JPS5672196A - Bright plating bath for copper-tin alloy - Google Patents

Bright plating bath for copper-tin alloy

Info

Publication number
JPS5672196A
JPS5672196A JP15053079A JP15053079A JPS5672196A JP S5672196 A JPS5672196 A JP S5672196A JP 15053079 A JP15053079 A JP 15053079A JP 15053079 A JP15053079 A JP 15053079A JP S5672196 A JPS5672196 A JP S5672196A
Authority
JP
Japan
Prior art keywords
copper
plating bath
tin
bath
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15053079A
Other languages
Japanese (ja)
Other versions
JPS639032B2 (en
Inventor
Yoshiji Shimizu
Shozo Sasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIMIZU SHOJI KK
Original Assignee
SHIMIZU SHOJI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIMIZU SHOJI KK filed Critical SHIMIZU SHOJI KK
Priority to JP15053079A priority Critical patent/JPS5672196A/en
Publication of JPS5672196A publication Critical patent/JPS5672196A/en
Publication of JPS639032B2 publication Critical patent/JPS639032B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To provide an alloy-plating bath which makes possible bright copper- tin alloy plating, and which has wide range of composition contg. no cyanic compounds, by the addition of specific compounding agent to a copper-tin bath. compsn. consisting essentially of pyrophosphate.
CONSTITUTION: A bright copper-tin alloy plating bath contg. 1W30g/l copper salt (in terms of Cu), 5W40g/l stannous salt (in terms of tin), 100W500g/l alkali metal pyrophosphate, 0.01W0.5g/l one or more members among water soluble polymers such as polyvinyl alcohol, 0.1W5g/l aldehyde compound, 0.1W10g/l chelating agent is used. Said plating bath is used generally under conditions such as 0.1W5.0A/dm2 current density, 40W70°C bath temp., 7.0W9.0pH. This plating bath is easy to handle because it is stable and contains no cyanic compounds.
COPYRIGHT: (C)1981,JPO&Japio
JP15053079A 1979-11-19 1979-11-19 Bright plating bath for copper-tin alloy Granted JPS5672196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15053079A JPS5672196A (en) 1979-11-19 1979-11-19 Bright plating bath for copper-tin alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15053079A JPS5672196A (en) 1979-11-19 1979-11-19 Bright plating bath for copper-tin alloy

Publications (2)

Publication Number Publication Date
JPS5672196A true JPS5672196A (en) 1981-06-16
JPS639032B2 JPS639032B2 (en) 1988-02-25

Family

ID=15498880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15053079A Granted JPS5672196A (en) 1979-11-19 1979-11-19 Bright plating bath for copper-tin alloy

Country Status (1)

Country Link
JP (1) JPS5672196A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1051584C (en) * 1995-11-10 2000-04-19 唐文海 Bronze plating bath and preparing process thereof
JP2001295092A (en) * 2000-04-14 2001-10-26 Nippon New Chrome Kk Pyrophosphoric acid bath for copper-tin alloy plating
EP1300486A1 (en) * 2001-10-02 2003-04-09 Shipley Co. L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP2005537394A (en) * 2002-10-11 2005-12-08 エンソーン インコーポレイテッド Bronze electrodeposition method
JP2006213996A (en) * 2005-02-07 2006-08-17 Fcm Kk METHOD FOR FORMING THIN FILM OF Sn-Ag-Cu TERNARY ALLOY
US7563353B2 (en) 2004-10-21 2009-07-21 Fcm Co., Ltd. Method of forming Sn-Ag-Cu ternary alloy thin-film on base material
KR20110039460A (en) * 2008-07-15 2011-04-18 엔쏜 인코포레이티드 Cyanide free electrolyte composition for the galvanic deposition of a copper layer
JP2014156643A (en) * 2013-02-18 2014-08-28 Shimizu:Kk Cyanogen-free copper-tin alloy plating bath
CN104152955A (en) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution
CN112323109A (en) * 2020-10-31 2021-02-05 重庆望江工业有限公司 Cyanide-free plating solution for low-tin alloy and preparation method thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1051584C (en) * 1995-11-10 2000-04-19 唐文海 Bronze plating bath and preparing process thereof
JP2001295092A (en) * 2000-04-14 2001-10-26 Nippon New Chrome Kk Pyrophosphoric acid bath for copper-tin alloy plating
EP1300486A1 (en) * 2001-10-02 2003-04-09 Shipley Co. L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6652731B2 (en) 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP2005537394A (en) * 2002-10-11 2005-12-08 エンソーン インコーポレイテッド Bronze electrodeposition method
US7563353B2 (en) 2004-10-21 2009-07-21 Fcm Co., Ltd. Method of forming Sn-Ag-Cu ternary alloy thin-film on base material
JP2006213996A (en) * 2005-02-07 2006-08-17 Fcm Kk METHOD FOR FORMING THIN FILM OF Sn-Ag-Cu TERNARY ALLOY
KR20110039460A (en) * 2008-07-15 2011-04-18 엔쏜 인코포레이티드 Cyanide free electrolyte composition for the galvanic deposition of a copper layer
JP2011528406A (en) * 2008-07-15 2011-11-17 エントン インコーポレイテッド Cyanide-free electrolyte composition for galvanic deposition of copper layers
JP2014156643A (en) * 2013-02-18 2014-08-28 Shimizu:Kk Cyanogen-free copper-tin alloy plating bath
CN104152955A (en) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution
CN112323109A (en) * 2020-10-31 2021-02-05 重庆望江工业有限公司 Cyanide-free plating solution for low-tin alloy and preparation method thereof

Also Published As

Publication number Publication date
JPS639032B2 (en) 1988-02-25

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