ES2531163T3 - Procedure and electrolyte for galvanic deposition of bronzes - Google Patents
Procedure and electrolyte for galvanic deposition of bronzes Download PDFInfo
- Publication number
- ES2531163T3 ES2531163T3 ES02022718T ES02022718T ES2531163T3 ES 2531163 T3 ES2531163 T3 ES 2531163T3 ES 02022718 T ES02022718 T ES 02022718T ES 02022718 T ES02022718 T ES 02022718T ES 2531163 T3 ES2531163 T3 ES 2531163T3
- Authority
- ES
- Spain
- Prior art keywords
- electrolyte
- bronzes
- procedure
- galvanic deposition
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
Procedimiento para la deposición galvánica de bronces con una proporción de cobre de > 10 % en peso, donde un sustrato a recubrir se metaliza en un electrolito ácido con una densidad de corriente ajustada a entre 0,1 y 120 A/dm2, donde el electrolito presenta al menos iones de estaño y de cobre, un medio humectante aromático no iónico, así como ácido metanosulfónico, caracterizado por que en el electrolito se ajusta una concentración de iones de estaño de 2 a 75 g/l, una concentración de iones de cobre de 2 a 70 g/l y una concentración de ácido metanosulfónico de al menos 238 g/l y se añaden al electrolito bismuto y/o cinc.Procedure for the galvanic deposition of bronzes with a copper content of> 10% by weight, where a substrate to be coated is metallized in an acid electrolyte with a current density adjusted to between 0.1 and 120 A / dm2, where the electrolyte has at least tin and copper ions, a non-ionic aromatic wetting medium, as well as methanesulfonic acid, characterized in that a tin ion concentration of 2 to 75 g / l is set in the electrolyte, a copper ion concentration 2 to 70 g / l and a methanesulfonic acid concentration of at least 238 g / l and bismuth and / or zinc are added to the electrolyte.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02022718.7A EP1408141B1 (en) | 2002-10-11 | 2002-10-11 | Process and electrolyte for the galvanic deposition of bronze |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2531163T3 true ES2531163T3 (en) | 2015-03-11 |
Family
ID=32010957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES02022718T Expired - Lifetime ES2531163T3 (en) | 2002-10-11 | 2002-10-11 | Procedure and electrolyte for galvanic deposition of bronzes |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060137991A1 (en) |
EP (1) | EP1408141B1 (en) |
JP (1) | JP4675626B2 (en) |
KR (1) | KR100684818B1 (en) |
CN (1) | CN1703540B (en) |
ES (1) | ES2531163T3 (en) |
WO (1) | WO2004035875A2 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004041701A1 (en) * | 2004-08-28 | 2006-03-02 | Enthone Inc., West Haven | Process for the electrolytic deposition of metals |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
EP1791693B1 (en) * | 2004-09-24 | 2012-06-27 | Jarden Zinc Products, LLC | Electroplated metals with silvery-white appearance and method of making |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
CN100368924C (en) * | 2005-05-31 | 2008-02-13 | 西北工业大学 | Negative magnetic permeability material in aperiodic infrared band |
ES2698205T3 (en) | 2005-11-25 | 2019-02-01 | Macdermid Enthone Inc | Procedure and device for the purification of process solutions |
EP2336394B1 (en) * | 2006-05-24 | 2015-07-01 | Atotech Deutschland GmbH | Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell |
ATE453740T1 (en) | 2007-02-14 | 2010-01-15 | Umicore Galvanotechnik Gmbh | COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS |
JP5642928B2 (en) | 2007-12-12 | 2014-12-17 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Bronze electroplating |
ATE486157T1 (en) | 2008-05-08 | 2010-11-15 | Umicore Galvanotechnik Gmbh | MODIFIED COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS |
DE102008032398A1 (en) | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Improved copper-tin electrolyte and process for depositing bronze layers |
DE102011008836B4 (en) * | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Electrolyte and method for depositing copper-tin alloy layers |
US8426241B2 (en) | 2010-09-09 | 2013-04-23 | International Business Machines Corporation | Structure and method of fabricating a CZTS photovoltaic device by electrodeposition |
EP2565297A3 (en) * | 2011-08-30 | 2013-04-24 | Rohm and Haas Electronic Materials LLC | Adhesion promotion of cyanide-free white bronze |
CN102605394B (en) * | 2012-03-07 | 2015-02-18 | 深圳市华傲创表面技术有限公司 | Cyanogen-free acidic cupronickel-tin plating solution |
JP6101510B2 (en) * | 2013-02-18 | 2017-03-22 | 株式会社シミズ | Non-cyanide copper-tin alloy plating bath |
CA2957587C (en) * | 2014-08-08 | 2019-03-05 | Okuno Chemical Industries Co., Ltd. | Copper-tin alloy plating bath |
US11597637B2 (en) | 2018-02-22 | 2023-03-07 | Vis, Llc | Under hoist support stand |
EP3540097A1 (en) | 2018-03-13 | 2019-09-18 | COVENTYA S.p.A. | Electroplated products and electroplating bath for providing such products |
US10906789B2 (en) * | 2018-09-05 | 2021-02-02 | Vis, Llc | Power unit for a floor jack |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2854388A (en) * | 1955-03-14 | 1958-09-30 | City Auto Stamping Co | Electrodeposition of copper-tin alloys |
JPS5672196A (en) * | 1979-11-19 | 1981-06-16 | Shimizu Shoji Kk | Bright plating bath for copper-tin alloy |
DE3339541C2 (en) * | 1983-11-02 | 1986-08-07 | Degussa Ag, 6000 Frankfurt | Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings |
JPS63206494A (en) * | 1987-02-20 | 1988-08-25 | Yutaka Fujiwara | Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound |
JPH02107795A (en) * | 1988-10-14 | 1990-04-19 | Tohoku Ricoh Co Ltd | Copper-tin alloy plating bath |
DE3934866A1 (en) * | 1989-10-19 | 1991-04-25 | Blasberg Oberflaechentech | METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE |
JP2901292B2 (en) * | 1989-12-05 | 1999-06-07 | 住友ゴム工業 株式会社 | Bead wire for rubber coated tire and tire using the same |
DE4336664A1 (en) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process |
JPH0711477A (en) * | 1993-06-28 | 1995-01-13 | Electroplating Eng Of Japan Co | Noble metal plated article |
US5385661A (en) * | 1993-09-17 | 1995-01-31 | International Business Machines Corporation | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
JP3274766B2 (en) * | 1994-06-28 | 2002-04-15 | 荏原ユージライト株式会社 | Low melting tin alloy plating bath |
JPH0827590A (en) * | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | Bright copper-tin alloy plating bath |
SG68083A1 (en) * | 1997-10-30 | 1999-10-19 | Sung Soo Moon | Tin alloy plating compositions |
JP3366851B2 (en) * | 1997-12-18 | 2003-01-14 | 株式会社ジャパンエナジー | Tin alloy electroplating solution and plating method |
TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
JP2001060672A (en) * | 1999-08-20 | 2001-03-06 | Mitsubishi Electric Corp | Etching method and etching mask |
JP3433291B2 (en) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film |
JP2001107287A (en) * | 1999-10-07 | 2001-04-17 | Ebara Udylite Kk | Sn-Cu ALLOY PLATING BATH |
EP1091023A3 (en) * | 1999-10-08 | 2003-05-14 | Shipley Company LLC | Alloy composition and plating method |
JP2001181889A (en) * | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | Bright tin-copper alloy electroplating bath |
DE10046600C2 (en) * | 2000-09-20 | 2003-02-20 | Schloetter Fa Dr Ing Max | Electrolyte and process for the deposition of tin-copper alloy layers and use of the electrolyte |
DE50106133D1 (en) * | 2000-09-20 | 2005-06-09 | Schloetter Fa Dr Ing Max | ELECTROLYTE AND METHOD OF DEPOSITING TIN COPPER ALLOY LAYERS |
JP2003049293A (en) * | 2001-03-16 | 2003-02-21 | Shipley Co Llc | Tinning |
DE60226196T2 (en) * | 2001-05-24 | 2009-05-14 | Shipley Co., L.L.C., Marlborough | Tin-plating |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
-
2002
- 2002-10-11 EP EP02022718.7A patent/EP1408141B1/en not_active Revoked
- 2002-10-11 ES ES02022718T patent/ES2531163T3/en not_active Expired - Lifetime
-
2003
- 2003-10-10 CN CN2003801012538A patent/CN1703540B/en not_active Expired - Lifetime
- 2003-10-10 WO PCT/EP2003/011229 patent/WO2004035875A2/en active Application Filing
- 2003-10-10 US US10/531,142 patent/US20060137991A1/en not_active Abandoned
- 2003-10-10 JP JP2004544134A patent/JP4675626B2/en not_active Expired - Lifetime
- 2003-10-10 KR KR1020057004846A patent/KR100684818B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP4675626B2 (en) | 2011-04-27 |
US20060137991A1 (en) | 2006-06-29 |
CN1703540B (en) | 2010-10-06 |
WO2004035875A2 (en) | 2004-04-29 |
EP1408141A1 (en) | 2004-04-14 |
JP2005537394A (en) | 2005-12-08 |
WO2004035875A3 (en) | 2005-04-14 |
CN1703540A (en) | 2005-11-30 |
KR100684818B1 (en) | 2007-02-22 |
KR20050059174A (en) | 2005-06-17 |
EP1408141B1 (en) | 2014-12-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2531163T3 (en) | Procedure and electrolyte for galvanic deposition of bronzes | |
TWI268292B (en) | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions | |
TW200702498A (en) | Method for electrodeposition of bronzes | |
DE602007004516D1 (en) | ALKALI BATTERY CELL WITH REDUCED GASING AND REDUCED DEHUMIDIFICATION | |
WO2006091937A3 (en) | Auxiliary electrode encased in cation exchange membrane tube for electroplating cell | |
TW200636834A (en) | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | |
WO2006053062A3 (en) | Tin alloy electroplating system | |
BR0208821A (en) | cell and process for selectively coating metal on an exposed surface of a zinc / air cell | |
PE20000168A1 (en) | LOW DENSITY LARGE SURFACE AREA COPPER POWDER AND ELECTRODEPOSITION PROCEDURE TO MAKE IT | |
EP1703001A3 (en) | Electrolytic anode and method for electrolytically synthesizing fluorine-containing substance using the electrolytic anode | |
AU2002218606A1 (en) | Doctor or coater blade and method in connection with its manufacturing | |
BR0102167A (en) | Electrochemical cell for the oxidation of organic compounds and electrocatalytic oxidation process | |
IL194505A0 (en) | Electroplating device and method | |
JP2012092434A5 (en) | ||
WO2008060261A3 (en) | Multilayer self-decontaminating coatings | |
TW561808B (en) | Method of copper plating small hole | |
DE60102364D1 (en) | ELECTROLYTIC SOLUTION FOR THE ELECTROCHEMICAL DEPOSITION OF PALLADIUM OR ITS ALLOYS | |
TW200617218A (en) | Current collimation for thin seed and direct plating | |
US6562221B2 (en) | Process and composition for high speed plating of tin and tin alloys | |
AR034247A1 (en) | A PROCESS FOR THE ELECTRODEPOSITION OF COPPER FROM A SOLUTION IN AN ELECTROLYTIC CELL, AN ELECTROLYTIC CELL, AN ELECTRODE TO USE IN THE ELECTROLYTIC CELL, AND A METHOD TO PRODUCE THE ELECTRODE | |
ES2375057T8 (en) | METAL ELECTROLYTIC EXTRACTION CELL OF METALS WITH ELECTROLYTE PURIFIER. | |
WO2014052950A4 (en) | Residual disinfection of water | |
KR900702085A (en) | Electrolytic bath for electrodeposition of tin-bismuth alloy, electrolytic cell and method | |
WO2003035941A3 (en) | Electrolytic processes with reduced cell voltage and gas formation | |
EP1336670A3 (en) | Plate treatment |