. |
Removable modular cell for electro-chemical plating and method
|
US6662673B1
(en)
*
|
1999-04-08 |
2003-12-16 |
Applied Materials, Inc. |
Linear motion apparatus and associated method
|
US6551488B1
(en)
*
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Segmenting of processing system into wet and dry areas
|
US6368475B1
(en)
*
|
2000-03-21 |
2002-04-09 |
Semitool, Inc. |
Apparatus for electrochemically processing a microelectronic workpiece
|
US6254742B1
(en)
*
|
1999-07-12 |
2001-07-03 |
Semitool, Inc. |
Diffuser with spiral opening pattern for an electroplating reactor vessel
|
US6395101B1
(en)
*
|
1999-10-08 |
2002-05-28 |
Semitool, Inc. |
Single semiconductor wafer processor
|
US6527920B1
(en)
*
|
2000-05-10 |
2003-03-04 |
Novellus Systems, Inc. |
Copper electroplating apparatus
|
JP4058307B2
(en)
*
|
2002-08-29 |
2008-03-05 |
大日本スクリーン製造株式会社 |
Plating equipment
|
US7195702B2
(en)
*
|
2003-06-06 |
2007-03-27 |
Taskem, Inc. |
Tin alloy electroplating system
|