ES2531163T3 - Procedure and electrolyte for galvanic deposition of bronzes - Google Patents

Procedure and electrolyte for galvanic deposition of bronzes Download PDF

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Publication number
ES2531163T3
ES2531163T3 ES02022718T ES02022718T ES2531163T3 ES 2531163 T3 ES2531163 T3 ES 2531163T3 ES 02022718 T ES02022718 T ES 02022718T ES 02022718 T ES02022718 T ES 02022718T ES 2531163 T3 ES2531163 T3 ES 2531163T3
Authority
ES
Spain
Prior art keywords
electrolyte
bronzes
procedure
galvanic deposition
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES02022718T
Other languages
Spanish (es)
Inventor
Katrin Zschintzsch
Joachim Dr Heyer
Marlies Dr Kleinfeld
Stefan Schäfer
Ortrud Steinius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32010957&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2531163(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone Inc filed Critical Enthone Inc
Application granted granted Critical
Publication of ES2531163T3 publication Critical patent/ES2531163T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

Procedimiento para la deposición galvánica de bronces con una proporción de cobre de > 10 % en peso, donde un sustrato a recubrir se metaliza en un electrolito ácido con una densidad de corriente ajustada a entre 0,1 y 120 A/dm2, donde el electrolito presenta al menos iones de estaño y de cobre, un medio humectante aromático no iónico, así como ácido metanosulfónico, caracterizado por que en el electrolito se ajusta una concentración de iones de estaño de 2 a 75 g/l, una concentración de iones de cobre de 2 a 70 g/l y una concentración de ácido metanosulfónico de al menos 238 g/l y se añaden al electrolito bismuto y/o cinc.Procedure for the galvanic deposition of bronzes with a copper content of> 10% by weight, where a substrate to be coated is metallized in an acid electrolyte with a current density adjusted to between 0.1 and 120 A / dm2, where the electrolyte has at least tin and copper ions, a non-ionic aromatic wetting medium, as well as methanesulfonic acid, characterized in that a tin ion concentration of 2 to 75 g / l is set in the electrolyte, a copper ion concentration 2 to 70 g / l and a methanesulfonic acid concentration of at least 238 g / l and bismuth and / or zinc are added to the electrolyte.

ES02022718T 2002-10-11 2002-10-11 Procedure and electrolyte for galvanic deposition of bronzes Expired - Lifetime ES2531163T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02022718.7A EP1408141B1 (en) 2002-10-11 2002-10-11 Process and electrolyte for the galvanic deposition of bronze

Publications (1)

Publication Number Publication Date
ES2531163T3 true ES2531163T3 (en) 2015-03-11

Family

ID=32010957

Family Applications (1)

Application Number Title Priority Date Filing Date
ES02022718T Expired - Lifetime ES2531163T3 (en) 2002-10-11 2002-10-11 Procedure and electrolyte for galvanic deposition of bronzes

Country Status (7)

Country Link
US (1) US20060137991A1 (en)
EP (1) EP1408141B1 (en)
JP (1) JP4675626B2 (en)
KR (1) KR100684818B1 (en)
CN (1) CN1703540B (en)
ES (1) ES2531163T3 (en)
WO (1) WO2004035875A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
EP1791693B1 (en) * 2004-09-24 2012-06-27 Jarden Zinc Products, LLC Electroplated metals with silvery-white appearance and method of making
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN100368924C (en) * 2005-05-31 2008-02-13 西北工业大学 Negative magnetic permeability material in aperiodic infrared band
ES2698205T3 (en) 2005-11-25 2019-02-01 Macdermid Enthone Inc Procedure and device for the purification of process solutions
EP2336394B1 (en) * 2006-05-24 2015-07-01 Atotech Deutschland GmbH Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
ATE453740T1 (en) 2007-02-14 2010-01-15 Umicore Galvanotechnik Gmbh COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS
JP5642928B2 (en) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Bronze electroplating
ATE486157T1 (en) 2008-05-08 2010-11-15 Umicore Galvanotechnik Gmbh MODIFIED COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS
DE102008032398A1 (en) 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Improved copper-tin electrolyte and process for depositing bronze layers
DE102011008836B4 (en) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Electrolyte and method for depositing copper-tin alloy layers
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
EP2565297A3 (en) * 2011-08-30 2013-04-24 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
CN102605394B (en) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 Cyanogen-free acidic cupronickel-tin plating solution
JP6101510B2 (en) * 2013-02-18 2017-03-22 株式会社シミズ Non-cyanide copper-tin alloy plating bath
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US11597637B2 (en) 2018-02-22 2023-03-07 Vis, Llc Under hoist support stand
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
US10906789B2 (en) * 2018-09-05 2021-02-02 Vis, Llc Power unit for a floor jack

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JPS5672196A (en) * 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
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JPS63206494A (en) * 1987-02-20 1988-08-25 Yutaka Fujiwara Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound
JPH02107795A (en) * 1988-10-14 1990-04-19 Tohoku Ricoh Co Ltd Copper-tin alloy plating bath
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Also Published As

Publication number Publication date
JP4675626B2 (en) 2011-04-27
US20060137991A1 (en) 2006-06-29
CN1703540B (en) 2010-10-06
WO2004035875A2 (en) 2004-04-29
EP1408141A1 (en) 2004-04-14
JP2005537394A (en) 2005-12-08
WO2004035875A3 (en) 2005-04-14
CN1703540A (en) 2005-11-30
KR100684818B1 (en) 2007-02-22
KR20050059174A (en) 2005-06-17
EP1408141B1 (en) 2014-12-17

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