JPS5672196A - Bright plating bath for copper-tin alloy - Google Patents
Bright plating bath for copper-tin alloyInfo
- Publication number
- JPS5672196A JPS5672196A JP15053079A JP15053079A JPS5672196A JP S5672196 A JPS5672196 A JP S5672196A JP 15053079 A JP15053079 A JP 15053079A JP 15053079 A JP15053079 A JP 15053079A JP S5672196 A JPS5672196 A JP S5672196A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating bath
- tin
- bath
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To provide an alloy-plating bath which makes possible bright copper- tin alloy plating, and which has wide range of composition contg. no cyanic compounds, by the addition of specific compounding agent to a copper-tin bath. compsn. consisting essentially of pyrophosphate.
CONSTITUTION: A bright copper-tin alloy plating bath contg. 1W30g/l copper salt (in terms of Cu), 5W40g/l stannous salt (in terms of tin), 100W500g/l alkali metal pyrophosphate, 0.01W0.5g/l one or more members among water soluble polymers such as polyvinyl alcohol, 0.1W5g/l aldehyde compound, 0.1W10g/l chelating agent is used. Said plating bath is used generally under conditions such as 0.1W5.0A/dm2 current density, 40W70°C bath temp., 7.0W9.0pH. This plating bath is easy to handle because it is stable and contains no cyanic compounds.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15053079A JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15053079A JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5672196A true JPS5672196A (en) | 1981-06-16 |
JPS639032B2 JPS639032B2 (en) | 1988-02-25 |
Family
ID=15498880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15053079A Granted JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5672196A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1051584C (en) * | 1995-11-10 | 2000-04-19 | 唐文海 | Bronze plating bath and preparing process thereof |
JP2001295092A (en) * | 2000-04-14 | 2001-10-26 | Nippon New Chrome Kk | Pyrophosphoric acid bath for copper-tin alloy plating |
EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
JP2005537394A (en) * | 2002-10-11 | 2005-12-08 | エンソーン インコーポレイテッド | Bronze electrodeposition method |
JP2006213996A (en) * | 2005-02-07 | 2006-08-17 | Fcm Kk | METHOD FOR FORMING THIN FILM OF Sn-Ag-Cu TERNARY ALLOY |
US7563353B2 (en) | 2004-10-21 | 2009-07-21 | Fcm Co., Ltd. | Method of forming Sn-Ag-Cu ternary alloy thin-film on base material |
KR20110039460A (en) * | 2008-07-15 | 2011-04-18 | 엔쏜 인코포레이티드 | Cyanide free electrolyte composition for the galvanic deposition of a copper layer |
JP2014156643A (en) * | 2013-02-18 | 2014-08-28 | Shimizu:Kk | Cyanogen-free copper-tin alloy plating bath |
CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
CN112323109A (en) * | 2020-10-31 | 2021-02-05 | 重庆望江工业有限公司 | Cyanide-free plating solution for low-tin alloy and preparation method thereof |
-
1979
- 1979-11-19 JP JP15053079A patent/JPS5672196A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1051584C (en) * | 1995-11-10 | 2000-04-19 | 唐文海 | Bronze plating bath and preparing process thereof |
JP2001295092A (en) * | 2000-04-14 | 2001-10-26 | Nippon New Chrome Kk | Pyrophosphoric acid bath for copper-tin alloy plating |
EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
JP2005537394A (en) * | 2002-10-11 | 2005-12-08 | エンソーン インコーポレイテッド | Bronze electrodeposition method |
US7563353B2 (en) | 2004-10-21 | 2009-07-21 | Fcm Co., Ltd. | Method of forming Sn-Ag-Cu ternary alloy thin-film on base material |
JP2006213996A (en) * | 2005-02-07 | 2006-08-17 | Fcm Kk | METHOD FOR FORMING THIN FILM OF Sn-Ag-Cu TERNARY ALLOY |
KR20110039460A (en) * | 2008-07-15 | 2011-04-18 | 엔쏜 인코포레이티드 | Cyanide free electrolyte composition for the galvanic deposition of a copper layer |
JP2011528406A (en) * | 2008-07-15 | 2011-11-17 | エントン インコーポレイテッド | Cyanide-free electrolyte composition for galvanic deposition of copper layers |
JP2014156643A (en) * | 2013-02-18 | 2014-08-28 | Shimizu:Kk | Cyanogen-free copper-tin alloy plating bath |
CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
CN112323109A (en) * | 2020-10-31 | 2021-02-05 | 重庆望江工业有限公司 | Cyanide-free plating solution for low-tin alloy and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS639032B2 (en) | 1988-02-25 |
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