JPS5760092A - Copper-tin alloy plating bath - Google Patents
Copper-tin alloy plating bathInfo
- Publication number
- JPS5760092A JPS5760092A JP13562680A JP13562680A JPS5760092A JP S5760092 A JPS5760092 A JP S5760092A JP 13562680 A JP13562680 A JP 13562680A JP 13562680 A JP13562680 A JP 13562680A JP S5760092 A JPS5760092 A JP S5760092A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- alloy plating
- copper
- betaine
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To obtain a plating bath giving Cu-Sn alloy plating with superior brightness by adding a nonionic polyoxyethylenealkylphenol ether surfactant, a betaine compound, etc. to a Cu-Sn alloy plating bath contg. copper cyanide and alkali stannate.
CONSTITUTION: By adding 0.5W15g/l said nonionic surfactant, 0.5W8g/l betaine compound and 5W40g/l of ≥1 kind of polyamine compound to a Cu-Sn alloy plating bath contg. copper cyanide and alkali stannate, the desired Cu-Sn alloy plating bath is prepared. As said betaine compound betaine, trimethylbetaine or the like is used, and said polyamine compound includes ethylenediamine. This plating bath is used at about 45W70°C, and it is desirable to apply an insoluble anode.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13562680A JPS5760092A (en) | 1980-09-29 | 1980-09-29 | Copper-tin alloy plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13562680A JPS5760092A (en) | 1980-09-29 | 1980-09-29 | Copper-tin alloy plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5760092A true JPS5760092A (en) | 1982-04-10 |
Family
ID=15156196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13562680A Pending JPS5760092A (en) | 1980-09-29 | 1980-09-29 | Copper-tin alloy plating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5760092A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60114589A (en) * | 1983-11-02 | 1985-06-21 | デグツサ・アクチエンゲゼルシヤフト | Alkaline cyanide bath for electrodepositing original or lustrous copper tin alloy coating |
| US6372117B1 (en) | 1999-12-22 | 2002-04-16 | Nippon Macdermid Co., Ltd. | Bright tin-copper alloy electroplating solution |
| CN103540956A (en) * | 2013-09-26 | 2014-01-29 | 界首市飞航铜业有限公司 | Wet separation technology for waste copper-tin alloy fitting soldering flakes |
| CN110158129A (en) * | 2019-05-27 | 2019-08-23 | 广州三孚新材料科技股份有限公司 | Pre- bleeding agent composition, pre- bleeding agent, copper facing preprocess method and cyanide-free copper electroplating method |
-
1980
- 1980-09-29 JP JP13562680A patent/JPS5760092A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60114589A (en) * | 1983-11-02 | 1985-06-21 | デグツサ・アクチエンゲゼルシヤフト | Alkaline cyanide bath for electrodepositing original or lustrous copper tin alloy coating |
| US4565608A (en) * | 1983-11-02 | 1986-01-21 | Degussa Aktiengesellschaft | Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings |
| US4605474A (en) * | 1983-11-02 | 1986-08-12 | Gerd Hoffacker | Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings |
| US6372117B1 (en) | 1999-12-22 | 2002-04-16 | Nippon Macdermid Co., Ltd. | Bright tin-copper alloy electroplating solution |
| CN103540956A (en) * | 2013-09-26 | 2014-01-29 | 界首市飞航铜业有限公司 | Wet separation technology for waste copper-tin alloy fitting soldering flakes |
| CN110158129A (en) * | 2019-05-27 | 2019-08-23 | 广州三孚新材料科技股份有限公司 | Pre- bleeding agent composition, pre- bleeding agent, copper facing preprocess method and cyanide-free copper electroplating method |
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